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2•1
INTRODUCTION
This chapter provides unpacking instructions, hardware preparation, and installation instructions
for the
.
MSC8101ADS
2•2
UNPACKING INSTRUCTIONS
If the shipping carton is damaged upon
receipt, request carrier's agent to be
present during unpacking and inspection of
equipment.
Unpack equipment from shipping carton. Refer to packing list and verify that all items are present.
Save packing material for storing and reshipping of equipment.
AVOID
INTEGRATED
DISCHARGE CAN DAMAGE CIRCUITS.
2•3
HARDWARE PREPARATION
To select the desired configuration and ensure proper operation of the MSC8101-ADS board,
changes of the DIP-Switch settings may be required before installation. The location of the
switches, indicators, DIP-Switches, and connectors is illustrated in
Top Side Part Location diagram" on page
with DIP-Switch settings as described in the following paragraphs. Parameters can be changed for
the following conditions:
•
The Processor Internal Logic and PLLs Supply Level (1.6V) via potentiometer RP2.
•
The Processor I/O Supply Voltage (3.3V) via potentiometer RP1 (be careful since this
power supply feeds another logic devices on the ADS and tool boards).
•
The Processor Clocking:
MODCK(1:3). Determining Core's and CPM's PLLs multiplication factor via the
o
DIP Switch SW9.
MODCKH(4:6) for the Flash Memory Config. Word/Host Config Word (Power-On
o
Reset Source Dependent) or from the DIP Switch SW9 for FPGA Config. Setting
(Safe Mode).
Clock mode update requires power up operation.
o
•
Hard Reset Configuration Word source is selected by the DIP Switch SW9/7.
•
Normal (64-bit wide) or Narrow (32-bit wide) Data bus width for Host I/F mode is
selected by the DIP Switches SW5,6.
16
Freescale Semiconductor, Inc.
Hardware Preparation
2 - Hardware Preparation
NOTE
CAUTION
TOUCHING
CIRCUITRY;
17. The board has been factory tested and is shipped
MSC8101ADS RevB User's Manual
For More Information On This Product,
Go to: www.freescale.com
AREAS
OF
STATIC
FIGURE 2-1 "MSC8101-ADS
MOTOROLA
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