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Material Composition Declaration
© Copyright 2005. IPC, Bannockburn, Illinois. All rights reserved under
both international and Pan-American copyright conventions.
IPC-1752-1 v1.02
IPC Web Site for Information on IPC-1752 Standard
http://www.ipc.org/IPC-175x
1752-1
Supplier Information
Company Name *
Company Unique ID
Keyspan
Contact Name *
Title - Contact
Eric Welch
CTO
Authorized Representative * Title - Representative
Same
Requester Item Number
Mfr Item Number
AV-DK1W and AV-DK1B
Alternate Recommendation
Manufacturing Information section intentionally omitted.
* Required Field
This document is a declaration of the substances within the manufacturer listed item. Note: if the item is an assembly
with lower level parts, the declaration encompasses all lower level materials for which the manufacturer has
engineering responsibility.
Form Type *
Distribute
Unique ID Authority
Response Date *
August 2006
Phone - Contact *
Email - Contact *
510 222 0131
eric@keyspan.com
Phone - Representative *
Email - Representative *
Mfr Item Name
Effective Date
AV Dock for iPod
April 2006
CAS Registry Number(R) is a Registered Trademark of the American Chemical Society
Adobe Reader version 7.0.5 is required to complete this declaration.
Declaration Class *
Class 1 - RoHS Yes/No
Response Document ID
Duplicate
Contact -> Authorized Representative
Supplier Comments or URL for Additional Information
Version
Manufacturing Site
Weight
China
Alternate Item Comments
UOM
Unit Type
mg
Each
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Summary of Contents for Keyspan AV-DK1B
- Page 1 Authorized Representative * Title - Representative Same Requester Item Number Mfr Item Number AV-DK1W and AV-DK1B Alternate Recommendation Manufacturing Information section intentionally omitted. * Required Field This document is a declaration of the substances within the manufacturer listed item. Note: if the item is an assembly with lower level parts, the declaration encompasses all lower level materials for which the manufacturer has engineering responsibility.
- Page 2 15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. Digitally signed by Eric Welch DN: cn=Eric Welch, c=US, o=InnoSys Inc, ou=Keyspan Date: 2006.09.08 14:18:17 -07'00' CAS Registry Number(R) is a Registered Trademark of the American Chemical Society...
- Page 3 JIG section intentially omitted. * Required Field CAS Registry Number(R) is a Registered Trademark of the American Chemical Society Form enabled by Adobe...