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CX-LZX7
8-2. PRINTED WIRING BOARDS — BD SECTION —
1
A
BD BOARD
(COMPONENT SIDE)
C302
C305
C303
B
R313
C315
C316
C314
C312
C318
C
C184
C210
R162
R165
C183
C401
C182
R201
C201
X171
C203
C209
D
C151
E
• See page 27 for Circuit Boards Location.
2
3
C255
R405
R351
C257
R352
R302
R353
R354
C258
R253
C259
C308
C116
R191
R173
C14
C174
C196
C172
R172
C195
C10
C17
R171
C11
C15
C16
1-861-619-
Q10
E
R121
C134
C123
•
: Uses unleaded solder.
4
5
BD BOARD
(CONDUCTOR SIDE)
C260
28
22
21
15
IC251
1
7
8
14
R252
TP
(VC)
TP
(TEO)
R111
C112
R112
C111
12
(12)
CN101
OPTICAL
PICK-UP
BLOCK
(KSM-215CFP)
30
30
6
M101
M
(SPINDLE)
3
1
IC303
4
5
S101
(LIMIT)
R404
R403
R419
C306
M
C313
16
1
R301
17
64
R306
IC301
C320
R307
C311
C307
C317
R305
32
49
R402
C309
33
48
1
R401
C310
R409
R303
R407
C211
R163
C163
120
91
1
90
R182
C115
C181
TP
IC101
C186
(FEO)
C162
C185
R181
27
C161
30
61
R204
31
60
TP
C124
(RFDCO)
C143
C122
C133
R142
R203
R132
TP
(RFACO)
R133
C142
R131
7
• Semiconductor
Location
Ref. No. Location
IC101
C-6
M102
IC251
B-4
(SLED)
IC301
B-6
IC303
B-6
Q10
D-3
CN201
C
MAIN
BOARD
CN902
(Page 36)
12
1-861-619-
(12)
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