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Samsung NT-Q70 Series Service Manual

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SERVICE
SAMSUNG Q70
If there are the Contents not included in this book, please refer to K-zone Service Manual
Q70
BEIJING
NT-Q70xxxx/xxx
Manual
FEATURES
1. Simple & Essential Note PC
-. New Intel SantaRosa technology.
-. Internal 1.3M Camera
-. 12.1'' WXGA 200nit Glare LCD
-. Windows Vista Home/Premium Supportable.
2. High Performance
-. Intel Core™2 Duo processor
-. Powerful connectivity.
-. Convenient Multi-media.

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Summary of Contents for Samsung NT-Q70 Series

  • Page 1 BEIJING NT-Q70xxxx/xxx SERVICE Manual FEATURES SAMSUNG Q70 1. Simple & Essential Note PC -. New Intel SantaRosa technology. -. Internal 1.3M Camera -. 12.1'' WXGA 200nit Glare LCD -. Windows Vista Home/Premium Supportable. 2. High Performance -. Intel Core™2 Duo processor -.

  • Page 2: Table Of Contents

    CONTENTS 1. Precautions 1) General After-Sales Service Precautions....................1-1 2) Safety Precautions..........................1-2 3) Ground..............................1-3 4) Static Electricity Precautions........................1-3 2. Introduction and Specification 1) Introduction.............................2-1 2) Specification............................2-2 3) Key Feature............................2-7 4) Compare with competitor........................2-8 5) Option Partlist............................2-9 6) Product Feature............................2-11 7) Software List............................2-21 8) System Setup (BIOS Setup).......................2-22 9) Description of Main board........................2-30 3.
  • Page 3 CONTENTS 7. System Wire Diagram 1) Top..............................7-1 1) Bottom..............................7-2 1) LCD..............................7-3 8. Schematic 1) Block diagram............................8-1 2) Schematic..............................8-2 If there are the Contents not included in this book, please refer to K-zone Service Manual...

  • Page 4: Introduction

    - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 1) Introduction (1) High Performance PC - Intel ® Core™ 2 Duo Processor and DDR II Memory...

  • Page 5: Specification

    - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2) Specification Processor and Motherboard Description Intel® Core 2 Duo T7100 (1.8GHz) ~ T7700 (2.4G) and All CPU at Q4'07.35W (64bit)
  • Page 6 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification   Audio Sound High Definition Audio Controller HD Audio Codec, ALC262 Conversion Built-in high performance 20-bit ADC & 24-bit DAC...
  • Page 7 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Security RPC-II Regional Encoding Combo Drive 2 Factory Option Module type Fixed 12.7mm Slim...
  • Page 8 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Weight 180g or less S/W supplied Cyberlink DVD Solution Security RPC-II Regional Encoding  ...
  • Page 9 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Security Kensington Lock Input Devices Key board 88KEY(KR/US), 89KEY(UK/FR/GM/SP) Travel length 2.6mm/ Key Pitch 19.05mm...

  • Page 10: Key Feature

    - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 3) Key Feature FSB800MHz Intel Core 2 Duo Processor FSB800MHz Intel Core 2 Duo Processor...

  • Page 11: Compare With Competitor

    - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 4) Compare with competitor SONY Fujisu SONY Lenovo F30T2050W31024080 Model VGN-SZ34LP/B S6311SC18M VGN-C12C/W BiXW3b Image Intel T5600 1.83GHz Intel T5600 1.83GHz...

  • Page 12: Option Partlist

    - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 5) Option Partlist BA59-01999A HTS541660J9SA00 5400rpm, 60G, SATA, 8M BA59-01946A MHV2060BH-PL 5400rpm, 60G, SATA, 8M...
  • Page 13 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 0902-002196 T_T7100(Merom Dual Core ) 1.8Ghz(FSB800) 2MB 0902-002197 T_T7300(Merom Dual Core ) 2.0Ghz(FSB800) 4MB...

  • Page 14: Product Feature

    - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 6) Product Feature 6)-1 System View 2 - 11...
  • Page 15 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 12...
  • Page 16 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 13...
  • Page 17 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 14...
  • Page 18 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 15...
  • Page 19 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 16...
  • Page 20 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 6)-2 New Function 6)-2-1. HD-DVD, Blue-Ray 2 - 17...
  • Page 21 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 18...
  • Page 22 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 6)-2-2. New Keyboard 2 - 19...
  • Page 23 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 20...

  • Page 24: Software List

    - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 7) Software List Items Specification Version Vista Home Premium 32Bit Windows Vista Vista Home Basic 32Bit...

  • Page 25: System Setup (Bios Setup)

    - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 8) System Setup (BIOS Setup) MAIN Primary Master ▷ The information on the device mounted on the Primary Master. The HDD capacity is displayed in Beijing.
  • Page 26 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Advanced Core Multi-Processing ▷ The option to determine whether to switch Single core or Dual Core processing.
  • Page 27 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 24...
  • Page 28 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Security Set the Supervisor Password ▷ Select to set the supervisor password. Set a User Password ▷...
  • Page 29 Boot-time Diagnostic Screen ▷ The option to determine whether to display the Samsung logo on the screen when booting. PXE OPROM ▷ The option to determine whether to always initialize PXE Oprom in relation to a network boot.
  • Page 30 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 27...
  • Page 31 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 2 - 28...
  • Page 32 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification Exit Exit Saving changes ▷ Saves the changed settings and exits. Exit Discarding Changes ▷...

  • Page 33: Description Of Main Board

    - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 9) Description of Main board 9)-1. Top CRT connector (CRT500) USB connector (USB501) DC-Jack (J500)

  • Page 34: Bottom

    - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 2. Introduction and Specification 9)-2. Bottom 13 14 CPU socket (CPU500) (G)MCH (U504) Graphics Controller (U503) Battery connector (J501)
  • Page 35 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - Exploded View & Partlist SYSTEM T4009 I0006 T4008 T0302 T3002 T2200 T0300 T0101 T0102 M0001 M3005 B0008 I0009...
  • Page 36 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - Exploded View & Partlist Unit-Housing-Back K0001 Unit-Housing_Top T0001 T3002 T0302 T0102 T0300 T0101 5- 2...
  • Page 37 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - Exploded View & Partlist Unit-Housing_Bottom B0001 T2004 B0501 B0303 T2009 B0302 T2004 B0015 B0009 B0402 B0403 B0010 T2004...
  • Page 38 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - Exploded View & Partlist Unit-ODD D0001 D1002 D1008 D3000 5- 4...
  • Page 39 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - Exploded View & Partlist NP-Q70AV02/SUK Location Part Number Parts Name & Specification Q'ty SA/SNA A0010 3903-000116 CBF-POWER CORD;DT,GB,GP3,IEC320 C5,250/2...
  • Page 40 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - Exploded View & Partlist NP-Q70AV02/SUK Location Part Number Parts Name & Specification Q'ty SA/SNA K0002 BA75-01936A UNIT-HOUSING_LCD-FRONT;BEIJING,SEC,PC/AB K0007 BA64-00723A LOGO-SAMSUNG;BEIJING,NI,T0.95(W/ TAPE),W...
  • Page 41 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - Exploded View & Partlist NP-Q70AV02/SUK Location Part Number Parts Name & Specification Q'ty SA/SNA M1024 0801-002195 IC-CMOS LOGIC;7S08,AND GATE,SOT-25,5P,63...
  • Page 42 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - Exploded View & Partlist NP-Q70AV02/SUK Location Part Number Parts Name & Specification Q'ty SA/SNA M9999 0904-002220 IC-I/O CONTROLLER;NH82801HBM,BGA,676P,31...
  • Page 43 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - Exploded View & Partlist NP-Q70AV02/SUK Location Part Number Parts Name & Specification Q'ty SA/SNA M9999 3709-001401 CONNECTOR-CARD EDGE;52P,0.8mm,SMD-A,AU,m...
  • Page 44 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - Exploded View & Partlist NP-Q70AV02/SUK Location Part Number Parts Name & Specification Q'ty SA/SNA T2200 BA39-00524A CBF HARNESS-MIC;HABANA,-,AWG32,2P,-,Writ...

