LG -A100 Service Manual page 15

3. TECHNICAL BRIEF
3.1.1 General
Technology:
– SoC, Monolithic, 65 nm CMOS
• Package:
– WFWLB, 8x8x0.8 mm
– 0.5 mm pitch
– 217 balls
3.1.2 RF Transceiver
• Dual-band direct conversion receiver
• Tri/Quad-band possible with external circuitry
• Fully integrated digital controlled X0
• Additional buffer for 2 external system clocks
• Fully digital RF-Synthesizer incl. -Transmitter
3.1.3 Baseband
• High performance fixed-point TEAKlite DSP
• C166S-V2 high performance microcontroller with a 16KB Instruction Cache and a Data cache Buffer.
• FM Stereo Radio Receiver with RDS
• There are several Interfaces:
– I2S interface for DAI connections (for Tape Approval) and external Audio component connection.
– High Speed SSC Interface for connection of companion chips (like Serial SD Cards)
– High Speed SSC Interface dedicated to Display control
– USIM Interface with support of Protocol T=1 and Dual USIM support.
– Keypad Interface (6x4 or 5x5 keys)
– External Memory Controller (EBU) for external RAM/NOR FLASH/Busrt Flash/NAND Flash/Serial Flash
(SPI/SQI) and Parallel Display connection
– Asynchronous serial interface.
– Asynchronous serial interface for WLAN/BT/GPS control (incl. IrDA support capability) .
– JTAG Interface, OCDS, Multi-Core Debug and Real Time Trace facilities.
– Black & white and 128x160 - 16bit color displays are supported
– PWM source to drive vibrator
– Keypad and display backlight supported.
– HASH Unit support for hashing.
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