Service MD110 / F1S, /N1S Manual MD Deck STANDBY OPEN MD110 STANDBY OPEN SOURCE DISPLAY REC MODE DUBB. MULTI JOG PUSH ENTER CHARACTER EDIT TABLE OF CONTENTS SECTION PAGE 1. TECHNICAL SPECIFICATIONS ................1 2. SERVICE MODE ....................2 3. WIRING DIAGRAM ....................9 4.
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MARANTZ Parts for your equipment are generally available to our National Marantz Subsidiary or Agent. ORDERING PARTS : Parts can be ordered either by mail or by Fax.. In both cases, the correct part number has to be specified.
1. TECHNICAL SPECIFICATIONS MAIN UNIT (MD110) Type ........................... MiniDisc Digital Audio System Laser ............................Semiconductor laser Recording method ................Magnetic field modulation overwrite method RPMs ......................Approximately 400rpm to 900rpm (CLV) Sampling frequency ............................. 44.1 kHz Frequency characteristics ......................20 to 20 kHz (± 1 dB) S/N ..............................
2. SERVICE MODE Service Mode 1. While Mains cord is disconnected, press DISPLAY Button on the unit and plug in the Mains cord. 2. Version number of the front micom software is displayed. 3. Turn JOG dial to either direction then Display segment test begins. 4.
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TEST MODE 1 How to Setting and Cancel Test Mode Setting: While pressing the PLAY/PAUSE keys, insert the power cord to the wall outlet. Cancel: Pull out the power cord. Key Operation for Adjustment Operation MULTI JOG Select parameter and mode. PLAY Fix items.
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2. Change of Playback Points (In continuous playback mode) Display/Function PL AY [CPLAY OUT] Carry out No.4 and 5 in the above table PL AY [CPLAY IN] Carry out No.4 and 5 in the above table ST OP [CPLAY MODE] EJECT Disc out 5 Continuous Recording Mode 1.
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2 Precaution on handling of Optical pick-up (KMS-260B) The laser diode in an optical pick-up is easy to be subject to electrostatic destruction. Therefore, solder-bridge the laser tap on the flexible board when handling the optical pick-up. When removing the flexible board from the connector, make a solder bridge in advance, then remove the board. Be careful not to remove the solder bridge before inserting the connector.
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6 Laser Power Check and Adjustment Laser power setting in playback and recording modes. Preparation 1. Remove the MD mechanism from the unit 2. Remove the case and bracket. 3. Reconnect the flat cable of MD mechanism to the unit 1.
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FE Balance 1. Recordable Disc Display/Function Connect the oscilloscope to TE1 and VC in X33 PCB MULTI JOG Select [EFBAL ADJUST] Load the recordable disc PL AY [EFBAL MO-W] PL AY [EF=$**MOW] MULTI JOG Write adjustment. Adjust the waveform as follows. PLAY Display shows [EF=$**MOR] after [EFB=**xSAVE] to save the data in E2PROM.
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8 Focus Bias Adjustment Use the special disc (continuous recorded disc) Display/Function MULTI JOG Select [FBIAS ADJUST] Load the disc. PLAY [a=xx yyyy/zz] point a (xx = focus bias yyyy = C1error) Adjust "yyyy" to 220* PLAY [b=xx yyyy/zz] point b DOWN Adjust "yyyy"...
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IC300:M66005F PIN CONFIGURATION PIN DESCRIPTIONS Symbol Comment Pin name Reset input When "L", M66005 is initialized. RESET When "L", communication with the MCU is possible. Chip select input When "H", any instruction from the MCU is neglected. Shift clock input Serial input data is taken and shifted by the positive edge of SCK.
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IC13:74HC04 PIN DESCRIPTION PIN NO. SYMBOL NAME AND FUNCTION 1, 3, 5, 9, 11, 13 1A to 6A data inputs 2, 4, 6, 8, 10, 12 1Y to 6Y data outputs ground (0 V) positive supply voltage Fig.5 Schematic diagram Fig.1 Pin configuration.