  • Page 45: Disassembly And Reassembling

    - This Document can not be used without Samsung's authorization - 4. Disassembly and Reassembly 4-1. Disassembly and Reassembly of Q70 Part Figure Description Name Must remove AC Adapter and Battery when disassembling system. After push knobs to end forward to red arrows and red mark No.1, Push Battery...
  • Page 46 - This Document can not be used without Samsung's authorization - 4. Disassembly and Reassembly Part Figure Description Name 8. You can see HDD, removing Door-HDD, And, Pick Insulator and pull it toward to 70º direction than ground with HDD.
  • Page 47 - This Document can not be used without Samsung's authorization - 4. Disassembly and Reassembly Part Figure Description Name 12. After reversing Keyboard backward like pic. pull out Keyboard FPC with operating Keyboard Connector. * CAUTION Be careful for Sheet-top scratch 13.Separate cables From Main Board.
  • Page 48 - This Document can not be used without Samsung's authorization - 4. Disassembly and Reassembly Part Figure Description Name 16. Separate perfectly TOP in bottom with picture. * CAUTION Be careful for Sheet-top scratch 17. Separate Antenna Cable connector in Wireless LAN module.
  • Page 49 - This Document can not be used without Samsung's authorization - 4. Disassembly and Reassembly Part Figure Description Name 20.Separate LCD-CABLE in MAIN Board 21. Remove screws between Hinge and Brkt- Reinforce -M2XL7: 2개(RED) Main System 22.Separate LCD in System.
  • Page 50 - This Document can not be used without Samsung's authorization - 4. Disassembly and Reassembly Part Figure Description Name Remove screws using assembling Main PCB - M2xL3 : 3개(RED) 25.Separate cables between Main PCB and Bottom. - Speaker Cable (RED)
  • Page 51 - This Document can not be used without Samsung's authorization - 4. Disassembly and Reassembly Part Figure Description Name 31.Reverse Main PCB backward, Separate Memory of MAIN PCB bottomside. (1st, push side pin toward to each outside direction, 2nd, Memory module lift up automatically, 3rd, pick memory and pull out.)
  • Page 52 - This Document can not be used without Samsung's authorization - 4. Disassembly and Reassembly Part Figure Description Name 34.After check combination loosen, separate CPU. (Be careful with bending of CPU pin.) Main System 35. Separate Wireless LAN Module with pushing...
  • Page 53 - This Document can not be used without Samsung's authorization - 4. Disassembly and Reassembly Part Figure Description Name 1. Remove 5 Rubber-Front and Remove 5 screws. - M2xL5 : 5 EA * CAUTION : Be careful with scratch in LCD-Front when removing Rubber-Front.
  • Page 54 - This Document can not be used without Samsung's authorization - 4. Disassembly and Reassembly Part Figure Description Name 7. Disassemble Inverter B’d like pic. (Must separate Inverter B’d and LCD Panel’s cable first.) 8. Remove screws for hinges. (Only Arrow shape picture - M2XL5 : 4 EA (YELLOW).
  • Page 55 - This Document can not be used without Samsung's authorization - 4. Disassembly and Reassembly Part Figure Description Name 10. Reverse LCD Panel, Remove tapes at point of no.1 and no.2. 12.Separate LCD Cable to pull toward to red arrow direction like pic.
  • Page 56 - This Document can not be used without Samsung's authorization - 4. Disassembly and Reassembly Part Figure Description Name 1.Remove screws for ONTOP B’D and BRACKET TOUCHPAD. - M2xL3 : 4 EA (RED) 2. Separate MIC. ass'y 3. Separate ONTOP B’D and Cable.
  • Page 57 - This Document can not be used without Samsung's authorization - 4. Disassembly and Reassembly Part Figure Description Name 5. Disassemble BRACKET-TOUCHPAD. 6. Disassemble Touchpad-B’D. ass'y THE END... 4-13...

  • Page 58: Troubleshooting

    - This Document can not be used without Samsung's authorization - 4. Troubleshooting 1) General (1) Tools used for repairing the product System Diagnostics Disk MS-DOS Booting Disk System Diagnostics Card Screwdrivers ( ┼ , ━ ) Tweezers Multi-meter Oscilloscope...

  • Page 59: Debugging Flow Chart

    - This Document can not be used without Samsung's authorization - 4. Troubleshooting 2) Debugging Flow Chart S t a r t P o w e r o n N o p r o b le m N o p r o b le m...
  • Page 60 - This Document can not be used without Samsung's authorization - 4. Troubleshooting N o p r o b l e m N o p r o b l e m C h e c k s p e a k e r...

  • Page 61: System Diagnosis

    - This Document can not be used without Samsung's authorization - 4. Troubleshooting 3) System Diagnosis (1) System Diagnostics Card The Diagnostics Card shows the system operations during the POST (Power On Self Test) in a 2 digit hexadecimal number by connecting the cable to the 10 pin connector below the PCMCIA slot after separating the Top part.
  • Page 62 - This Document can not be used without Samsung's authorization - 4. Troubleshooting Shadow system BIOS ROM Auto size cache Advanced configuration of chipset registers Load alternate registers with CMOS values Initialize interrupt vectors POST device initialization 2-1-2-3 Check the ROM copyright notice...
  • Page 63 - This Document can not be used without Samsung's authorization - 4. Troubleshooting Test and initialize PS/2 mouse Initialize floppy controller Determine number of ATA drives (optional) Initialize hard-disk controllers Initialize local-bus hard-disk controllers Jump to UserPatch2 Build MPTABLE for multi-processor boards...
  • Page 64 - This Document can not be used without Samsung's authorization - 4. Troubleshooting (3) Use Debug card -. As above picture shown, debug card is connected to DEBUG connector in Main board. -. Debug code is shown the 2-digit LED displays in red marked area.

  • Page 65: Use Of Diagnostic Program

    - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4)Use of diagnostic program 4)-1 Copy Windiag2.42a to C:\WINDIAG.
  • Page 66 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4)-2 Execute run.exe...
  • Page 67 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4)-3 Click Start Button to begin test. 4-10...
  • Page 68 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4)-4 Click stop button to terminal all of the tests. 4-11...
  • Page 69 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4)-5 Click pause button to pause the present tests. 4)-6 Click EXIT button to end and exit Windiag. 4-12...

