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LG L602i Service Manual

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L602i SVC (9)_Cover_0628
1904.1.9 1:42 PM
˘
` 1
Service Manual
L602i
Date: June, 2007 / Issue 1.0

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Summary of Contents for LG L602i

  • Page 1 L602i SVC (9)_Cover_0628 1904.1.9 1:42 PM ˘ Service Manual L602i Date: June, 2007 / Issue 1.0...

  • Page 2: Table Of Contents

    Table Of Contents 1. INTRODUCTION ......5 4.12 1.3M Camera Trouble ......100 4.13 Main LCD Trouble......101 1.1 Purpose........... 5 4.14 Folder ON/OFF Trouble .....103 1.2 Regulatory Information......5 4.15 Camera Direction Change Trouble ..104 4.16 Audio Trouble Shooting .....105 2. PERFORMANCE.......7 4.17 Charger Trouble Shooting....117 2.1 System Overview ........7 2.2 Usable environment .........8...
  • Page 3 - 4 -...

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 6: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape Clamshell Slide Size 96 x 49 x 17mm Weight 100 g (with 860 mAh Battery) Power 3.7V normal, 860 mAh Li-Polymer Talk Time Over 140 Min (WCDMA, Tx=10dBm, Voice Call) (with 860mAh) Over 90 Min (WCDMA, Tx=10dBm, Video Call) Over 200 Min (GSM, Tx=29dBm, Voice)

  • Page 7: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Specification Voltage 3.7 V(Typ), 3.38 V(Min), [Shut Down : 3.28 V] Operation Temp -20 ~ +60°C Storage Temp -20 ~ +70°C Humidity 85 % (Max) 2) Environment (Accessory) Reference Spec. Typ. Unit TA Power Available power * CLA : 12 ~ 24 V(DC)
  • Page 8 2. PERFORMANCE Item DCS & PCS 30M~1GHz -36dBm 30M ~ 1GHz -36dBm MS allocated 1G~[A]MHz -30dBm Channel [A]M~[B]MHz -36dBm 1G ~ 4GHz -30dBm Radiated [B]M~4GHz -30dBm Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm 915M~1GHz -57dBm 915M~1GHz...
  • Page 9 2. PERFORMANCE Item DCS & PCS Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3...
  • Page 10 2. PERFORMANCE 2) Transmitter - WCDMA Mode Item Specification Maximum Output Power Class 3 : +24dBm(+1/-3dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5...
  • Page 11 2. PERFORMANCE Item Specification 33dB@5MHz, ACP>-50dBm Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc...
  • Page 12 2. PERFORMANCE 4) Receiver - WCDMA Mode Item Specification Reference Sensitivity Level -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3)

  • Page 13: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption Stand by (Static) Stand by(Dynamic) Voice Call 380hrs (auto mode) 250hrs (auto mode) 140 Min 90 Min WCDMA (DRX=2.56) (DRX=2.56) (Tx=10 dBm) (Tx=10 dBm) Stand By (Static) Voice Call 260 hrs/260 hrs 200 Min (auto mode) (Tx=Max) (Paging period =5) (Stand by and Voice Call Test Condition : LCD backlight Off)

  • Page 14: Battery Bar

    2. PERFORMANCE 2.6 Battery BAR Indication Voltage Bar 4 → 3 (68%) Over 3.80 ± 0.05V Bar 3 → 2 (47%) 3.72 ± 0.05V Bar 2 → 1 (26%) 3.65 ± 0.05V Bar 1 → Icon Blinking (5%) 3.47 ± 0.05V Low Voltage, 3.35 ±...

  • Page 15: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Specification Sending Loudness Rating (SLR) 8 ±3 dB -4 ± 3 dB Receiving Loudness Rating (RLR) -15 ± 3 dB Side Tone Masking Rating (STMR) 17 dB Echo Loss (EL) 40 dB Sending Distortion (SD) Refer to Table 30.3 Receiving Distortion (RD)

  • Page 16: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 General Description The L602i supports UMTS-2100, UMTS-800 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. All receivers and the UMTS transmitter use the radioOne Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The EGSM, DCS1800 and PCS1900 transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.
  • Page 17 3. TECHNICAL BRIEF A generic, high-level functional block diagram of L602i is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus a duplexer for UMTS operation).

  • Page 18: Gsm Mode

    3.2 GSM Mode 3.2.1 GSM Receiver The multi-mode L602i’s receiver functions are split between the four RFICs as follows: • UMTS-800 and UMTS-2100 operation uses the RFL6202 LNA and RFR6202 Receiver ICs to implement the receive signal path, accepting an RF input and delivering analog baseband outputs (I and Q).
  • Page 19 3. TECHNICAL BRIEF These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM6250A IC for further processing (an interface shared with the RFR6202 UMTS receiver outputs). - 20 -...

  • Page 20: Gsm Transmitter

    3. TECHNICAL BRIEF 3.2.2 GSM Transmitter The shared GSM Low-band (EGSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6250A IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250.
  • Page 21 3. TECHNICAL BRIEF The mixer IF port output is the offset feedback signal - the variable input to the frequency/phase detector circuit. The detector compares its variable input to its reference input and generates an error signal that is lowpass filtered by the loop filter and applied to the dual Tx VCO tuning port to force the VCO output in the direction that minimizes errors.

  • Page 22: Wcdma Mode

    3. TECHNICAL BRIEF 3.3 WCDMA Mode 3.3.1 Receiver The UMTS duplexer receiver output is routed to LNA circuits within the RFL6202 IC. These LNA functions are removed from the RFR6202 IC to improve mixer LO to RF isolation. The LNA gain is dynamically controlled by the MSM device to cover full receiver dynamic range and to save current consumption.
  • Page 23 3. TECHNICAL BRIEF The RFR6202 IC includes LO generation and distribution circuitry to reduce off-chip component requirements. The UMTS RX LO source is created using an external UMTS_RX_VCO that is closed- loop controlled by the RTR6250 PLL2 via a discrete loop filter, with an RFR6202 buffer amplifier supplying the PLL feedback signal.
  • Page 24 The RTR6250 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. The PA device used in L602i is “Load Insensitive PA”- no need to use isolator - and routed to the duplexer Tx port directly. Transmit power is delivered from the duplexer to the antenna through the switch module.

