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General RF troubleshooting
Introduction to RF troubleshooting
Most RF semiconductors are static discharge sensitive
ESD protection must be applied during repair (ground straps and ESD soldering irons).
Pre-baking (TBD)
These parts are moisture sensitive and must be pre-baked prior to soldering:
RFIC xxxx
PA xxxx
Discrete components
In addition to the key-components, there are a number of discrete components (resistors, inductors and
capacitors) for which troubleshooting is done mainly by visual inspection .
Capacitors: check for short circuits.
Resistors: check value with an ohm meter.
Note:
In-circuit measurements should be evaluated carefully
Measuring equipment
All measurements should be done using:
An oscilloscope for low frequency and DC measurements. Recommended probe: 10:1, 10Mohm//8pF.Title of
the Document + Issue Number/Date of publication
A radio communication tester including RF generator and spectrum analyser, for example Rohde & Schwarz
CMU200. (Alternatively a spectrum analyser and an RF generator can be used. Some tests in this guide are not
possible to perform if this solution is chosen).
Note:
All measurements with an RF coupler should be performed in an RF-shielded environment because
nearby base stations can disturb sensitive receiver measurements. If there is no possibility to use RF
shielded environment, testing at frequencies of nearby base stations should be avoided.
Level of repair
The scope of this guideline is to enable repairs at key-component level. Some key-components are not
accessible, i.e. not replaceable. Please refer to the list of
General information on RF troubleshooting
Page 4-2
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Copyright © 2008 Nokia. All rights reserved.
Non-replaceable RF
components.
RM-376
RF Troubleshooting
Issue1
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Troubleshooting