  • Page 70: Hardware Troubleshooting

    - This Document can not be used without Samsung's authorization - 4. Troubleshooting 5) Hardware Troubleshooting For the procedures to disassemble each part, refer to the descriptions of Chapter 4, “Disassembly and Reassembly”. ◆ LCD Related Troubles 1. The screen is dark or the colors of the screen are distorted.
  • Page 71 - This Document can not be used without Samsung's authorization - 4. Troubleshooting ◆ Main System Troubles 5. The system is not turned off. → Check if the AC adapter LED is lit and if the adapter is properly connected to the system.
  • Page 72 - This Document can not be used without Samsung's authorization - 4. Troubleshooting → Replace the memory module and check if it is out of order. → Reset the RTC Reset terminal. Remove RTC cabel from RTC connector Connect the two pad of the cap for a while →...
  • Page 73 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 10. The external microphone does not work normally. → Check the audio driver settings and change them if necessary. Selecting the "1. Front panel microphone" option activates the external MIC.
  • Page 74 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 12. The Touch Pad does not work or is malfunctioning. → Check the connection status of the Touch Pad FFC. → Check the connection status of the Touch Pad module →...
  • Page 75 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 16. The wireless LAN does not work normally. → Check if the WLAN slide switch is in the ON position. → Check if the WLAN driver is properly installed.
  • Page 76 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 17. The Fan does not work normally → Check if the Thermal is locked tightly. → Check if the Fan cable is properly connected FAN Control Table...
  • Page 77 - This Document can not be used without Samsung's authorization - 4. Troubleshooting device and press a key" message appears. → Check if the signal and power cables are properly connected to the hard disk drive. → Check if the hard disk drive is recognized in the BIOS SETUP.
  • Page 78 - This Document can not be used without Samsung's authorization - 4. Troubleshooting ◆ Windows / Screen Related Problems 24. The computer hangs while running a program. → If the running program causes an error: In Windows XP, press the <Ctrl>, <Alt> and <Del> key combination, select the application program and click on End Task in the Applications tab of the [Windows Task Manager] window.

  • Page 79: Device Settings Related Software Diagnosis

    - This Document can not be used without Samsung's authorization - 4. Troubleshooting 6) Device Settings Related Software Diagnosis (1) Check if the drivers of each of the devices are properly installed. That is, check if there are any yellow exclamation marks in the Device Manager.
  • Page 80 - This Document can not be used without Samsung's authorization - 4. Troubleshooting (3) Check if the program is properly installed. Click on the Realtek Control Panel in the Control Panel and check if the function works normally. 4-23...
  • Page 81 - This Document can not be used without Samsung's authorization - 4. Troubleshooting (4) HDD and ODD Related Problems For an HDD, check if the HDD operates in Ultra DMA Mode 5 by selecting the Primary IDE Channel in the Control Panel as follows. If it does not, check the BIOS SETUP, reinstall the operating system or replace the HDD-FPC or HDD, if necessary.
  • Page 82 - This Document can not be used without Samsung's authorization - 4. Troubleshooting For an ODD, check if it operates in Ultra DMA Mode 2. If it does not, check if the disc inserted into the ODD is clean. If the disc is contaminated, the access speed may slows down. If the disc is clean, check the BIOS SETUP, reinstall the operating system or ODD, if necessary.
  • Page 83 - This Document can not be used without Samsung's authorization - 4. Troubleshooting (6) Other Problems Press each corresponding button and check its operation. The following figure illustrates the operation of the volume control button. 4-26...
  • Page 84 - This Document can not be used without Samsung's authorization - 4. Troubleshooting The drivers and application software are listed in the following table. Drivers PV-R (XP Pro,ENG) Chipset/Graphic Driver 8.1.0.1006 8.1.1.1010 Wireless LAN Driver(Askey) 11.1.0.59 11.1.0.72 32bit (B3) Sound Driver 5.10.0.5324LogoSRS...

  • Page 85: Battery Use Time

    - This Document can not be used without Samsung's authorization - 4. Troubleshooting 7) Battery Use Time Check the following check lists for systems where the battery use time is too short to diagnose problems. (1) Check the battery Check if the battery is out of order referring to the Battery check program distributed to Service Centers and the 'Battery Check Manual' included in the 'Note-PC A/S Guide'.
  • Page 86 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4-29...
  • Page 87 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4-30...
  • Page 88 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 3. Battery Capacity Table 4. Battery Check Program 4-31...
  • Page 89 - This Document can not be used without Samsung's authorization - 4. Troubleshooting (2) Check the battery use environment 1. Generally, the battery usage time in advertisements by notebook manufacturers refers to the maximum battery use time. Since the system specifications and the usage environment may differ, the user's battery usage time may differ from the advertisement even if there is no problem with the system.

  • Page 90: Etc

    - This Document can not be used without Samsung's authorization - 4. Troubleshooting 8) Etc. (1)CPU type 4-6 CODE TYPE Description 2.4GHz,uFCPGA,479P,TR,PLASTIC,1.05V,34W,0t T7700 0902-002199 uFCPGA LF80537GG0564M o+100C,4MB,FSB800 2.2GHz,uFCPGA,479P,TR,PLASTIC,1.05V,34W,0t T7500 0902-002198 uFCPGA LF80537GG0494M o+100C,4MB,FSB800 2.0GHz,uFCPGA,479P,TR,PLASTIC,1.05V,34W,0t T7300 0902-002197 uFCPGA LF80537GG0414M o+100C,4MB,FSB800 1.8GHz,uFCPGA,479P,TR,PLASTIC,1.05V,34W,0t...