  • Page 25: Lo Phase-Locked Loop

    3. TECHNICAL BRIEF 3.4 LO Phase-locked Loop Most LO functions are fully integrated on-chip, do not require user adjustment, and need not be considered by handset designers. QUALCOMM has established and implemented frequency plans and LO generation schemes that support the radioOne 6250-IVseries chipset while requiring minimal off-chip design effort.
  • Page 26 3. TECHNICAL BRIEF 3.4.2 Transceiver PLL (PLL1) All LO functional blocks for the other handset modes(UMTS Tx, EGSM Tx/Rx, DCS Tx/Rx, PCS Tx/Rx) are integrated into the RTR6250 IC except the loop filter components (Figure 1.4.2-1). On-chip circuits include reference divider, phase detector, charge pump, VCO, feedback divider, and digital logic status.

  • Page 27: Off-Chip Rf Components

    A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include: -. Insertion loss . this component is also in the receive and transmit paths; In the L602i typical losses: UMTS Tx = 1.5 dB, UMTS Rx = 2.3 dB.
  • Page 28 Figure1.5.3-1 UMTS PA functional block diagram 3.5.4 Thermistor (R1029) This thermistor senses temperature variations around UMTS PA to adjust PA gain deviation for assure compliance with the applicable transmit power control standards. Negative temperature compensation thermistor is used in the L602i. - 29 -...
  • Page 29 Its detector coupling range and converted voltage is based on diode sensitivity and transmitter power level. The L602i uses National Semiconductor LMV228TLX power detector IC. In Figure 1.5.5-1, Directional coupler is 20dB. The output voltage is proportional to the logarithm of the input power. Figure1.5.5-2 shows the output voltage versus PA output power of the LMV228TLX setup as depicted in Figure1.5.5-1...
  • Page 30 3. TECHNICAL BRIEF 3.5.6 Dual band GSM power amplifier (U1003) The SKY77318 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation. The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The module consists of separate GSM850/900 PA and DCS1800/PCS1900 PA blocks, impedance- matching circuitry for 50 Ω...
  • Page 31 3. TECHNICAL BRIEF 3.5.7 GSM transmit VCO (U1002) The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts PLL and transmitter performance. VCO specifications refer to muRata MQW6V0C869M datasheet. The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA .
  • Page 32 3. TECHNICAL BRIEF 3.5.9 VCTCXO (X1000) The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6250A IC. The 6250-series chipset requires a 19.2 MHz nominal VCTCXO frequency. The oscillator frequency is controlled by the MSM6250A’s TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control.

  • Page 33: Digital Baseband(Dbb/Msm6250A)

    3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital BaseBand(DBB/MSM6250A) 3.6.1 General Description A. Features(MSM6250A) • The ARM926EJ-S microprocessor can operate at up to 180 MHz with variable rate, software controlled clocks to provide greater standby time. • Integrated PLL to provide additional on-chip clock frequencies •...

  • Page 34: Hardware Architecture

    3. TECHNICAL BRIEF 3.7 Hardware Architecture Figure. Simplified Block Diagram - 35 -...
  • Page 35 3. TECHNICAL BRIEF 3.7.1. Block Diagram(MSM6250A) Figure. Simplified Block Diagram of MSM6250A - 36 -...

  • Page 36: Subsystem(Msm6250A)

    3. TECHNICAL BRIEF 3.8. Subsystem(MSM6250A) 3.8.1. ARM Microprocessor Subsystem The MSM6250A device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, and ROM devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6250, RFR6200, RFL6200, and PM6650-2 devices.

  • Page 37: Wideband Codec

    3. TECHNICAL BRIEF 3.8.6. Wideband CODEC The MSM6250A device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface on two single-ended earphone output.
  • Page 38 3. TECHNICAL BRIEF 3.8.10. UART There are three UARTs in the MSM6250A ASIC: ■ UART1 for data ■ UART2 (can be used for USIM interface) ■ UART3 (can be used for PM SBI interface) 3.8.11. USB The MSM6250A device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces.

  • Page 39: External Memory Interface

    3. TECHNICAL BRIEF 3.9. External memory interface A. MSM6250A The MSM6250A have two external memory interfaces with arbitration for the multi-layer AHB system and memory controllers. The EBI1 bus is a high performance bus that supports a wide variety of memories.

  • Page 40: H/W Sub System

    3. TECHNICAL BRIEF 3.10. H/W Sub System 3.10.1. RF Interface A. RTR6250(WCDMA_Tx, GSM_Tx/Rx) MSM6250A controls RF part(RTR6250) using these signals. • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • RX_I/Q,TX_I/Q : I/Q for T/Rx of RF • TX_AGC_ADJ : control the transmit WCDMA output power. •...
  • Page 41 3. TECHNICAL BRIEF B. RFR6202(WCDMA_Rx) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • RX_I/Q, : I/Q for Rx of RF C. RFL6202(WCDMA_Rx) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset D. the others • ANT_SEL[0-2] : Ant Switch Module Mode Selection (WCDMA,GSM Tx/Rx,DCS Tx/Rx) •...

  • Page 42: Msm Sub System

    3. TECHNICAL BRIEF 3.10.2. MSM Sub System 3.10.2.1. SIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx USIM CLK VREG_USIM 2.85V USIM CLK USIM Reset...
  • Page 43 3. TECHNICAL BRIEF 3.10.2.3. USB The MSM6250A device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6250A was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1.
  • Page 44 3. TECHNICAL BRIEF 3.10.2.4. HKADC(House Keeping ADC) The MSM6250A device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6250A device has six analog input pins which are multiplexed to the input of the internal HKADC.
  • Page 45 3. TECHNICAL BRIEF 3.10.3. MSM Sub System 3.10.3.1. General MSM6250A, included RF, is fully covered by PM6650-2(Qualcomm PMIC). PM6650-2 cover the power of MSM6250A, MSM memory, RF block, USIM and TCXO. Major power components are : PM6650-2 (U401) : Phone Power Supply, Camera Flash LED Power Supply QST4 (Q400) : External Charger Supply Switching SI3493DV (Q402) : Main Battery Charging Control BH28FB1WHFV (U701) : LCD Power Supply...
  • Page 46 3. TECHNICAL BRIEF Figure. PM6650-2 Functional Block Diagram - 47 -...
  • Page 47 These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively. 3.47V~3.28V 3.72V~3.66V 3.65V~3.48V 4.2V~3.81V 3.80V~3.73V 2~0 (%) 40~21 (%) 20~3 (%) 100~63 (%) 62~41 (%) L602i Battery Bar Display - 48 -...
  • Page 48 3. TECHNICAL BRIEF Trickle Charging Trickle Charging of the main battery, enabled through SBI control and powered from V , is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from V to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V).
  • Page 49 3. TECHNICAL BRIEF Constant Current Charging The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. Constant Voltage Charging Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.