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IC6:CXP84648 PIN NO PIN NAME OPERATION DESCRIPTION ASSIGN PIN ASSIGNMENT A_MUTE OUTPUT A_MUTE ACTIVE LOW D_MUTE OUTPUT D_MUTE ACTIVE LOW PO_OFF_CONT OUTPUT FOR RLY ACTIVE HIGH BACKUP_V RESET INPUT CPU ACTIVE HIGH EXTAL OUTPUT FOR 12.288MHZ CRYSTAL XTAL 12.288MHZ CRYSTAL 32MHZ CRYSTAL OUTPUT FOR 32MHZ CRYSTAL AVSS...
9. ELECTRICAL PARTS LIST NOTE ON SAFETY FOR FUSIBLE RESISTOR : ASSIGNMENT OF COMMON PARTS CODES. RESISTORS The suppliers and their type numbers of fusible resistors : 1) GD05 × × × 140, Carbon film fixed resistor, ±5% 1/4W are as follows; : 2) GD05 ×...
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9965 000 11128 DOUBLE LAYER(70), *EX000090R CHIP,10K-J,1/16W-1608REEL 0.047F-70UA/5.5V-5RE R71L CHIP,680-J,1/16W-1608REEL ELECT,47µF-M/16V,5x11-5RE R71R CHIP,680-J,1/16W-1608REEL CER.CHIP,0.1µF-K/50V-1608 1-J,1/4W-R.TYPE REEL CER.CHIP,18pF-J/50V-1608 CHIP,47K-J,1/16W-1608REEL CER.CHIP,18pF-J/50V-1608 CHIP,2.2K-J,1/16W-1608REEL 1-J,1/4W-R.TYPE REEL MAIN - RESISTORS CHIP,3.3K-J,1/16W-1608REEL CHIP,3.3K-J,1/16W-1608REEL NOTE : "nsp" PART IS LISTED FOR REFERENCE ONLY, MARANTZ WILL NOT SUPPLY THESE PARTS.
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9965 000 11423 CRYSTAL,12.288MHZ, *JX000890R 4822 130 60729 CHIP TRS.2SC, *BA001040R HC49U-CL;20pF DTC144EK,0.2W/SMT-REEL XTAL2 9965 000 11124 CRYSTAL,MX-38T(32.768KHZ) *JX000830R 9965 000 10753 CHIP TRS.2SC, *BA001220R KRC102S T/P (KEC) NOTE : "nsp" PART IS LISTED FOR REFERENCE ONLY, MARANTZ WILL NOT SUPPLY THESE PARTS.
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4822 130 60941 CHIP TRS.2SA,DTA114EK, BA10023210 CHIP,100-J,1/16W-1608REEL 0.2W/SMT-REEL CHIP,1.5K-J,1/16W-1608REEL Q306 9965 000 11131 CHIP TRS.2SC,KRC104S (SOP) *BA001290R CHIP,1.5K-J,1/16W-1608REEL Q307 9965 000 10753 CHIP TRS.2SC,KRC102S T/P *BA001220R (KEC) NOTE : "nsp" PART IS LISTED FOR REFERENCE ONLY, MARANTZ WILL NOT SUPPLY THESE PARTS.
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5322 209 13406 IC,NJM2068MD-SOP8P *HC107380R REC - MISCELLANEOUS BKT1 BRACKET,AVR3300(E3) (DENON) SPTE 0.8t/SCREW BKT2 BRACKET,AVR3300(E3) (DENON) SPTE 0.8t/SCREW CN.WAFER 2.0MM, 35237-1010 10P CN.WAFER 2.0MM, 35237-0510 5P CHIP,0-J,1/8W-3216REEL J109 NOTE : "nsp" PART IS LISTED FOR REFERENCE ONLY, MARANTZ WILL NOT SUPPLY THESE PARTS.