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Product End-of-Life Disassembly Instr uctions
Product Category: Storage Enclosures
Marketing Name / Model
[List multiple models if applicable.]
V-class
QR619A, HP 3PAR V 4x100GB 4G SSD Mag
QR620A, HP 3PAR V 4x200GB 4G SSD Mag
QR621A, HP 3PAR V 4x300GB 15K 4G Drive Mag
QR622A, HP 3PAR V 4x600GB 15K 4G Drive Mag
QR623A, HP 3PAR V 4x2TB 7.2K 4G Drive Mag
QR624A, HP 3PAR V Upgr 4x100GB 4G SSD Mag
QR625A, HP 3PAR V Upgr 4x200GB 4G SSD Mag
QR626A, HP 3PAR V Upgr 4x300GB 15K 4G Drive Mag
QR627A, HP 3PAR V Upgr 4x600GB 15K 4G Drive Mag
QR628A, HP 3PAR V Upgr 4x2TB 7.2K 4G Drive Mag
QR592A, HP 3PAR V Drive Chassis 40-Disk, 4G
QR609A, HP 3PAR Upgr V Drv Chassis 40-Disk, 4G
T-Class
QL239B, HP 3PAR 4x300 GB 15K 4-Gb/sec FC LFF Drive Magazine
QL242B, HP 3PAR 4x1 TB 4-Gb/sec FC LFF Nearline Drive Magazine
QL251B, HP 3PAR 4x50 GB 4-Gb/sec SSD Magazine
QL252B, HP 3PAR 4x600 GB 15K 4-Gb/sec FC LFF Drive Magazine
QL235B, HP 3PAR Drive Chassis HP 3PAR 40-disk 4 Gb/sec Drive Chassis
QL313B, HP 3PAR Upgrade 40-Disk 4 Gb/sec Drive Chassis
QL317B, HP 3PAR Upgrade 4x300 GB 15K 4-Gb/sec FC LFF Drive Magazine
QL320B, HP 3PAR Upgrade 4x1 TB 4-Gb/sec FC LFF Nearline Drive Magazine
QL335B, HP 3PAR Upgrade 4x50 GB 4-Gb/sec SSD Magazine
QL336B, HP 3PAR Upgrade 4x600 GB 15K 4-Gb/sec FC LFF Drive Magazine
QL339B, HP 3PAR Upgrade 4x2 TB 4-Gb/sec FC LFF Nearline Drive Magazine
QR612B, HP 3PAR 4x100 GB 4-Gb/sec SSD Magazine
QR614B, HP 3PAR 4x200 GB 4-Gb/sec SSD Magazine
QR616B, HP 3PAR Upgrade 4x100 GB 4-Gb/sec SSD Magazine
QR618B, HP 3PAR Upgrade 4x200 GB 4-Gb/sec SSD Magazine
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
EL-MF877-00
Template Revision B
Notes
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
Page 1
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Related Manuals for HP V-class Series
Summary of Contents for HP V-class Series
- Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
- Page 2 Printed Circuit Boards (PCB) or Printed Circuit With a surface greater than 10 sq cm Min Config: Assemblies (PCA) Config: 63 Batteries All types including standard alkaline and lithium coin or button style batteries Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Liquid Crystal Displays (LCD) with a surface greater Includes background illuminated displays with gas...
- Page 3 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). Disassembling MBOD Power Supplies (PS): Remove two screws on front side and rear of the power supply and remove the top cover. Disconnect fan connector to remove the cover w/ fan.
- Page 4 Remove six screws from bottom, and three screws on the side. Lift up the bottom PCBA and slide the 2 PCBA assy away from the Front Fan Assembly EL-MF877-00 Page 4 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 5 Disconnect the Front Fan Connector Slide out the 2 PCBA Assy from the Chassis Remove two screws from the right PCBA Slide the PCBA up and disconnect the Board wires EL-MF877-00 Page 5 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 6 Remove the Capacitor Disassembling MBOD FCAL PCBA: Loosen the mounting screw in front of the FCAL PCBA assy, pivot the handle and slide out the assy: Remove screws holding the PCBA: EL-MF877-00 Page 6 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 7 Disassembling MBOD Midplane: Loosen the four screws as shown: Pull out the cage assembly holding the PCBA from the main Chassis: Remove the eight screws holding the Midplane PCBA: EL-MF877-00 Page 7 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 8 Disassembling MBOD Drive Sled PCBA and HDDs: Loosen the mounting screw in front of the Drive Mag assy, Pivot the handle downward and slide out the Dmag assy: EL-MF877-00 Page 8 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 9 Remove screws holding each of the drive assemblies, and slide the HDD away from the connector to remove Hard Drive. Remove the 9 screws holding the Sled PCBA and remove it. EL-MF877-00 Page 9 Template Revision B PSG instructions for this template are available at EL-MF877-01...