  • Page 91: Adding A Memory Module

    - This Document can not be used without Samsung's authorization - 4. Troubleshooting (5) Model group Different model group indication: Desktop PC Notebook PC Division DeskType Tower Type Technical Leading Performance Value Entry New Form Factor Ultra Slim 2 SP. Thin & Light...
  • Page 92 - This Document can not be used without Samsung's authorization - 4. Troubleshooting 4-35...
  • Page 93 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 7. System Wire Diagram 1) Top 7- 1...
  • Page 94 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 7. System Wire Diagram 2) Bottom MDC modem cable Bluetooth cable LCD cable 7- 2...
  • Page 95 - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - - This Document can not be used without Samsung's authorization - 7. System Wire Diagram 3) LCD Antenna cable Main Antenna cable Aux 7- 3...
  • Page 96 Main System Location Level SEC Code Name Description Qt'y SA/SNA Option T7100(1.8GHz) 0902-002196 IC-MICROPROCESSOR LF80537GG0332M,1.8GHz,uFCPGA,479P,TR,PLASTIC,1.05V,34W,0to+100C,2MB 1 SA T7300(2.0GHz) 0902-002197 IC-MICROPROCESSOR LF80537GG0414M,2.0GHz,uFCPGA,479P,TR,PLASTIC,1.05V,34W,0to+100C,4MB 1 SA T7500(2.2GHz) 0902-002198 IC-MICROPROCESSOR LF80537GG0494M,2.2GHz,uFCPGA,479P,TR,PLASTIC,1.05V,34W,0to+100C,4MB 1 SA T7700(2.4GHz) 0902-002199 IC-MICROPROCESSOR LF80537GG0564M,2.4GHz,uFCPGA,479P,TR,PLASTIC,1.05V,34W,0to+100C,4MB 1 SA 1G_D6(SEC 512X2) 1105-001683 IC-DRAM MODULE M470T6554,DDR2,512MByte,64Mx64,SO-DIMM,200P,67.6x30.0mm,3nS,1.7/1.9 2 SA 512M_D6(SEC)
  • Page 97 Location Level SEC Code Name Description Qt'y SA/SNA Option PRE-HDM-KOR/INT BA46-06077A S/W HDM-WINVISTAHP S/W HDM-WINVISTAHP;TORINO2,WINVISTAHP,-, 1 SNA BUS-HDM-KOR/INT BA46-06086A S/W HDM-WINVISTAB S/W HDM-WINVISTAB;TORINO2,WINVISTAB,-,KO 1 SNA BASIC-HDM-KOR/EXT BA46-06150A S/W HDM-WINVISTAHB S/W HDM-WINVISTAHB;TORINO2,WINVISTAHB,-, 1 SNA PRE-HDM-KOR/EXT BA46-06159A S/W HDM-WINVISTAHP S/W HDM-WINVISTAHP;TORINO2,WINVISTAHP,-, 1 SNA BUS-HDM-KOR/EXT BA46-06168A S/W HDM-WINVISTAB...
  • Page 98 MANUAL-ONLINE_GAME;All of VISTA MODEL,SE INS-GUIDE(KOR) BA68-03837A MANUAL INSTALL-GUIDE MANUAL INSTALL-GUIDE;Q45,SEC,KOR,DOMESTI LABEL-ZAIGEN(KOR) BA68-03850B LABEL-ZAIGEN LABEL-ZAIGEN;Torino2,KOR,PET,-,W48,L100m CENTRINO DUO_SAN BA68-03880A LABEL-LOGO_CENTRINO-DUO2_ LABEL-LOGO_CENTRINO-DUO2_SANTA;OSLO,N/P LABEL LOGO SAMSUNG BA68-10150B LABEL-LOGO_SAMSUNG LABEL-LOGO_SAMSUNG;NP,SEC,ARTPAPER+OPP C 1 SNA HDD BARCODE BA68-20039A LABEL-PPID_E LABEL-PPID_E;BLADE,-,PET,-,W50.8,L12.7mm 1 SA LCD CABLE LABEL BA68-20039A LABEL-PPID_E LABEL-PPID_E;BLADE,-,PET,-,W50.8,L12.7mm...
  • Page 99 Location Level SEC Code Name Description Qt'y SA/SNA Option 2007-000402 R-CHIP R-CHIP;150ohm,5%,1/10W,TP,1608 1 SNA 2203-005148 C-CER C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA 2203-005148 C-CER C-CER,CHIP;100nF,10%,16V,X7R,1608 1 SA 3404-001052 SWITCH SWITCH-TACT;12V,50mA,160gf,5.2x5.2x0.8mm 1 SA 3404-001052 SWITCH SWITCH-TACT;12V,50mA,160gf,5.2x5.2x0.8mm 1 SA 3711-004779 CONNECTOR CONNECTOR-HEADER;BOX,6P,1R,1.25mm,SMD-A, 1 SA PCB(GCE) BA41-00756A PCB MAIN PCB MAIN;TORINO2,Immersion Gold L/F,2LAY...
  • Page 100 Location Level SEC Code Name Description Qt'y SA/SNA Option BRKT-VGA BA70-00388A BRKT-VGA BRACKET-VGA;FIRENZE,STS304,T0.15mm,-,-,N 1 SA RUBBER-ODD BA81-02722A RUBBER RUBBER-ODD;TORINO,DOMESTIC,SR,H80,NTR,RU 5 SNA INSULATOR_USB BA81-02748A INSULATOR INSULATOR-USB;TORINO,DOMESTIC,PC,L13*W11 2 SNA INSULATOR-PCMCIA BA81-02808A INSULATOR INSULATOR-PCMCIA;FIRENZE2,PC,W72*L50*T0. 1 SA INSULATOR-ODD BA81-03483A INSULATOR INSULATOR-ODD;TORINO2,PC,W12.5,L12,T0.2M 1 SA INSULATOR-DVBT BA81-03488A INSULATOR INSULATOR-DVBT;OSLO,PC,T0.1,W47*L30mm,BL...
  • Page 101 LCD FRT PROTECTOR TAPE-FILAMENT;3M 8915,-,T0.15,W18,L55000mm,WHITE,- 0.08 SNA LCD FRT PROTECTOR BA62-00327A LCD FRT PROTECTOR INSULATION-LCD_PROTECTOR;NEON,PET,T0.1,W274,L174mm,CLEAR,-,-,- 1 SA LOGO SAMSUNG BA64-00700H LOGO SAMSUNG LOGO-SAMSUNG;TORINO2,NI,T0.95(W/ TAPE),W45MM,-,-,SILVER,HIGH GLOSS 1 SA HINGE L BA81-02740A HINGE L HINGE-L;TORINO,DOMESTIC,SUS,W26.2*L17.7*H22.7,HINGE-L,-,- 1 SA HINGE R BA81-02744A HINGE R HINGE-R;TORINO,DOMESTIC,SUS,W26.2*L17.7*H22.7,NTR,HINGE-R,-...
  • Page 102 Location Level SEC Code Name Description Qt'y SA/SNA Option ..4 0402-001024 DIODE-SWITCHING DIODE-RECTIFIER;MBR0540,40V,0.5A,SOD-123,TP 1 SNA ..4 0402-001405 DIODE-SWITCHING DIODE-RECTIFIER;B340A,40,3A,SMA,TP 1 SA ..4 0402-001405 DIODE-SWITCHING DIODE-RECTIFIER;B340A,40,3A,SMA,TP 1 SA ..4 0402-001405 DIODE-SWITCHING DIODE-RECTIFIER;B340A,40,3A,SMA,TP 1 SA ..4 0403-001047 DIODE-SWITCHING DIODE-ZENER;BZX84C12L,5%,225mW,SOT-23,TP 1 SA ..4 0404-000114 DIODE-SWITCHING DIODE-SCHOTTKY;MMBD301,30V,200MA,SOT-23,TP...
  • Page 103 Location Level SEC Code Name Description Qt'y SA/SNA Option ..4 0505-001861 FET-SILICON;SI2315BDS,P,-12V,-3A,0.100OHM,0.75W,SOT-23 1 SNA ..4 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 1 SA ..4 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 1 SA ..4 0505-001920 FET-SILICON;HAT2195R,N,30V,18A,0.0084ohm,2.5W,SOP-8 1 SNA ..4 0505-001920 FET-SILICON;HAT2195R,N,30V,18A,0.0084ohm,2.5W,SOP-8 1 SNA ..4 0505-001920 FET-SILICON;HAT2195R,N,30V,18A,0.0084ohm,2.5W,SOP-8 1 SNA ..4 0505-001920 FET-SILICON;HAT2195R,N,30V,18A,0.0084ohm,2.5W,SOP-8 1 SNA...