  • Page 50: Key Pad

    3. TECHNICAL BRIEF 3.10.4. Key Pad There are 26 buttons and 3 side keys in Figure. Shows the Keypad circuit. °ÆEND’ Key is connected On_SW_N to PMIC(PM6650-2) and MSM(GPIO76). COL0 COL1 COL2 COL3 COL4 COL5 ROW0 HOT3( i ) MENU HOT2 (INBOX) Side key(Up) ROW(1)

  • Page 51: Camera Interface

    3. TECHNICAL BRIEF 3.10.5. Camera Interface L602i Installed a VGA and 1.3M Pixel CMOS SXGA Camera. Below figure show the camera board to board connector and camera I/F signal. Indicator LED Flash LED H.C.P LED Receiver IrDA 1.3M Camera VGA Camera...

  • Page 52: Vga Camera

    3. TECHNICAL BRIEF 3.10.5 Camera Interface VGA CAMERA R800 VGA_CAM_PWDN 470K CN800 FB800 VREG_CAM_AVDD_2.8V CAM_MCLK VREG_CAM_IOVDD_2.8V VGA_CAM_RESET_N CAM_PCLK I2C_SCL CAM_DATA(0) I2C_SDA CAM_DATA(1) CAM_DATA(2) CAM_HSYNC CAM_DATA(3) CAM_VSYNC CAM_DATA(4) CAM_DATA(7) CAM_DATA(5) CAM_DATA(6) AXK720145G 1.3M CAMERA CN600 CAM_DATA(7) I2C_SCL CAM_DATA(6) I2C_SDA CAM_DATA(5) CAM_DATA(4) CAM_VSYNC CAM_DATA(3) CAM_HSYNC...
  • Page 53 3. TECHNICAL BRIEF The VGA Camera module is connected to main board with 20pin Board to Board connector (AXK720145G). Its interface is dedicated camera interface port in MSM6250A. The camera port supply 24MHz master clock to camera module and receive 24MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.
  • Page 54 3. TECHNICAL BRIEF The 1.3M Camera module is connected to main board with 24pin Board to Board connector (14-5602- 024-000-829). Its interface is dedicated camera interface port in MSM6250A. The camera port supply 24MHz master clock to camera module and receive 48MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.
  • Page 55 3. TECHNICAL BRIEF 3.10.6. Slide ON/OFF Operation There is a magnet to detect the slide status, opened or closed. If a magnet is close to the hall-effect switch, the voltage at pin1 of U602i goes to 0V. Otherwise, 2.7V. This folder signal is delivered to MSM6250A GPIO80. SLIDE_SENSE R600 VREG_MSMP_2.7V...
  • Page 56 3. TECHNICAL BRIEF 3.10.7. UART & IrDA COMMUNICATION AA15 LCD_ADS EBI2_ADD[20]_GPIO[34] AC13 EBI2_ADD[19] AF13 EBI2_ADD[18] AE13 EBI2_ADD[17] AA13 EBI2_ADD[16] EBI2_ADD[15] EBI2_ADD[14] AC12 EBI2_ADD[13] AA12 EBI2_ADD[12] AF11 EBI2_ADD[11] AE11 EBI2_ADD[10] EBI2_ADD[9] AC11 EBI2_ADD[8] AA11 EBI2_ADD[7] EBI2_ADD[6] AC10 EBI2_ADD[5] EBI2_ADD[4] AA10 EBI2_ADD[3] EBI2_ADD[2] EBI2_ADD[1] UART...
  • Page 57 3. TECHNICAL BRIEF 3.10.8. Bi Color LED & Hidden Camera Prevention LED Indicator MSM6250A BLK BT_CLK_GPIO[25] BT_SBST_GPIO[24] CAM_LED_EN BT_SBCK_GPIO[23] BT_SBDT_GPIO[22] G_LED_EN BT_TX_RN_N_GPIO[21] R_LED_EN BT_DATA_GPIO[20] Bi Color LED S/W TR Indicator LED +VPWR CL-165HR-YG_D_T LD800 GREEN G_LED R802 R_LED R_LED R_LED_EN G_LED_EN R803 G_LED...

  • Page 58: Lcd Module

    3. TECHNICAL BRIEF 3.10.9. LCD Module Indicator LED Flash LED H.C.P LED Receiver IrDA 1.3M Camera VGA Camera MAIN LCD Camera Slide FPCB Main PCB FPCB Key PCB Speaker Motor Figure. LCD Module Block Diagram MAIN LCD MODULE 260K Color TFT 176 * 220 Pixel NT39106_NOVATEK DISPLAYS Figure.
  • Page 59 3. TECHNICAL BRIEF 3.10.10. Display & SLIDE FPC Interface Slide FPCB is connected to Main board with 70-pin B to B connector (CN500_AXK7L70227J). VGA Camera, Indicator LED, Receiver, IrDA, Key board are connected in Slide FPCB. The LCD connected to Key board controlled by 16-bit EBI2 in MSM6250A 1 : EBI2_DATA(0) 36 : CAM_DATA(6) 2 : EBI2_DATA(1)

  • Page 60: Audio And Sound

    3. TECHNICAL BRIEF 3.10.11. Audio and Sound 3.10.11.1. Overview of Audio & Sound path Head Set Jack Head_Set Slide FPCB MSM6250A Receiver Slide FPCB Connector (U201) Camera FPCB Motor Camera FPCB Connector Head Set Head_set MIC Jack Figure Audio & Sound Path Block Diagram - 61 -...
  • Page 61 3. TECHNICAL BRIEF 3.10.11.2. Audio Signal Processing & Interface Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (MSM6250A). This transmitted signal is reformed to fit in GSM &...

