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HCD-LF1H
Ver. 1.1
Q Q
6-15. PRINTED WIRING BOARD — MAIN BOARD (SIDE B) —
3 7 6 3 1 5 1 5 0
11
10
MAIN BOARD (SIDE B)
(CHASSIS)
JW602
EP102
L131
C117
T E
L
1 3 9 4 2 2 9 6 5 1 3
R121
JW601
EP101
(CHASSIS)
• Semiconductor Location
Ref. No.
Location
Ref. No.
w w w
D101
C-9
IC101
D111
D-9
IC102
D121
D-9
IC103
D131
C-7
IC104
D141
F-8
IC105
D301
E-4
IC601
D501
E-6
D502
E-6
Q305
HCD-LF1H
• See page 27 for Circuit Boards Location.
9
8
7
L112
L132
L133
C102
C107
C103
L101
C133
R101
C134
EXCEPT AEP, UK, RU
L111
R114
C113
R111
L121
C128
L122
L114
C143
L104
D141
Location
C-9
D-9
x
a o
D-9
y
D-7
F-8
.
i
D-7
C-3
http://www.xiaoyu163.com
:Uses unleaded solder.
6
5
R565
R555
R566
R556
R567
R557
R568
R569
R558
R559
R585
R586
R545
R535
R546
R547
R536
R537
Q
Q
R548
IC601
3
7
6
R538
R549
R539
R583
R584
R525
R515
R526
R527
R516
R517
R610
R528
R518
EXCEPT AEP, UK, RU
R529
R519
R582
R581
C620
R407
R401
R617
R402
u 1 6 3
.
42
42
http://www.xiaoyu163.com
2
4
8
9
9
4
3
R425
CLP305
R424
C362
EP302
Q305
E
R304
R314
C301
R312
R344
R303
R343
C302
R319
R342
R321
R325
3
1
5
1
5
0
8
9
2
C351
R329
R410
R336
R337
R338
R356
R357
R330
R404
R405
R403
m
c o
2
8
9
9
2
1
A
B
(CHASSIS)
C
D
4
9
8
2
9
9
E
F
EP301
(CHASSIS)
G
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