  • Page 104 Location Level SEC Code Name Description Qt'y SA/SNA Option ..4 0801-002628 IC-CMOS LOGIC IC-CMOS LOGIC;7SZ08,2-INPUT AND GATE,SC70,5P,49MIL,SINGLE,TP,CMOS,1 1 SA ..4 0903-001439 C-MICROCOMPUTER IC-MICROCOMPUTER;H8S/2110B,16Bit,TQFP,100P,16x16mm,10MHz,TR,PLASTI 1 SA ..4 0904-002063 IC-BUS CONTROLLER IC-BUS CONTROLLER;R5C843,32Bit,CSP,208P,16x16mm,33MHz,TR,Plastic,3.3V 1 SA ..4 0904-002220 IC-I/O CONTROLLER IC-I/O CONTROLLER;NH82801HBM,BGA,676P,31x31mm,100MHz,TR,PLASTIC,3 1 SA ..4 1103-001333 IC-EEPROM...
  • Page 105 Location Level SEC Code Name Description Qt'y SA/SNA Option R201 ..4 2007-000138 R-CHIP R-CHIP;100ohm,5%,1/16W,TP,1005 1 SNA R215 ..4 2007-000138 R-CHIP R-CHIP;100ohm,5%,1/16W,TP,1005 1 SNA ..4 2007-000140 R-CHIP R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SNA ..4 2007-000140 R-CHIP R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SNA R190 ..4 2007-000141 R-CHIP R-CHIP;2.2Kohm,5%,1/16W,TP,1005 1 SNA R203 ..4...
  • Page 106 Location Level SEC Code Name Description Qt'y SA/SNA Option ..4 2007-000171 R-CHIP R-CHIP;0ohm,5%,1/16W,TP,1005 1 SNA ..4 2007-000171 R-CHIP R-CHIP;0ohm,5%,1/16W,TP,1005 1 SNA ..4 2007-000171 R-CHIP R-CHIP;0ohm,5%,1/16W,TP,1005 1 SNA R891 ..4 2007-000171 R-CHIP R-CHIP;0ohm,5%,1/16W,TP,1005 1 SNA ..4 2007-000171 R-CHIP R-CHIP;0ohm,5%,1/16W,TP,1005 1 SNA R185 ..4 2007-000172...
  • Page 107 Location Level SEC Code Name Description Qt'y SA/SNA Option R200 ..4 2007-001292 R-CHIP R-CHIP;33ohm,5%,1/16W,TP,1005 1 SNA R229 ..4 2007-001292 R-CHIP R-CHIP;33ohm,5%,1/16W,TP,1005 1 SNA R248 ..4 2007-001292 R-CHIP R-CHIP;33ohm,5%,1/16W,TP,1005 1 SNA R165 ..4 2007-002906 R-CHIP R-CHIP;200Kohm,1%,1/10W,TP,1608 1 SNA R115 ..4 2007-002910 R-CHIP R-CHIP;30.1Kohm,1%,1/10W,TP,1608 1 SNA...
  • Page 108 Location Level SEC Code Name Description Qt'y SA/SNA Option ..4 2007-007142 R-CHIP R-CHIP;10Kohm,1%,1/16W,TP,1005 1 SNA NB8M ..4 2007-007142 R-CHIP R-CHIP;10Kohm,1%,1/16W,TP,1005 1 SNA NB8M ..4 2007-007142 R-CHIP R-CHIP;10Kohm,1%,1/16W,TP,1005 1 SNA ..4 2007-007142 R-CHIP R-CHIP;10Kohm,1%,1/16W,TP,1005 1 SNA ..4 2007-007142 R-CHIP R-CHIP;10Kohm,1%,1/16W,TP,1005 1 SNA R146 ..4 2007-007156...
  • Page 109 Location Level SEC Code Name Description Qt'y SA/SNA Option R139 ..4 2007-007642 R-CHIP R-CHIP;12.1ohm,1%,1/16W,TP,1005 1 SNA R186 ..4 2007-007642 R-CHIP R-CHIP;12.1ohm,1%,1/16W,TP,1005 1 SNA R147 ..4 2007-007766 R-CHIP R-CHIP;2Kohm,1%,1/16W,TP,1005 1 SNA R158 ..4 2007-007766 R-CHIP R-CHIP;2Kohm,1%,1/16W,TP,1005 1 SNA R242 ..4 2007-007766 R-CHIP R-CHIP;2Kohm,1%,1/16W,TP,1005 1 SNA...
  • Page 110 Location Level SEC Code Name Description Qt'y SA/SNA Option R226 ..4 2007-008298 R-CHIP R-CHIP;49.9ohm,1%,1/16W,TP,1005 1 SNA R236 ..4 2007-008298 R-CHIP R-CHIP;49.9ohm,1%,1/16W,TP,1005 1 SNA R234 ..4 2007-008300 R-CHIP R-CHIP;5.11Kohm,1%,1/16W,TP,1005 1 SNA R131 ..4 2007-008303 R-CHIP R-CHIP;27.4ohm,1%,1/16W,TP,1005 1 SNA R137 ..4 2007-008303 R-CHIP R-CHIP;27.4ohm,1%,1/16W,TP,1005 1 SNA...
  • Page 111 Location Level SEC Code Name Description Qt'y SA/SNA Option ..4 2203-000254 C-CER C-CER,CHIP;10nF,10%,16V,X7R,1005 1 SNA NB8M C226 ..4 2203-000254 C-CER C-CER,CHIP;10nF,10%,16V,X7R,1005 1 SNA C227 ..4 2203-000254 C-CER C-CER,CHIP;10nF,10%,16V,X7R,1005 1 SNA ..4 2203-000254 C-CER C-CER,CHIP;10nF,10%,16V,X7R,1005 1 SNA NB8M ..4 2203-000254 C-CER C-CER,CHIP;10nF,10%,16V,X7R,1005 1 SNA NB8M...
  • Page 112 Location Level SEC Code Name Description Qt'y SA/SNA Option C134 ..4 2203-000940 C-CER C-CER,CHIP;0.47nF,10%,50V,X7R,1005 1 SNA NB8M ..4 2203-000940 C-CER C-CER,CHIP;0.47nF,10%,50V,X7R,1005 1 SNA NB8M C323 ..4 2203-000940 C-CER C-CER,CHIP;0.47nF,10%,50V,X7R,1005 1 SNA C253 ..4 2203-000995 C-CER C-CER,CHIP;0.047nF,5%,50V,C0G,1005 1 SNA C318 ..4 2203-000995 C-CER C-CER,CHIP;0.047nF,5%,50V,C0G,1005...
  • Page 113 Location Level SEC Code Name Description Qt'y SA/SNA Option C230 ..4 2203-002711 C-CER C-CER,CHIP;100nF,10%,25V,X7R,1608 1 SNA C233 ..4 2203-002711 C-CER C-CER,CHIP;100nF,10%,25V,X7R,1608 1 SNA C239 ..4 2203-002711 C-CER C-CER,CHIP;100nF,10%,25V,X7R,1608 1 SNA C243 ..4 2203-002711 C-CER C-CER,CHIP;100nF,10%,25V,X7R,1608 1 SNA C288 ..4 2203-002711 C-CER C-CER,CHIP;100nF,10%,25V,X7R,1608 1 SNA...
  • Page 114 Location Level SEC Code Name Description Qt'y SA/SNA Option C148 ..4 2203-005384 C-CER C-CER,CHIP;4700nF,+80-20%,10V,Y5V,2012 1 SNA NB8M C149 ..4 2203-005384 C-CER C-CER,CHIP;4700nF,+80-20%,10V,Y5V,2012 1 SNA NB8M C153 ..4 2203-005384 C-CER C-CER,CHIP;4700nF,+80-20%,10V,Y5V,2012 1 SNA NB8M C185 ..4 2203-005384 C-CER C-CER,CHIP;4700nF,+80-20%,10V,Y5V,2012 1 SNA C186 ..4 2203-005384...
  • Page 115 Location Level SEC Code Name Description Qt'y SA/SNA Option C187 ..4 2203-005918 C-CER C-CER,CHIP;1000nF,10%,6.3V,X7R,1608 1 SA C231 ..4 2203-005918 C-CER C-CER,CHIP;1000nF,10%,6.3V,X7R,1608 1 SA C255 ..4 2203-005918 C-CER C-CER,CHIP;1000nF,10%,6.3V,X7R,1608 1 SA C259 ..4 2203-005918 C-CER C-CER,CHIP;1000nF,10%,6.3V,X7R,1608 1 SA C264 ..4 2203-005918 C-CER C-CER,CHIP;1000nF,10%,6.3V,X7R,1608 1 SA...
