Note For Printed Wiring Boards And Schematic Diagrams - Sony NW-S4 Service Manual

NW-S4
4-2.

NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : internal component.
f
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• MAIN and SUB boards are multi-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in this diagrams.
* Lead Layouts (IC601 and IC901)
surface
Lead layout of conventional IC CSP (chip size package)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
• % : indicates tolerance.
• f : internal component.
• C : panel designation.
• A : B+ Line.
• Power voltage is dc 1.5 V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground in
playback mode.
no mark : PLAYBACK
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Signal path.
F
: PLAYBACK
* The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
• Waveforms
– MAIN Board –
1 IC901 6 (XIN) (When power on)
50 mV/DIV, 50 ns/DIV
3 Vp-p
20.8 ns
2 IC601 rk (BCLKX0)
2 V/DIV, 500 ns/DIV
3.4 Vp-p
710 ns
3 IC601 td (BFSX0)
1 V/DIV, 5 µs/DIV
3.4 Vp-p
22.7 µ s
4 IC601 ua (BCLKX1)
2 V/DIV, 50 ns/DIV
3.2 Vp-p
59.1 ns
5 IC601 oj (X2/CLKIN)
200 mV/DIV, 50 ns/DIV
1.2 Vp-p
59.1 ns
14 14
– SUB Board –
6 IC801 2 (X1) 0 IC302 1 (LRCK)
500 mV/DIV, 20 µs/DIV 1 V/DIV, 5 µs/DIV
1.8 Vp-p
30.5 µ s
7 IC801 5 (OSC2) (When power on) qa IC302 3 (SCLK)
100 mV/DIV, 200 ns/DIV 2 V/DIV, 500 ns/DIV
3.2 Vp-p
125 ns
8 IC401 7 (LX) qs IC302 5 (MCLK)
1 V/DIV, 2 µs/DIV
2 V/DIV, 50 ns/DIV
4.1 Vp-p
6.6 µ s
9 IC404 9 (LX)
1 V/DIV, 2 µs/DIV
4.1 Vp-p
3.5 µ s
3.4 Vp-p
22.7 µ s
3.4 Vp-p
710 ns
3.2 Vp-p
59.1 ns