Table Of Contents - Panasonic KX-TC2101BXB Service Manual

KX-TC2101BXB
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
1.1. Suggested PbF Solder
1.2. How to recognize that Pb Free Solder is Used
2 FOR SERVICE TECHNICIANS
3 CAUTION
4 OPERATING INSTRUCTIONS
4.1. Battery
4.2. Location of Controls
4.3. Connection
4.4. Troubleshooting
5 DISASSEMBLY INSTRUCTIONS
6 TROUBLESHOOTING GUIDE
6.1. Check Power
6.2. Bell Reception
6.3. Check Battery Charge
6.4. Check Link
6.5. Check Handset Transmission
6.6. Check Handset Reception
7 ADJUSTMENTS (BASE UNIT)
7.1. Test Mode Flow Chart (Base Unit)
7.2. How to change the channel
7.3. Adjustment
7.4. Adjustment Standard (Base Unit)
8 ADJUSTMENTS (HANDSET)
8.1. Test Mode Flow Chart (Handset)
8.2. How to change the channel
8.3. Adjustment
8.4. Adjustment Standard (Handset)
9 RF SPECIFICATION
9.1. Base Unit
9.2. Handset
10 HOW TO CHECK THE HANDSET SPEAKER
11 FREQUENCY TABLE (MHz)
12 EXPLANATION OF CPU DATA COMMUNICATION
12.1. STAND-BY -> TALK, TALK -> STAND-BY
12.2. Ringing
Page
4 12.3. Changing the Channel
4 12.4. Ports for transmitting and receiving of data
5 12.5. Waveform of DATA used for cordless transmission and
5 reception
5 13 BLOCK DIAGRAM (BASE UNIT)
6 14 CIRCUIT OPERATION (BASE UNIT)
6 14.1. Outline
7 14.2. Power Supply Circuit
8 14.3. Reset Circuit
9 14.4. Charge Circuit
10 14.5. Telephone Line Interface
12 14.6. Transmitter/Receiver
13 15 BLOCK DIAGRAM (HANDSET)
14 16 CIRCUIT OPERATION (HANDSET)
15 16.1. Outline
16 16.2. Reset Circuit
17 16.3. Battery Low / Power Down Detector
18 17 SIGNAL ROUTE
19 18 CPU DATA (Base Unit)
19 18.1. IC201
20 19 CPU DATA (Handset)
20 19.1. IC701
21 20 RF IC (Base Unit and Handset)
22 20.1. Base Unit: IC401, Handset: IC801
22 21 HOW TO REPLACE THE FLAT PACKAGE IC
23 21.1. PREPARATION
23 21.2. FLAT PACKAGE IC REMOVAL PROCEDURE
24 21.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
25 21.4. BRIDGE MODIFICATION PROCEDURE
25 22 CABINET AND ELECTRICAL PARTS (BASE UNIT)
25 23 CABINET AND ELECTRICAL PARTS (HANDSET)
25 24 ACCESSORIES AND PACKING MATERIALS
26 25 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
27
27 25.1. Base Unit
28 25.2. Handset
2
Page
29
30
30
31
32
32
33
34
35
35
36
38
39
39
39
40
41
42
42
43
43
44
44
45
45
45
46
46
47
48
49
50
50
50