  • Page 116 Location Level SEC Code Name Description Qt'y SA/SNA Option C167 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C168 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C169 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C170 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C171 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA...
  • Page 117 Location Level SEC Code Name Description Qt'y SA/SNA Option C336 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C341 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C342 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C346 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C348 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA...
  • Page 118 Location Level SEC Code Name Description Qt'y SA/SNA Option C326 ..4 2203-006069 C-CER C-CER,CHIP;4700nF,10%,6.3V,X7R,2012 1 SNA C345 ..4 2203-006069 C-CER C-CER,CHIP;4700nF,10%,6.3V,X7R,2012 1 SNA ..4 2203-006069 C-CER C-CER,CHIP;4700nF,10%,6.3V,X7R,2012 1 SNA ..4 2203-006069 C-CER C-CER,CHIP;4700nF,10%,6.3V,X7R,2012 1 SNA C100 ..4 2203-006090 C-CER C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 1 SA C101 ..4...
  • Page 119 Location Level SEC Code Name Description Qt'y SA/SNA Option C237 ..4 2203-006090 C-CER C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 1 SA C263 ..4 2203-006090 C-CER C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 1 SA C292 ..4 2203-006090 C-CER C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 1 SA C296 ..4 2203-006090 C-CER C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 1 SA C300 ..4 2203-006090 C-CER C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 1 SA...
  • Page 120 Location Level SEC Code Name Description Qt'y SA/SNA Option ..4 2203-006336 C-CER C-CER,CHIP;10000nF,10%,25V,X5R,3216 1 SNA ..4 2203-006336 C-CER C-CER,CHIP;10000nF,10%,25V,X5R,3216 1 SNA ..4 2203-006336 C-CER C-CER,CHIP;10000nF,10%,25V,X5R,3216 1 SNA ..4 2203-006336 C-CER C-CER,CHIP;10000nF,10%,25V,X5R,3216 1 SNA ..4 2203-006336 C-CER C-CER,CHIP;10000nF,10%,25V,X5R,3216 1 SNA ..4 2203-006336 C-CER C-CER,CHIP;10000nF,10%,25V,X5R,3216...
  • Page 121 Location Level SEC Code Name Description Qt'y SA/SNA Option C272 ..4 2203-006650 C-CER C-CER,CHIP;10000nF,20%,4V,X6S,-,2012 1 SNA EC24 ..4 2402-001120 C-ORGANIC C-POLYMER AL CHIP;330uF,0.2,6.3V,-,TP,7.3x4.3x2.8,0 1 SA EC25 ..4 2402-001120 C-ORGANIC C-POLYMER AL CHIP;330uF,0.2,6.3V,-,TP,7.3x4.3x2.8,0 1 SA EC15 ..4 2402-001125 C-ORGANIC C-ORGANIC;15uF,20%,25V,-,TP,7.3x4.3x1.9mm 1 SNA EC21 ..4 2402-001125...
  • Page 122 Location Level SEC Code Name Description Qt'y SA/SNA Option ..4 2703-002656 INDUCTOR-SMD INDUCTOR-SMD;3.3uH,20%,6965 1 SNA ..4 2703-002656 INDUCTOR-SMD INDUCTOR-SMD;3.3uH,20%,6965 1 SNA ..4 2703-002746 INDUCTOR-SMD INDUCTOR-SMD;10uH,20%,6965 1 SNA ..4 2703-002871 INDUCTOR-SMD INDUCTOR-SMD;0.82uH,20%,6965 1 SNA ..4 2801-003856 CRYSTAL-SMD CRYSTAL-SMD;0.032768MHz,20ppm,28-ACP,7pF,65000ohm,TP 1 SA ..4 2801-004200 CRYSTAL-SMD CRYSTAL-SMD;10MHz,30ppm,28-ACF,15pF,80ohm,TP...
  • Page 123 Location Level SEC Code Name Description Qt'y SA/SNA Option B504 ..4 3301-001649 BEAD-SMD BEAD-SMD;180ohm,1608,-,TP,-,226ohm/389MHz,- 1 SNA B505 ..4 3301-001649 BEAD-SMD BEAD-SMD;180ohm,1608,-,TP,-,226ohm/389MHz,- 1 SNA B506 ..4 3301-001649 BEAD-SMD BEAD-SMD;180ohm,1608,-,TP,-,226ohm/389MHz,- 1 SNA B507 ..4 3301-001649 BEAD-SMD BEAD-SMD;180ohm,1608,-,TP,-,226ohm/389MHz,- 1 SNA B540 ..4 3301-001649 BEAD-SMD BEAD-SMD;180ohm,1608,-,TP,-,226ohm/389MHz,- 1 SNA...
  • Page 124 Location Level SEC Code Name Description Qt'y SA/SNA Option BIOS_REV ..4 BA68-40012N LABE LABEL-LOCATION;NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,- 1 SNA MICOM_REV ..4 BA68-40012N LABE LABEL-LOCATION;NOTE PC,-,ART PAPER,-,W6.2,L6.2MM,-,-,-,- 1 SNA EMI1 ..4 BA70-00601A GASKET GASKET-EMI;EMISTOP,Be-Cu,T0.10,Au/gold color,W5.5,-,L4.5mm,- 1 SNA EMI2 ..4 BA70-00601A GASKET GASKET-EMI;EMISTOP,Be-Cu,T0.10,Au/gold color,W5.5,-,L4.5mm,- 1 SNA EMI504 ..4...
  • Page 125 Location Level SEC Code Name Description Qt'y SA/SNA Option Q510 ..4 0505-001049 FET-GAAS;BSS84,-50V,20V,-130mA,360mW,SOT-23,TP 1 SA Q519 ..4 0505-001049 FET-GAAS;BSS84,-50V,20V,-130mA,360mW,SOT-23,TP 1 SA Q514 ..4 0505-001585 FET-SILICON;FDC653N,N,30V,5A,55mohm,1.6W,SSOT-6 1 SA Q506 ..4 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 1 SA Q507 ..4 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323 1 SA Q513 ..4 0505-001883 FET-SILICON;RHU002N06,N,60V,200MA,3.3OHM,0.15W,SOT-323...
  • Page 126 Location Level SEC Code Name Description Qt'y SA/SNA Option R820 ..4 2007-000043 R-CHIP R-CHIP;1Kohm,1%,1/10W,TP,1608 1 SNA R827 ..4 2007-000043 R-CHIP R-CHIP;1Kohm,1%,1/10W,TP,1608 1 SNA R866 ..4 2007-000043 R-CHIP R-CHIP;1Kohm,1%,1/10W,TP,1608 1 SNA R688 ..4 2007-000070 R-CHIP R-CHIP;0ohm,5%,1/10W,TP,1608 1 SNA R804 ..4 2007-000070 R-CHIP R-CHIP;0ohm,5%,1/10W,TP,1608 1 SNA...
  • Page 127 Location Level SEC Code Name Description Qt'y SA/SNA Option R628 ..4 2007-000143 R-CHIP R-CHIP;4.7Kohm,5%,1/16W,TP,1005 1 SNA NB8M R685 ..4 2007-000143 R-CHIP R-CHIP;4.7Kohm,5%,1/16W,TP,1005 1 SNA R699 ..4 2007-000143 R-CHIP R-CHIP;4.7Kohm,5%,1/16W,TP,1005 1 SNA R718 ..4 2007-000143 R-CHIP R-CHIP;4.7Kohm,5%,1/16W,TP,1005 1 SNA R819 ..4 2007-000143 R-CHIP R-CHIP;4.7Kohm,5%,1/16W,TP,1005...