  • Page 62: Ear Jack

    3. TECHNICAL BRIEF MSM6250 BLK MIC_Feedback MICFBP MICINN C200 C201 180K MICOUTP R203 0.1uF 0.1uF 470K C225 R206 Close to MSM C223 C224 180K MICOUTN R208 0.1uF 0.1uF MICINP MICFBN Head Set Jack BLK Ear jack VREG_MSMP_2.7V CN501 CSS5010-9A02F 2.2K R509 MICBIAS C512...
  • Page 63 3. TECHNICAL BRIEF Handset main MIC BLK MICBIAS SP0204LE5-PB C508 22n MIC1N C509 MIC1P U501 C510 C511 R504 Audio Amp for loud Speaker Audio AMP U500 TPA2010D1YZF C500 R500 +VPWR PVDD C501 FB500 R502 R503 HB-1M1005-601JT HPH_L SPK+ => Speaker SPK_AMP_EN _SHDN SPK-...

  • Page 64: Main Features

    3. TECHNICAL BRIEF 3.11 Main Features 1-1. LG-L602i (Nadia) Main features - Slide Type - GSM Tri Band (900,1800, 1900) + WCDMA Dual Band (800, 2100) - LCD 2.2” QCIF(176x220), 262K TFT LCD, - 1.3M CMOS + VGA Camera (Dual Camera)
  • Page 65 3. TECHNICAL BRIEF 2. LG-L602i Main Components 1.3M Camera Module LCD & Slide Assy MAIN Bottom Side - 66 -...
  • Page 66 3. TECHNICAL BRIEF 2-1. Main Top Side Audio B to B Connector Hall Camera LDO sensor Camera side key Volume Side key Key LED Reference Description Reference Description U500 Audio Amp U601 Camera LDO U600 Hall Sensor IC CN602 Camera Side Key CN601 Volume Side Key CN500...
  • Page 67 3. TECHNICAL BRIEF 2-2. Main Bottom Side 1.3M Camera BtoB Connector RF Switch W2100 Duplexer SPDT W800 Duplexer HDET EARJACK W800 PAM Connector W2100 PAM A.S.M RTR6250 GSM PAM GSM TX VCO 32.768 X-TAL WCDMA RX VCO VC TCXO PMIC (19.2MHz) MSM6250 48M X-Tal...
  • Page 68 3. TECHNICAL BRIEF 2-2. Main Bottom Side(continued) Design COMPONENT SW100 RF Switch U1000 SPDT SWITCH FL1000 ANT SWITCH MODULE U1003 GSM PAM U1002 GSM TX VCO X1001 WCDMA RX VCO U1001 RTR6250D FL1001 SAW FILTER (2100) FL1003 SAW FILTER (800) U1005 WCDMA PAM (2100) U1007...

  • Page 69: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1. RF Component ANT 100,101 SW1000 FL1004 FL1002 U1008 U1007 U1005 FL1000 U1001 U1003 U1002 X1001 X1001 RF component (Bottom) Reference Description Reference Description X1000 VCTCXO(19.2MHz) U1008 HDET IC X1001 UMTS RX VCO FL1004,1002 WCDMA Duplexer U1001 GSM/WCDMA Transceiver IC...
  • Page 70 4. TROUBLE SHOOTING U1010 FL1006 U1009 FL1005 RF component (Top) Reference Description Reference Description U1010 WCDMA Receiver IC(RFR6202) U1009 WCDMA LNA IC(RFR6202) FL1005,1006 WCDMA Receiver IC(RFR6250) - 71 -...

  • Page 71: Signal Path

    4. TROUBLE SHOOTING 4.2. SIGNAL PATH WCDMA Tx PATH WCDMA Rx PATH - 72 -...
  • Page 72 4. TROUBLE SHOOTING GSM Tx PATH GSM Rx PATH DCS/PCS Tx PATH DCS Rx PATH GSM/DCS/PCS Rx Common path PCS Rx PATH - 73 -...

  • Page 73: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.3. Checking VCXO Block The reference frequency (19.2MHz) from X1000 (VCXO) is used WCDMA TX part, GSM part and BB part. - 74 -...
  • Page 74 4. TROUBLE SHOOTING Check 1. Crystal part If you already check this crystal part, you can skip check 1. Test Point (Crystal Part) X1000 19.2MHz C1062 W2100_TX_OUT TCXO_PM 100p R1027 RTR6250_TCXO VCONT TRK_LO_ADJ C1064 1000p RFR6202_TCXO C1071 0.01u VREG_TCXO_2.85V C1074 C1075 0.1u 1000p...
  • Page 75 4. TROUBLE SHOOTING Check TP1 VCC of TCXO VCC ≥ 2.8V Check PMIC Check TP2 TRK_LO_AD 3V≥ Voltage≥ 0V Check MSM Check TP3,4 With scilloscope Check soldering 3V≥ Voltage≥ 0V and components VCXO is OK Check other part - 76 -...

  • Page 76: Checking Ant. Sw Module Block

    4. TROUBLE SHOOTING 4.4. Checking Ant. SW Module Block ANT_SEL0 ANT_SEL1 ANT_SEL2 TP 1. VREG_RFRX_0_2.85V LMSP54MA-543 Antenna Switch Block(Bottom) 15nH ANT100 ANT101 C1001 C1002 U1000 AC_T_N OUT2 VCONT SW1000 C1003 FL1000 LMSP54MA-543 KMS-507 OUT1 GSM900_RX1 R1001 C1004 GSM900_RX2 UPG2010TB-E3 1000p GSM1800_RX1 C1007 C1005...
  • Page 77 4. TROUBLE SHOOTING ANT _SEL0 MODE ANT_SEL1 ANT_SEL2 GSM900 TX HIGH HIGH GSM1800/1900 TX HIGH GSM900 RX HIGH GSM1800 RX HIGH HIGH GSM1900 RX HIGH UMTS 800 HIGH HIGH UMTS 2100 HIGH HIGH HIGH Logic Table of the Antenna Switch Checking Switch Block power source Check Soldering of ANT_SEL0, 1, 2 High Level...

