<Rest switch board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
SW1
No.MA465
(No.MA465<Rev.003>)37/37
created date:2010-08-05