Pin Configurations And Pinouts - Harman Kardon AVR 151/230C Service Manual

Harman Kardon
1. Description
The Atmel AT45DB321D is a 2.5V or 2.7V, serial interface, sequential access flash memory ideally suited for a wide variety of
digital voice-, image-, program code-, and data-storage applications. The AT45DB321D supports the Atmel RapidS serial
interface for applications requiring very high speed operations. The RapidS serial interface is SPI compatible for frequencies up
to 66MHz. The 34,603,008-bits of memory are organized as 8,192 pages of 512 bytes or 528 bytes each. In addition to the main
memory, the AT45DB321D also contains two SRAM buffers of 512/528 bytes each. These buffers allow the receiving of data
while a page in the main memory is being reprogrammed, as well as the writing of a continuous data stream. EEPROM
(electrically erasable and programmable read-only memory) emulation (bit or byte alterability) is easily handled with a self-
contained, three-step read-modify-write operation. Unlike conventional flash memories, which are accessed randomly with
multiple address lines and a parallel interface, Atmel DataFlash
data. The simple sequential access dramatically reduces active pin count, facilitates hardware layout, increases system
reliability, minimizes switching noise, and reduces package size. The device is optimized for use in many commercial and
industrial applications where high density, low pin count, low voltage and low power are essential.
To allow for simple, in-system reprogrammability, the AT45DB321D does not require high input voltages for programming. The
device operates from a single power supply, 2.7V to 3.6V, for both the program and read operations. The AT45DB321D is
enabled through the chip select pin (CS) and accessed via a three-wire interface consisting of the serial input (SI), serial output
(SO), and serial clock (SCK) lines.
All programming and erase cycles are self timed.
Figure 1-1. Pin configurations and pinouts.
SI
SCK
RESET
CS
Note: 1. The metal pad on the bottom of
the MLF package is floating.
This pad can be a "No Connect" or
connected to GND.
BGA Package Ball-out
1
A
B
NC
C
NC
D
NC
E
NC
(1)
MLF (VDFN)
Top View
SO
1 8
GND
2 7
VCC
3 6
WP
4 5
Top View
2 3 4 5
NC NC NC NC
SCK GND VCC NC
CS RDY/BSY WP NC
SO SI RESET NC
NC NC NC NC
®
devices use a RapidS serial interface to sequentially access its
SI
SCK
RESET
CS
RDY/BUSY 1
RESET 2
WP 3
NC 4
NC 5
VCC 6
GND 7
NC 8
NC 9
NC 10
CS 11
SCK 12
SI 13
SO 14
Note: TSOP package is not recommended for new designs.
Future die shrinks will support 8-pin packages only.
SOIC
Top View
1 8 SO
2 7 GND
3 6 VCC
4 5 WP
TSOP: Type 1
Top View
Atmel AT45DB321D
3597Q–DFLASH–6/11
AVR 151 Service Manual
28 NC
27 NC
26 NC
25 NC
24 NC
23 NC
22 NC
21 NC
20 NC
19 NC
18 NC
17 NC
16 NC
15 NC
2
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