  • Page 78: Checking Wcdma Block

    4. TROUBLE SHOOTING 4.5. Checking WCDMA Block START 1. Check VCXO 19.2MHz 2. Check ANT. SW Module ANT_SEL0, 1, 2 3. Check RF Tx Level 4. Check PAM Block 5. Check RF Rx Level 6. Re-download SW & CAL. - 79 -...
  • Page 79 4. TROUBLE SHOOTING 4.5.1. Checking VCXO Block Refer to 3.3 4.5.2. Checking Ant. SW module Refer to 3.4 4.5.3. Checking RF TX Level Test Point (RF TX Level) - 80 -...
  • Page 80 4. TROUBLE SHOOTING 15nH ANT100 ANT101 C1001 C1002 U1000 AC_T_N OUT2 VCONT SW1000 C1003 FL1000 LMSP54MA-543 KMS-507 OUT1 GSM900_RX1 R1001 C1004 GSM900_RX2 UPG2010TB-E3 1000p GSM1800_RX1 C1007 C1005 GSM1800_RX2 1.2nH RF_OUT VREG_RFRX_0_2.85V GSM1900_RX1 GND1 GSM1900_RX2 L1010 GND2 C1009 GND3 GSM1800_1900TX GND4 GSM900TX R1004 ANT_SEL0...
  • Page 81 4. TROUBLE SHOOTING For testing, Max power output is needed. Set the Phone Tx is ON and PDM is 450 Check TP1 RF Tx Level is OK Over 21dBm ? Check TP2 Check FEM Over 19dBm ? Check TP3 Check Duplexer Over 16dBm ? Check TP4 Check PAM Block...
  • Page 82 4. TROUBLE SHOOTING 4.5.4. Checking PAM Block PAM control signal PA_ON : WCDMA Tx Power Detect IC(HDET) Enable TX_AGC_ADJ : WCDMA Tx Power Amp Gain Control PA_ON TX_AGC_ADJ PA_ON must be HIGH(over 2.5V) PA_FET_N must be LOW if the max Tx power is set (lower than 0.5V) PAM IN/OUT Signal PAM_OUT PAM_IN...
  • Page 83 4. TROUBLE SHOOTING 4.5.5. Check RF Rx Level Bias1 - 84 -...
  • Page 84 4. TROUBLE SHOOTING L1000 15nH ANT100 ANT101 C1001 C1002 U1000 AC_T_N OUT2 VCONT SW1000 C1003 FL1000 LMSP54MA-543 KMS-507 OUT1 GSM900_RX1 R1001 C1004 GSM900_RX2 UPG2010TB-E3 1000p GSM1800_RX1 C1007 C1005 GSM1800_RX2 1.2nH RF_OUT VREG_RFRX_0_2.85V GSM1900_RX1 GND1 GSM1900_RX2 L1010 GND2 C1009 GND3 GSM1800_1900TX GND4 GSM900TX R1004...
  • Page 85 4. TROUBLE SHOOTING Set the Phone Rx is ON Check bias1 Check bias block Over 2V ? soldering Check TP1 Check RF s/w Signal exist? Check TP2 Check FEM Signal exist? Check TP3 Check Duplexer Signal exist? Check TP4 Check RFL6202 Signal exist? Change the board - 86 -...

  • Page 86: Checking Gsm Block

    4. TROUBLE SHOOTING 4.6. Checking GSM Block START 1. Check TXVCO Block 2. Check ANT. SW Module 3. Check Tx PAM Block 4. Check RF Rx Level 5. Re-download SW & CAL. - 87 -...

  • Page 87: Checking Vco Block

    4. TROUBLE SHOOTING 4.6.1. Checking VCO Block Test Point (TXVCO Level) FB1000 VREG_RFTX_2.85V U1002 R1016 MQW6V0C869M OUT1 R1017 OUT2 R1018 GSM_TX_VCO_1_EN_N R1019 GSM_TX_VCO_0_EN_N C1047 C1048 C1049 C1050 C1051 R1021 R1022 R1024 R1023 0.1u R1025 Schematic of RF TXVCO - 88 -...
  • Page 88 4. TROUBLE SHOOTING START Check TP1 Check RTR6250 0.5V < TP1 < 2.5V Check TP2, TP3 Check Soldering If GSM TP2=High , TP3=Low If DCS/PCS TP2=Low , TP3=High & MSM6250A Check TP4 Check PMIC(U401) 2.8V < TP4 < 3.0V Check TP5, TP6 Check Soldering of 0dBm <...
  • Page 89 4. TROUBLE SHOOTING 4.6.2. Checking Ant. SW Module Refer to chapter 3.4 4.6.3. Checking RF Tx level Test Point (RF Tx Level) L1000 15nH ANT100 ANT101 C1001 C1002 U1000 AC_T_N OUT2 VCONT SW1000 C1003 FL1000 LMSP54MA-543 KMS-507 OUT1 GSM900_RX1 R1001 C1004 GSM900_RX2 UPG2010TB-E3...
  • Page 90 4. TROUBLE SHOOTING START Check TP1 GSM/DCS/PCS If GSM over 31dBm ? Tx is Ok If DCS/PCS over 28dBm ? Check other part Check TP2, TP3 Check ANT. SW If TP2 over 29dBm ? Module (FL1000) If TP3 over 25dBm ? Refer to chapter 3.4 Check PAM Block (U1003) Check TXVCO (X1002)

  • Page 91: Checking Pam Block

    4. TROUBLE SHOOTING 4.6.4. Checking PAM Block PAM Control Signal TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc < 2.6V, TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 2.5V , Power OFF : lower than 0.7V) TP3.

  • Page 92: Checking Rf Rx Block

    4. TROUBLE SHOOTING Checking RF Rx Block EGSM.RX DCS.RX PCS.RX Test Point (RF Rx Level) GSM 900 Rx HIGH HIGH HIGH L1003 2.2uH GSM 1800 Rx HIGH HIGH 1.2nH L1001 GSM 1900 Rx HIGH GSM_PA_BAND MODE 2.2uH WCDMA 800 HIGH HIGH L1005 L1004...

  • Page 93: Power On Trouble

    4. TROUBLE SHOOTING 4. BB Trouble Shooting 4.7 Power ON Trouble Power On sequence of L602i is : PWR(END) key press -> PM_ON_SW_N go to low(D200), PM6650-2 KPDPWR_N pin(24) -> PM6650-2 Power Up -> VREG_MSMC_1.2V(L405), VREG_MSME_1.8V(L406), VREG_MSMP_2.7V(C426), VREG_MSMA_2.6V(C423), VREG_TCXO_2.85V(C402) power up and system reset assert to MSM ->...
  • Page 94 4. TROUBLE SHOOTING VREG_MSMA_2.6V PS_HOLD (D400) 19.2MHz (C1062) 19.2MHz (R405) 32.768KHz VREG_MSMP_2.7V VREG_MSME_1.8V PM6650 VREG_MSMC_1.2V PM6650 VREG_TCXO_2.85V MSM6250 MSM6250 - 95 -...

