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HCD-GP8D
Q Q
7-7. PRINTED WIRING BOARD — FRONT SECTION —
3 7 6 3 1 5 1 5 0
1
2
3
A
B
C
FRONT BOARD
D
E
E
TAPE
MECHANISM
E
DECK
T E
F
L
1 3 9 4 2 2 9 6 5 1 3
G
bB
H
I
.m
–
J
VOLUME–
K
w w w
L
HCD-GP8D
• See page 17 for Circuit Boards Location.
4
5
6
7
HP/MIC BOARD
MIC
4
G
MAIN
1
BOARD
CN401
(Page 18)
K
AMP
BOARD
CN101(Page 29)
?/1
IR651
BX
M>
+
VOLUME+
x
a o
Z
.
i
http://www.xiaoyu163.com
:Uses unleaded solder.
8
9
10
11
HP/MIC BOARD
PHONES
FRONT BOARD
Q
Q
3
7
6
IC651
u 1 6 3
y
A
MAIN
BOARD
CN501
(Page 18)
24
24
http://www.xiaoyu163.com
2
4
8
9
9
12
13
14
3
1
5
1
5
0
8
9
2
m
c o
.
2
8
9
9
15
16
• Semiconductor
Location
Ref. No.
Location
D113
B-9
D114
B-10
D205
B-11
D206
B-11
D651
E-4
D652
D-5
D654
E-4
IC651
G-10
IR651
E-5
Q651
E-3
Q652
F-14
Q653
E-3
Q654
E-14
4
9
8
2
9
9
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