XR-F5100EE
TABLE OF CONTENTS
......................................................... 2
1.
2.
2-4. MAIN Board ................................................................... 9
3.
3-1. Assembly Flow ................................................................ 10
3-2. Housing ........................................................................... 11
3-6. Guide (C) ......................................................................... 13
4.
5.
Tuner Section .................................................................. 15
6.
6-5. Schematic Diagram - MAIN Board (2/3) - .................. 20
7.
8.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
2
SERVICE POSITION
In checking the display board and main board, prepare two jigs
connection cable for F/P to main J-2502-071-1).
....................... 14
DISPLAY board
(CN901)
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
............................... 30
(Caution: Some printed circuit boards may not come printed with
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
• Strong viscosity
• Usable with ordinary solder
SERVICING NOTES
MAIN board
SUB board
(CNP801)
sub panel
assy
the lead free mark due to their particular size)
: LEAD FREE MARK
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
MAIN board (CN351)
mechanism deck
connect jig
(connection cable J-2502-066-2)
to the MAIN board (CN351) and
mechanism deck.
connect jig
(connection cable
for F/P to MAIN J-2502-071-1)
to the DISPLAY board (CN901) and
SUB board (CNP801).