  • Page 95: Usb Trouble

    4. TROUBLE SHOOTING 4.8 USB Trouble USB Initial sequence of L602i is : USB connected to L602i -> USB_VBUS(Q401 Pin_4) go to 5V -> USB_D+(U400 Pin_1) go to 3.3V -> 48M Crystal on -> USB_DATA (TP_209) is triggered -> USB work. Start...

  • Page 96: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.9 SIM Detect Trouble USB Initial sequence of L602i is : VREG_USIM_2.85V(C430 of PM6650-2) go to 3.0V -> USIM_CLK,USIM_RST,USIM_DATA triggered -> USIM IF work(Schematic and place are refer to SIM technical brief) Start Re-insert the SIM card...

  • Page 97: Key Sense Trouble

    4. TROUBLE SHOOTING 4.10 Key Sense Trouble Key Sense sequence of L602i is : Default condition ROW(0-4) is 2.7V -> Press the key -> Corresponding row(x) and col(x) go to 0V -> Key sensing Start Change the side key Work well?

  • Page 98: Vga Camera Trouble

    4. TROUBLE SHOOTING 4.11 VGA Camera Trouble Camera control signals are generated by MSM6250A and directly connected with MSM6250A. Start Check the VGA Camera connector And reconnect the camera Camera is OK? Check VREG_CAM_2.8V Change the U601 VREG_CAM_1.8V Check the EMI Filter Change the Slide FPCB (FL800, 801, 802) Change the VGA Camera...

  • Page 99: M Camera Trouble

    4. TROUBLE SHOOTING 4.12 1.3M Camera Trouble Camera control signals are generated by MSM6250A and directly connected with MSM6250A. Start Check the 1.3M Camera connector And reconnect the camera Camera is OK? Check VREG_CAM_2.8V Change the U601 VREG_CAM_1.8V Change the 1.3M Camera Camera is OK? Change the Main board U601 (Dual LDO for CAM)

  • Page 100: Main Lcd Trouble

    4. TROUBLE SHOOTING 4.13 Main LCD Trouble Main LCD control signals are generated by MSM6250A. Those signal’s path are : MSM6250A -> MAIN B’d -> CN500 -> Slide FPCB -> Key PCB -> LCD Module - 101 -...
  • Page 101 4. TROUBLE SHOOTING LCD Control data flow - 102 -...

  • Page 102: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.14 Folder ON/OFF Trouble Folder On/Off(Close/Open) is worked as below : Folder On/Off Event -> Flip(U600 pin 1) is triggered(Open : about 2.7V, Close : 0V) -> MSM6250A Sense the Slide Up Down Event. Sensing signal is directly connected to MSM6250A. Start Check the magnet in Insert the magnet...

  • Page 103: Camera Direction Change Trouble

    4. TROUBLE SHOOTING 4.15 Camera Direction Change Trouble Camera direction change is worked as below : Camera preview start -> Pushing the side-key -> MSM6250A Sense the camera Direction Event. Side key sensing signal is directly connected to MSM6250A. Start ushing the side-key Camera direction change Event for p Direction is OK?

  • Page 104: Audio Trouble Shooting

    4. TROUBLE SHOOTING 4.16 Audio Trouble Shooting 4.16.1 Receiver Path Voice Receiver path as below: MSM6250A Ear1ON/Ear1OP -> CN500(b’d to b’d connector) -> Slide FPCB (b’d to b’d connector) -> Receiver Start Connect the phone to network Equipment and setup call Setup 1KHz tone out Hear the tone to the receiver The sine wave appear at...
  • Page 105 4. TROUBLE SHOOTING R525,R526(receiver signal serial resistor) CN500 B TO B Connector Receiver Receiver Soldering Point - 106 -...
  • Page 106 4. TROUBLE SHOOTING 4.16.2 Voice and Sound Path for Head_set Voice and Multimedia Sound path for Head_Set as below: MSM6250A HPH_R, HPH_L -> C513, C514 -> R510, R511 -> CN501 headset Jack pin 4,5 Start Connect the phone to network Equipment and setup call Setup 1KHz tone out And insert head_Set...
  • Page 107 4. TROUBLE SHOOTING Ear jack VREG_MSMP_2.7V CN501 CSS5010-9A02F 2.2K R509 MICBIAS C512 MIC2P C513 EAR_SENSE_N R510 HPH_R R511 HPH_L STEREO_DET_N VREG_MSMP_2.7V C514 HOOK_SW_N R514 100K VREG_MSMP_2.7V EAR_SENSE_ N R510, R511 R510, R511 - 108 -...
  • Page 108 4. TROUBLE SHOOTING 4.16.3 Loud Speaker path(voice speaker phone, VT, multimedia play, etc) Loud speaker path as below: MSM6250A HPL_L -> R502 -> C501 -> R503 -> U500(AMP) -> CN600 -> Camera FPCB (b’d to b’d connector) -> Speaker Start Connect the phone to network Equipment and setup call Setup 1KHz tone out...
  • Page 109 4. TROUBLE SHOOTING R502 C501 R503 AUDIO AMP FP500, 501 Speaker Soldering Point CN600 PIN 14, 15 - 110 -...
  • Page 110 4. TROUBLE SHOOTING 4.16.4 Microphone for Main MIC Main Microphone path as below: MIC -> C508,C509 -> MSM6250A -> MIC feed back gain logic -> MSM internal CODEC MICBIAS SP0204LE5-PB C508 22n MIC1N C509 MIC1P U501 C510 C511 C225 R504 Close to MSM Start Make a call...
  • Page 111 4. TROUBLE SHOOTING MICBIAS SP0204LE5-PB C508 22n MIC1N C509 MIC1P U501 C510 C511 R504 U501(MIC for Handset) - 112 -...
  • Page 112 4. TROUBLE SHOOTING 4.16.5 Microphone for Head_Set MIC for Head_Set path as below: Insert Headset -> EAR_SENSE_N(pin3) go 0V -> MSM6250A sense Head_Set insertion -> MIC signal go to MSM Ear jack VREG_MSMP_2.7V CN501 CSS5010-9A02F 2.2K R509 MICBIAS C512 MIC2P C513 EAR_SENSE_N R510...
  • Page 113 4. TROUBLE SHOOTING - 114 -...
  • Page 114 4. TROUBLE SHOOTING 4.16.6 Motor Motor path as below: PMIC VIB_DRV_N go 0V -> Motor Operate Start Motor Operate Try Re Assemble CN600 Check L1053 VIB_DRV_N is 0V? Or change the PMIC Motor Resoldering Change the Motor CN600 PMIC Camera Assy Module - 115 -...
  • Page 115 4. TROUBLE SHOOTING VBATT VBAT BATT_FET_N BAT_FET_N FLASH_DRV_N FLSH_DRV_N RESET_IN_N PON_RESET_N VREG_USB USB_ID VREG_5V 4.7u USB_OE_N USB_OE_N VSW_5V USB_CTL_N USB_VBUS USB_DAT USB_DAT C425 USB_D+ USB_D_P 4.7u USB_SE0 USB_SE0 1608 USB_D- USB_D_M GP1_DRV_N(MPP7) SUBKEYLED_DRV_N KYBD_BACKLIGHT ON_SW_N VIB_DRV_N USIM_P_DATA R407 +VPWR PMIC CN600 CAM_DATA(7) I2C_SCL...

