QQ
3 7 63 1515 0
3-6. ELECTRICAL PARTS LIST
NOTE:
• Due to standardization, replacements in the
parts list may be different from the parts speci-
fied in the diagrams or the components used
on the set.
• -XX and -X mean standardized parts, so they
may have some difference from the original one.
• RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
Ref. No.
Part No.
1-664-631-13 JACK BOARD
*
C901
1-163-009-11 CERAMIC CHIP
C902
1-163-038-00 CERAMIC CHIP
C903
1-163-009-11 CERAMIC CHIP
C903
1-163-038-00 CERAMIC CHIP
C905
1-162-302-11 CERAMIC
TE
L 13942296513
CN901
1-779-077-11 PLUG, CONNECTOR (SONY BUS/AUDIO OUT)
CN901
1-779-077-21 PLUG, CONNECTOR (SONY BUS/AUDIO OUT)
CNJ901 1-778-775-21 CONNECTOR, FPC 13P
FB901
1-500-445-21 INDUCTOR
FB902
1-500-445-21 INDUCTOR
FB903
1-500-445-21 INDUCTOR
IC901
1-532-686-21 LINK, IC
************************************************************
A-3313-212-A MAIN BOARD, COMPLETE
*
A-3313-223-A MAIN BOARD, COMPLETE
*
3-012-099-01 HOLDER (TR2)
*
3-016-116-01 TAPE (D), MOUNT (CDX-705: US, CND/EXCD-3)
*
www
C01
1-162-302-11 CERAMIC
.
http://www.xiaoyu163.com
• Items marked "*" are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when order-
ing these items.
• SEMICONDUCTORS
In each case, u: µ, for example:
uA. . : µA. .
uPB. . : µPB. .
uPD. . : µPD. .
• CAPACITORS
uF: µF
• COILS
uH: µH
Description
**********
< CAPACITOR >
0.001uF 10%
0.1uF
0.001uF 10%
(CDX-705: US, CND/EXCD-3)
0.1uF
(CDX-705: AEP, UK, G, E, TW)
0.0022uF 30%
(CDX-705: AEP, UK, G, E, TW)
< CONNECTOR >
< FERRITE BEAD >
0uH
0uH
0uH
< IC LINK >
(CDX-705: AEP, UK, G, E, TW)
(CDX-705: US, CND/EXCD-3)
********************
< CAPACITOR >
0.0022uF 30%
x
ao
u163
y
(CDX-705: US, CND/EXCD-3)
i
http://www.xiaoyu163.com
2 9
8
uPA. . : µPA. .
uPC. . : µPC. .
Remark
Ref. No.
Part No.
C02
1-162-286-21 CERAMIC
C101
1-163-038-00 CERAMIC CHIP
C102
1-163-251-11 CERAMIC CHIP
C103
1-163-011-11 CERAMIC CHIP
50V
C104
1-163-809-11 CERAMIC CHIP
25V
C105
1-164-004-11 CERAMIC CHIP
50V
C106
1-164-182-11 CERAMIC CHIP
C107
1-164-232-11 CERAMIC CHIP
25V
C108
1-163-038-00 CERAMIC CHIP
Q Q
16V
C109
1-126-513-11 ELECT
3
6 7
1 3
1 5
C110
1-163-038-00 CERAMIC CHIP
C111
1-163-038-00 CERAMIC CHIP
C120
1-163-038-00 CERAMIC CHIP
C121
1-163-038-00 CERAMIC CHIP
(CDX-705)
C122
1-163-038-00 CERAMIC CHIP
C123
1-163-038-00 CERAMIC CHIP
(EXCD-3)
C124
1-163-038-00 CERAMIC CHIP
C125
1-163-009-11 CERAMIC CHIP
C201
1-124-589-11 ELECT
C202
1-126-513-11 ELECT
C203
1-163-038-00 CERAMIC CHIP
C204
1-115-466-00 ELECT
C205
1-163-038-00 CERAMIC CHIP
C206
1-124-589-11 ELECT
C207
1-124-589-11 ELECT
C208
1-164-346-11 CERAMIC CHIP
C209
1-124-589-11 ELECT
C210
1-125-701-11 CAPACITOR
C211
1-163-038-00 CERAMIC CHIP
C212
1-164-346-11 CERAMIC CHIP
C213
1-164-346-11 CERAMIC CHIP
C214
1-163-038-00 CERAMIC CHIP
C302
1-163-038-00 CERAMIC CHIP
C303
1-126-513-11 ELECT
C304
1-163-038-00 CERAMIC CHIP
C305
1-163-038-00 CERAMIC CHIP
C306
1-163-038-00 CERAMIC CHIP
16V
C307
1-163-038-00 CERAMIC CHIP
co
C308
1-163-038-00 CERAMIC CHIP
.
– 21 –
9 4
2 8
JACK
When indicating parts by reference
number, please include the board.
Description
220PF
10%
(CDX-705: US, CND/EXCD-3)
0.1uF
100PF
5%
0.0015uF 10%
0.047uF 10%
0.1uF
10%
0.0033uF 10%
0.01uF
0.1uF
47uF
20%
0 5
8
2 9
9 4
2 8
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
0.001uF 10%
47uF
20%
47uF
20%
0.1uF
1000uF 20%
0.1uF
47uF
20%
47uF
20%
1uF
47uF
20%
0.047F
0.1uF
1uF
1uF
0.1uF
0.1uF
47uF
20%
0.1uF
m
0.1uF
0.1uF
0.1uF
0.1uF
9 9
MAIN
Remark
50V
25V
50V
50V
25V
25V
50V
50V
25V
6.3V
9 9
25V
25V
25V
25V
25V
25V
25V
50V
16V
6.3V
25V
16V
25V
16V
16V
16V
16V
5.5V
25V
16V
16V
25V
25V
6.3V
25V
25V
25V
25V
25V