  • Page 128 Location Level SEC Code Name Description Qt'y SA/SNA Option R698 ..4 2007-000148 R-CHIP R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SNA R711 ..4 2007-000148 R-CHIP R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SNA R713 ..4 2007-000148 R-CHIP R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SNA R714 ..4 2007-000148 R-CHIP R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SNA R715 ..4 2007-000148 R-CHIP R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SNA...
  • Page 129 Location Level SEC Code Name Description Qt'y SA/SNA Option R905 ..4 2007-000152 R-CHIP R-CHIP;20Kohm,5%,1/16W,TP,1005 1 SNA R519 ..4 2007-000156 R-CHIP R-CHIP;30Kohm,5%,1/16W,TP,1005 1 SNA R764 ..4 2007-000157 R-CHIP R-CHIP;47Kohm,5%,1/16W,TP,1005 1 SNA R765 ..4 2007-000157 R-CHIP R-CHIP;47Kohm,5%,1/16W,TP,1005 1 SNA R859 ..4 2007-000157 R-CHIP R-CHIP;47Kohm,5%,1/16W,TP,1005 1 SNA...
  • Page 130 Location Level SEC Code Name Description Qt'y SA/SNA Option R625 ..4 2007-000171 R-CHIP R-CHIP;0ohm,5%,1/16W,TP,1005 1 SNA R655 ..4 2007-000171 R-CHIP R-CHIP;0ohm,5%,1/16W,TP,1005 1 SNA R659 ..4 2007-000171 R-CHIP R-CHIP;0ohm,5%,1/16W,TP,1005 1 SNA R672 ..4 2007-000171 R-CHIP R-CHIP;0ohm,5%,1/16W,TP,1005 1 SNA R675 ..4 2007-000171 R-CHIP R-CHIP;0ohm,5%,1/16W,TP,1005 1 SNA...
  • Page 131 Location Level SEC Code Name Description Qt'y SA/SNA Option R581 ..4 2007-000695 R-CHIP R-CHIP;3.3ohm,5%,1/10W,TP,1608 1 SNA R902 ..4 2007-000736 R-CHIP R-CHIP;30Kohm,1%,1/10W,TP,1608 1 SNA R503 ..4 2007-000923 R-CHIP R-CHIP;470Kohm,1%,1/10W,TP,1608 1 SNA R507 ..4 2007-000923 R-CHIP R-CHIP;470Kohm,1%,1/10W,TP,1608 1 SNA R872 ..4 2007-001167 R-CHIP R-CHIP;75ohm,5%,1/10W,TP,1608 1 SNA...
  • Page 132 Location Level SEC Code Name Description Qt'y SA/SNA Option R515 ..4 2007-007107 R-CHIP R-CHIP;100Kohm,1%,1/16W,TP,1005 1 SNA R525 ..4 2007-007107 R-CHIP R-CHIP;100Kohm,1%,1/16W,TP,1005 1 SNA R551 ..4 2007-007107 R-CHIP R-CHIP;100Kohm,1%,1/16W,TP,1005 1 SNA R558 ..4 2007-007107 R-CHIP R-CHIP;100Kohm,1%,1/16W,TP,1005 1 SNA R586 ..4 2007-007107 R-CHIP R-CHIP;100Kohm,1%,1/16W,TP,1005 1 SNA...
  • Page 133 Location Level SEC Code Name Description Qt'y SA/SNA Option R717 ..4 2007-007142 R-CHIP R-CHIP;10Kohm,1%,1/16W,TP,1005 1 SNA R719 ..4 2007-007142 R-CHIP R-CHIP;10Kohm,1%,1/16W,TP,1005 1 SNA R720 ..4 2007-007142 R-CHIP R-CHIP;10Kohm,1%,1/16W,TP,1005 1 SNA R721 ..4 2007-007142 R-CHIP R-CHIP;10Kohm,1%,1/16W,TP,1005 1 SNA R759 ..4 2007-007142 R-CHIP R-CHIP;10Kohm,1%,1/16W,TP,1005 1 SNA...
  • Page 134 Location Level SEC Code Name Description Qt'y SA/SNA Option R767 ..4 2007-007306 R-CHIP R-CHIP;100ohm,1%,1/16W,TP,1005 1 SNA R518 ..4 2007-007312 R-CHIP R-CHIP;20Kohm,1%,1/16W,TP,1005 1 SNA R708 ..4 2007-007312 R-CHIP R-CHIP;20Kohm,1%,1/16W,TP,1005 1 SNA R800 ..4 2007-007312 R-CHIP R-CHIP;20Kohm,1%,1/16W,TP,1005 1 SNA R829 ..4 2007-007312 R-CHIP R-CHIP;20Kohm,1%,1/16W,TP,1005 1 SNA...
  • Page 135 Location Level SEC Code Name Description Qt'y SA/SNA Option R537 ..4 2007-007548 R-CHIP R-CHIP;39.2ohm,1%,1/10W,TP,1608 1 SNA R560 ..4 2007-007585 R-CHIP R-CHIP;430KOHM,1%,1/16W,TP,1005 1 SNA R642 ..4 2007-007585 R-CHIP R-CHIP;430KOHM,1%,1/16W,TP,1005 1 SNA R576 ..4 2007-007642 R-CHIP R-CHIP;12.1ohm,1%,1/16W,TP,1005 1 SNA R578 ..4 2007-007642 R-CHIP R-CHIP;12.1ohm,1%,1/16W,TP,1005 1 SNA...
  • Page 136 Location Level SEC Code Name Description Qt'y SA/SNA Option R504 ..4 2007-008304 R-CHIP R-CHIP;300Kohm,1%,1/16W,TP,1005 1 SNA R852 ..4 2007-008304 R-CHIP R-CHIP;300Kohm,1%,1/16W,TP,1005 1 SNA R853 ..4 2007-008304 R-CHIP R-CHIP;300Kohm,1%,1/16W,TP,1005 1 SNA R751 ..4 2007-008313 R-CHIP R-CHIP;301ohm,1%,1/16W,TP,1005 1 SNA R752 ..4 2007-008313 R-CHIP R-CHIP;301ohm,1%,1/16W,TP,1005 1 SNA...
  • Page 137 Location Level SEC Code Name Description Qt'y SA/SNA Option RA515 ..4 2011-000685 R-NET R-NET;56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm 1 SNA ..4 2011-000685 R-NET R-NET;56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm 1 SNA ..4 2011-000685 R-NET R-NET;56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm 1 SNA ..4 2011-000685 R-NET R-NET;56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm 1 SNA ..4 2011-000685 R-NET R-NET;56ohm,5%,63mW,L,CHIP,4P,TP,1.0x1.0mm 1 SNA C517 ..4 2203-000233...
  • Page 138 Location Level SEC Code Name Description Qt'y SA/SNA Option C845 ..4 2203-000278 C-CER C-CER,CHIP;0.01nF,0.5pF,50V,C0G,1005 1 SNA C596 ..4 2203-000425 C-CER C-CER,CHIP;0.018nF,5%,50V,C0G,1005 1 SNA C599 ..4 2203-000425 C-CER C-CER,CHIP;0.018nF,5%,50V,C0G,1005 1 SNA C549 ..4 2203-000438 C-CER C-CER,CHIP;1nF,10%,50V,X7R,1005 1 SNA C555 ..4 2203-000438 C-CER C-CER,CHIP;1nF,10%,50V,X7R,1005 1 SNA...
  • Page 139 Location Level SEC Code Name Description Qt'y SA/SNA Option C806 ..4 2203-000940 C-CER C-CER,CHIP;0.47nF,10%,50V,X7R,1005 1 SNA C807 ..4 2203-000940 C-CER C-CER,CHIP;0.47nF,10%,50V,X7R,1005 1 SNA C824 ..4 2203-000940 C-CER C-CER,CHIP;0.47nF,10%,50V,X7R,1005 1 SNA C605 ..4 2203-000995 C-CER C-CER,CHIP;0.047nF,5%,50V,C0G,1005 1 SNA C645 ..4 2203-000995 C-CER C-CER,CHIP;0.047nF,5%,50V,C0G,1005 1 SNA...
