Samsung ML-4500/XEV Service Manual page 78

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0202-000108
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0204-001068
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0401-000116
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0404-000112
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0501-000338
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0801-001090
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0803-001392
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0803-003058
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1103-000133
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1105-001213
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1107-001209
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3
1202-000164
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1203-001026
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2007-000026
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2007-000029
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2007-000221
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2007-000290
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2007-000290
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2007-000300
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2007-000300
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2007-000300
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2007-000401
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2007-000468
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2007-000468
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2007-000477
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2007-000671
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2007-000774
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2007-000781
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2007-000781
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3
2007-000859
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3
2007-000872
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3
2007-000964
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3
2007-000981
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3
2007-001133
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3
2203-000192
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3
2203-000192
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3
2203-000192
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3
2203-000192
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2203-000192
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2203-000239
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2203-000260
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2203-000260
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2203-000455
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2203-000455
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2203-000455
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2203-000595
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2203-000634
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2203-000818
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2203-000938
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2203-001223
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2402-000135
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2404-000468
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2901-001178
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3301-000317
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JB13-00003A
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JC41-00072A
SOLDER-CREAM;RMA-010 T-322,S63,-,-
BONDERITE;#3609,-,-,10cc/30cc
DIODE-SWITCHING;MMSD914T1,100V,200mA,225
DIODE-SCHOTTKY;RB420D,25V,100mA,SOT-23,T
TR-SMALL SIGNAL;KSC1623,NPN,60V,50V,150m
IC-CMOS LOGIC;74HC14,SCHIMITT INVERTER,S
IC-TTL;7406,BUFFER/DRIVER,SOP,14P,300
IC-TTL;74F1071,ESD,SOP,20P,-,-,TP,PLA
IC-EEPROM;93C66,256K*16BIT,SOP,8P,150MIL
IC-DRAM;416C1204,1Mx16BIT,SOJ,42P,400M
IC-FLASH MEMORY;29F400,512Kx8/256Kx16Bit
IC-VOLTAGE COMP.;393,SOP,8P,150MIL,DUAL,
IC-POSI.FIXED REG.;33269,DPAK,3P,265MIL,
R-CHIP;200OHM,5%,1/10W,R,TP,+-250PP
R-CHIP;0ohm,5%,1/10W,DA,TP,2012
R-CHIP;1.2Kohm,5%,1/10W,DA,TP,2012
R-CHIP;100ohm,5%,1/10W,DA,TP,2012
R-CHIP;100ohm,5%,1/10W,DA,TP,2012
R-CHIP;10Kohm,5%,1/10W,DA,TP,2012
R-CHIP;10Kohm,5%,1/10W,DA,TP,2012
R-CHIP;10Kohm,5%,1/10W,DA,TP,2012
R-CHIP;150ohm,5%,1/10W,DA,TP,2012
R-CHIP;1Kohm,5%,1/10W,DA,TP,2012
R-CHIP;1Kohm,5%,1/10W,DA,TP,2012
R-CHIP;1Mohm,5%,1/10W,DA,TP,2012
R-CHIP;2Kohm,5%,1/10W,DA,TP,2012
R-CHIP;33Kohm,5%,1/10W,DA,TP,2012
R-CHIP;33ohm,5%,1/10W,DA,TP,2012
R-CHIP;33ohm,5%,1/10W,DA,TP,2012
R-CHIP;4.3Kohm,5%,1/10W,DA,TP,2012
R-CHIP;4.7Kohm,5%,1/10W,DA,TP,2012
R-CHIP;5.1Kohm,5%,1/10W,DA,TP,2012
R-CHIP;5.6Kohm,5%,1/10W,DA,TP,2012
R-CHIP;68ohm,5%,1/10W,DA,TP,2012
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,201
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,201
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,201
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,201
C-CERAMIC,CHIP;100nF,+80-20%,50V,Y5V,201
C-CERAMIC,CHIP;100pF,5%,50V,NPO,2012,-,T
C-CERAMIC,CHIP;10nF,10%,50V,X7R,2012,-,T
C-CERAMIC,CHIP;10nF,10%,50V,X7R,2012,-,T
C-CERAMIC,CHIP;1nF,5%,50V,NPO,2012,-,TP
C-CERAMIC,CHIP;1nF,5%,50V,NPO,2012,-,TP
C-CERAMIC,CHIP;1nF,5%,50V,NPO,2012,-,TP
C-CERAMIC,CHIP;220pF,5%,50V,NPO,2012,-,T
C-CERAMIC,CHIP;22pF,5%,50V,NPO,2012,-,TP
C-CERAMIC,CHIP;33pF,5%,50V,NPO,2012,-,TP
C-CERAMIC,CHIP;470pF,10%,50V,NPO,2012,-,
C-CERAMIC,CHIP;820pF,10%,50V,X7R,2012,2.
C-AL,SMD;22uF,20%,16V,-,5.3x5.3x5.2mm,-
C-TA,CHIP;33uF,20%,16V,GP,TP,7343,-
FILTER-EMI SMD;25V,2A,-,100000pF,2x1.25x
CORE-FERRITE BEAD;AB,2x1.25x0.9mm,-,-
IC ASIC-CHORUS;SF-3100,KS32C65100,QFP,20
PCB-MAIN;ML-4500,FR-4,2L,1.6T,168x103mm

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