  • Page 116: Charger Trouble Shooting

    4. TROUBLE SHOOTING 4.17 Charger Trouble Shooting Charging Current Flow +5V_PWR (5.4V) Q400 QST4 Pass control Tr (ON) TA Charging control CHG_CNT_N ICHARGE Charging current sensing ICHARGEOUT +VPWR 4.2~4.25V Q402 SI3493DV-E3 VBATT Main Battery Battery charging BATT_FET_N control Charging Procedure - Connecting TA - Control the charging current by PM6650 IC using USB_CNT_N or CHG_CNT_N signal - Charging Current flows into the battery by control BATT_FET_N...
  • Page 117 4. TROUBLE SHOOTING Start Check the pin and battery Connect terminals of I/O connector Connection OK? Change I/O connector Is the TA voltage 5.4V? Change TA cable Check the Q400,Q402 Charging OK? Change the board - 118 -...

  • Page 118: Download

    LGMDP is a download tool with capabilities to upload image files to the handset. LGMDP is desinged to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG USB modem driver(Ver 1.0 or later) is installed. 5.2 Downloading Procedure 1) Connecting to Connect the phone to your desktop PC using the USB cable and run the LGMDP application.
  • Page 119 5. DOWNLOAD The status “Ready” is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed. - 120 -...

  • Page 120: Function Description

    5. DOWNLOAD Function Description 1) Image Folder indicates location where all image files are placed. 2) Image files to be downloaded. 3) NV Default: Uploading nv2 file for special use. 4) NV Backup/Restore: NV Backup/Restore always have to be done. Store and Backup the Calibration data 5) Display Binary Info: Displaying popup window for image information.
  • Page 121 5. DOWNLOAD 2) Choosing image files Select the image folder, where all the image files are located, by clicking on the “Browse…” button. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.) Select the path, where AMSS Modem Image file is located by clicking on the “Browse…”...
  • Page 122 5. DOWNLOAD Click on the “START” button to download. All User data will be kept after upgrading. Be careful to use other options. - 123 -...

  • Page 123: Download Process

    5. DOWNLOAD 3) Downloading This is whole process for downloading. You will see snapshots for each step in the succeeding slides. Download Start (NV Backup) (NV Restore) Erase MEDIA directory Reset Download MEDIA Erase MODULE directory Download MODULE (Erase EFS) Reset Download MODEM Download End...
  • Page 124 5. DOWNLOAD • This message box informs that a new file for NV backup will be created in the mentioned local directory as shown. • NV backup in progress. • Erasing the existing directories and files before the Module Image is downloaded. •...
  • Page 125 5. DOWNLOAD • Rebooting and waiting for a while. • Performing NV restore. • Erasing the existing directories and files before downloading the Media Image. • Download of Media image in progress. - 126 -...
  • Page 126 5. DOWNLOAD • Download of Module image in progress • Download process has completed successfully - 127 -...

  • Page 127: Troubleshooting Download Errors

    5. DOWNLOAD 5.3 Troubleshooting Download Errors 1) MEDIA Erasing error Snapshot showing the “MEDIA Erasing error” before downloading the Media Image. Next slide shows the remedial procedure to adopt. - 128 -...
  • Page 128 5. DOWNLOAD Reboot the phone and then try to download only the Media and Module images again. Both Media and Moule Image have to be downloaded at the same time. - 129 -...
  • Page 129 5. DOWNLOAD 2) NV Restore error Snapshot showing the “NV Restore error”. Next slide shows the remedial procedure to adopt. Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.) - 130 -...
  • Page 130 5. DOWNLOAD Click on “X” button to use another function. - 131 -...
  • Page 131 5. DOWNLOAD 3) NV Restore error Click on “NV Restore”. A list of NV Backup files(*.nv2) will be shown. These files were saved everytime NV Backup option was selected. The name is based on the time when NV Backup was done. Select the appropriate file and click on “Restore”.

  • Page 132: Caution

    5. DOWNLOAD Snapshot showing the error, Reading the NV file and restore NV. 5.4 Caution 1) Not recommended that multi-downloading using the USB hub. 2) Recommendsed that the Module and Media Image have to be downloaded at the same time. - 133 -...

  • Page 133: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 GSM & WCDMA RF Block Fig 2.1-1.UMTS-800/UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram - 134 -...
  • Page 134 6. BLOCK DIAGRAM Table 2.1-1. RF Block Component - 135 -...

  • Page 135: Interface Diagram

    Coupler Filter RF Switch UMTS 2100 TX Connector RX_I/Q Duplexer MSM6250 Coupler PA_ON TRK_LO_ADJ UMTS PAM (UMTS-800) RX VCO HDET HDET Duplexer RX SAW Filter UMTS 800 RX RFL6202 RFR6202 UMTS 2100 RX SBCK/SBDT/SBST L602i Interface Diagram - 136 -...
  • Page 136 6. BLOCK DIAGRAM Main RF signal (black) GSM TX : GSM Tx RF signal GSM RX : GSM Rx RF signal DCS TX : DCS Tx RF signal DCS RX : DCS Rx RF signal PCS TX : PCS Tx RF signal PCS RX : PCS Rx RF signal UMTS TX : UMTS Tx RF signal UMTS RX : UMTS Rx RF signal...
  • Page 137 6. BLOCK DIAGRAM *Top Side - 138 -...
  • Page 138 6. BLOCK DIAGRAM *Bottom Side - 139 -...
  • Page 139 - 140 -...