  • Page 140 Location Level SEC Code Name Description Qt'y SA/SNA Option C601 ..4 2203-002709 C-CER C-CER,CHIP;100nF,+80-20%,16V,Y5V,1005 1 SNA C679 ..4 2203-002709 C-CER C-CER,CHIP;100nF,+80-20%,16V,Y5V,1005 1 SNA C696 ..4 2203-002709 C-CER C-CER,CHIP;100nF,+80-20%,16V,Y5V,1005 1 SNA C703 ..4 2203-002709 C-CER C-CER,CHIP;100nF,+80-20%,16V,Y5V,1005 1 SNA C704 ..4 2203-002709 C-CER C-CER,CHIP;100nF,+80-20%,16V,Y5V,1005 1 SNA...
  • Page 141 Location Level SEC Code Name Description Qt'y SA/SNA Option C557 ..4 2203-002720 C-CER C-CER,CHIP;10nF,10%,25V,X7R,1005 1 SNA C558 ..4 2203-002720 C-CER C-CER,CHIP;10nF,10%,25V,X7R,1005 1 SNA C636 ..4 2203-002720 C-CER C-CER,CHIP;10nF,10%,25V,X7R,1005 1 SNA C713 ..4 2203-002720 C-CER C-CER,CHIP;10nF,10%,25V,X7R,1005 1 SNA NB8M C714 ..4 2203-002720 C-CER C-CER,CHIP;10nF,10%,25V,X7R,1005...
  • Page 142 Location Level SEC Code Name Description Qt'y SA/SNA Option C276 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C277 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C278 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C279 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C500 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA...
  • Page 143 Location Level SEC Code Name Description Qt'y SA/SNA Option C586 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C587 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C588 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C589 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C590 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA...
  • Page 144 Location Level SEC Code Name Description Qt'y SA/SNA Option C640 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C641 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C642 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C643 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C644 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA...
  • Page 145 Location Level SEC Code Name Description Qt'y SA/SNA Option C769 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C770 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C771 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C775 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C776 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA...
  • Page 146 Location Level SEC Code Name Description Qt'y SA/SNA Option C840 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C841 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C842 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C843 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA C850 ..4 2203-006048 C-CER C-CER,CHIP;100nF,10%,10V,X7R,1005 1 SA...
  • Page 147 Location Level SEC Code Name Description Qt'y SA/SNA Option C853 ..4 2203-006090 C-CER C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 1 SA C861 ..4 2203-006090 C-CER C-CER,CHIP;10000nF,10%,6.3V,X5R,2012 1 SA C521 ..4 2203-006093 C-CER C-CER,CHIP;1000nF,+80-20%,6.3V,Y5V,1005 1 SA NB8M C530 ..4 2203-006093 C-CER C-CER,CHIP;1000nF,+80-20%,6.3V,Y5V,1005 1 SA C559 ..4 2203-006093 C-CER C-CER,CHIP;1000nF,+80-20%,6.3V,Y5V,1005...
  • Page 148 Location Level SEC Code Name Description Qt'y SA/SNA Option C849 ..4 2203-006324 C-CER C-CER,CHIP;2200nF,10%,10V,X5R,1608 1 SNA C681 ..4 2203-006348 C-CER C-CER,CHIP;1000nF,10%,25V,X5R,1608 1 SNA C882 ..4 2203-006348 C-CER C-CER,CHIP;1000nF,10%,25V,X5R,1608 1 SNA C885 ..4 2203-006348 C-CER C-CER,CHIP;1000nF,10%,25V,X5R,1608 1 SNA C936 ..4 2203-006348 C-CER C-CER,CHIP;1000nF,10%,25V,X5R,1608 1 SNA...
  • Page 149 Location Level SEC Code Name Description Qt'y SA/SNA Option B516 ..4 3301-000314 BEAD-SMD BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- 1 SA B519 ..4 3301-000314 BEAD-SMD BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- 1 SA B520 ..4 3301-000314 BEAD-SMD BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- 1 SA B524 ..4 3301-000314 BEAD-SMD BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,- 1 SA B508 ..4 3301-001066 BEAD-SMD BEAD-SMD;600ohm,1608,210mA,TP,,,80000ohm 1 SNA...
  • Page 150 Location Level SEC Code Name Description Qt'y SA/SNA Option J507 ..4 3709-001413 CONNECTOR CONNECTOR-CARD EDGE;44P,0.8mm,SMD-A,AU,4IN1 1 SA J502 ..4 3710-002133 SOCKET SOCKET-BOARD TO BOARD;12P,2R,0.8mm,SMD-A,SN,NTR 1 SA ODD500 ..4 3710-002314 SOCKET SOCKET-BOARD TO BOARD;50P,2R,0.8mm,ANGLE,AU10U,BLK 1 SA J504 ..4 3711-000541 CONNECTOR HEADER-BOARD TO CABLE;BOX,2P,1R,1.25mm,SMD-A,SN,NTR 1 SA DEBUG500 ..4...
  • Page 151 - This Document can not be used without Samsung's authorization - 1. Precautions 1) General After-Sales Service Precautions (1) Do not let customers repair the product themselves. ☞ There is a danger of injury and the product life time may be shortened.
  • Page 152 - This Document can not be used without Samsung's authorization - 1. Precautions 2) Safety Precautions (1) EMI This device has been registered regarding EMI for residential use. It can be used in all areas. (2) Circuit Test (Logic Test) Precautions The LSI and MSI used in this product are semiconductor integrated circuits based on MOS-FET or CMOS.
  • Page 153 - This Document can not be used without Samsung's authorization - 1. Precautions 3) Ground The product must be grounded to protect it from static electricity and other dangers. When using a multitap, please use a multitap with a ground terminal only.

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