Table of Contents
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Chapter 1. Introduction
1.1 General
This manual gives the information needed by the Product
Customer Engineer to maintain the 3274 Control Unit
Models 51 C and 52C. This information includes:
• Subsystem Problem Isolation Procedure
• Maintenance Analysis Procedures (MAPs)
• Removal and Replacement Procedures
• Communication Reference Information
Entry into, and use of, the MAPs and Maintenance Proced-
ures should result ollly from performing the sequential
steps of the Subsystem Problem Isolation Procedure.
This manual also supplies:
• Illustrations
• 31 SD Diskette Drive Maintenance
• 51 TD Diskette Drive Maintenance
In most cases, the information supplied isolates a
problem to a defective or loose field replaceable unit
(FRU), cable, or connector. If the problem cannot be
isolated and repaired by performing the Subsystem Problem
Isolation Procedure and associated MAPs and Maintenance
Procedures, request assistance from the next level of the
support structure.
1.2 l"'Iaintenance Approach
The maintenance approach to 3274 problems is illustrated
in Figure 1-1. This approach involves performing the
following sequential steps of the Subsystem Problem
Isolation Procedure:
Step 1 - Obtain the
3274
Problem Report Form from the
operator. This form is used by the operator to record the
status (indications) of the 3274 when a problem is encount-
ered. If the form has not been completed, perform the
procedure described in the Problem Detenninatioll Guide
(PDG), GA27-2850, and record the necessary information.
Steps 2 through 9 - Steps 2 through 9 must be performed
sequentially. If the problem is encountered by these steps,
you will be directed to an FRU replacement figure (chart),
a MAP, or a maintenance procedure. When the problem has
been isolated and repaired, the Machine Checkout MAP
AIOO must be used to verify correct operation. Steps 2
through 9 include the following tests and checks:
• Step 2 - Verification that the DC Power light is on
• Step 3 - Bus Test
• Step 4 - Internal tests/IML load
• Step 5 - Device driver/receiver check
• Step 6 - Display symbol/error suffix check
• Step 7 - Operational indicator check
• Step 8 - Host tests
• Step 9 - Voltage checks
Step 10 - If the problem was not encountered by Steps
2 through 9, this step directs you to repeat Steps 2 through
9. If the problem is not encountered while Steps 2 through
9 are being repeated, Step 11 is performed.
Step 11 - Step 11 first directs you to the Symptom Repair
List. If this list does not assist you in isolating and repairing
the problem, Step 11 directs you to request assistance.
This assistance should be the support structure and/or local
assistance, which may consist of data searches, diagnostic
assistance, and/or on-site assistance.
The first step will normally be a data search, if available.
Diagnostic assistance may be performed by the support
structure and/or locally. The method used should be that
which will resolve the problem most rapidly.
Initial on-site assistance will usually be local.
Step 11
Repeat
Steps 2
through
9 once.
Problem
cannot be
isolated.
Symptom Repair
List/Request
Assistance
Service Call
Steps 2 through 9
Perform Subsystem
Problem Isolation
Procedure
Step 10
•
MAP
•
Maintenance
Procedures
Figure 1-1. Maintenance Approach
Problem
isolated
and repaired.
End of Call
Chapter 1. Introduction
l-J
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