  • Page 140: Circuit Diagram

    RX_WCDMA_2100 Checked C1117 C1118 100p 0.5p L1052 DRAWING SBDT 8.2nH SBST UHF_LO_BUFF SBCK C1120 C1119 Approved R1048 R1049 VREG_MSMP_2.7V C1121 R1050 100p C1122 C1123 C1124 100p 0.1u DRAWING LG Electronics Inc. Rev_1.2 LG(42)-A-5505-10:01 LG Electronics Inc. LGMC - 141 -...
  • Page 141 EBI2_ADD[1] C245 0.1u Section Date Sign & Name Sheet/ R219 2.2K Sheets L602i R220 2.2K MODEL KIM.D.K Designer 2007.01.24 FB301 M_CAM_MCLK CAM_MCLK Checked DRAWING MSM6250A NAME Approved DRAWING LG Electronics Inc. Rev_1.2 LG(42)-A-5505-10:01 LG Electronics Inc. LGMC - 142 -...

  • Page 142: Circuit Diagram

    NC26 NC86 NC27 NC87 Section Date Sign & Name Sheet/ NC28 NC88 Sheets MODEL NC29 NC89 L602i Designer 2007.01.24 KIM.D.K Checked DRAWING MEMORY & SIM NAME Approved DRAWING Rev_1.2 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. LGMC - 143 -...
  • Page 143 Sign & Name Sheet/ ICHARGEOUT Sheets MODEL L602i USB_VBUS USB_VBUS_IN +VPWR Designer 2006.01.24 KIM.D.K Q402 SI3493DV-E3 PS_HOLD Checked VBATT DRAWING PMIC & LDO & I/O NAME Approved BATT_FET_N DRAWING Rev_1.2 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. LGMC - 144 -...
  • Page 144 R514 100K AXK7L70227J VREG_MSMP_2.7V C515 0.1u Section Date Sign & Name Sheet/ Sheets MODEL L602i Designer KIM. D. K 2007.01.24 Checked DRAWING AUDIO & LCD NAME Approved DRAWING Rev_1.2 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. LGMC - 145 -...
  • Page 145 Sheet/ CN602 CAM_LED KEY_ROW(0) Sheets R1051 MODEL KEY_ROW(1) KEY_ROW(2) L602i R618 R619 KEY_COL(5) KEY_COL(5) Designer 2007.01.24 KIM.D.K Q1003 KRC402E CAM_LED_EN Checked DRAWING KEY & OTHER NAME Approved DRAWING Rev_1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. LGMC - 146 -...
  • Page 146 LCD_IF_MODE Section Date Sign & Name Sheet/ TP814 TP815 TP816 TP817 TP818 TP819 C809 Sheets MODEL L602i 0.1u AXK8L44125 KIM.D.K Designer 2006/11/27 V-MARK Checked DRAWING LCD FPCB NAME Approved DRAWING Rev_1.5 LG Electronics Inc. LG Electronics Inc. - 147 -...
  • Page 147 KEY_COL(4) KEY_COL(3) KEY_COL(2) Back-up Battery BAT700 ON_SW_N V_BACK_UP Section Date Sign & Name Sheet/ ML414RH-F9CE Sheets MODEL VA704 L602i EVLC14S02050 Designer 2006/11/27 KIM.D.K Checked DRAWING KEY PCB NAME Approved DRAWING Rev_E LG Electronics Inc. LG Electronics Inc. - 148 -...
  • Page 148 LG ELECTRONICS INC. KIM D K Drawn by: KIM D K R&D CHK: TITLE: Size: DOC CTRL CHK: L602i MEGA CAMERA FPCB Rev_1.0 MFG ENGR CHK: Changed by: Date Changed: Time Changed: QA CHK: Revison C Drawing Number: PAGE : 1...

  • Page 149: Pcb Layout

    8. PCB LAYOUT - 150 -...
  • Page 150 8. PCB LAYOUT - 151 -...
  • Page 151 8. PCB LAYOUT - 152 -...
  • Page 152 8. PCB LAYOUT - 153 -...
  • Page 153 8. PCB LAYOUT - 154 -...
  • Page 154 8. PCB LAYOUT - 155 -...
  • Page 155 8. PCB LAYOUT - 156 -...

  • Page 156: Calibration Program

    9. Calibration Program 9. Calibration Program 9.1 Configuration of HOT KIMCHI 9.1.1 Configuration of directory Jhangee Common Qualcomm LG_CL_009.dll At_Serial_Cmd.xml Diag_NV6250_RevB.dll DLL_E5515CD.DLL Diag_NV6275.dll DLL_PwrControlD.dll Diag_NV.dll Dll_SerialATD.dll LG_CL_016.dll PwrSupply_Cmd.xml L602i Debug Auto L602i CalAuto L602i : Directory : File - 157 -...
  • Page 157 9. Calibration Program Hot_Kimchi ComLMPLib_1_11.dll AutoSetup_100.xml ComLMPLib_2_11.dll Cal_Setup_Test.xml Dll_EzLooksMQ_015.dll dacTable.cfg GuiTk115d.dll Ezlooks.xml HK_30.exe LG_RfCal_Q3G6250_016.dll ShieldBox_DllD.dll NstProcedure_U310_102.xml Model L602i script_100.xml Spec_L602i_110.xml Spec_U310_101.xml LG_RfTest_E5515C_106.dll AutoSetup_100.xml Cal_Setup_Test.xml dacTable.cfg Ezlooks.xml LG_RfCal_Q3G6250_017.dll L602i_fix M_Multi_HK.reg Multi_HK.reg : Directory NstProcedure_L602i_111.xml : File script_102.xml Spec_L602i_110.xml - 158 -...
  • Page 158 9. Calibration Program dll,ocx (Win98)MFCD DLL COPY.bat (Win2000)MFCD DLL COPY.bat (WinXP)MFCD DLL COPY.bat MFC42D.DLL MFCD42D.DLL MFCN42D.DLL MFCO42D.DLL MSVCP60D.DLL MSVCRTD.DLL Vsflex7L.ocx vsflex7l_ocx_regist.bat Result Auto L602i L602i CalAuto L602i LG_UI_Qu6275_004.dll : Directory Login_10.ini : File Multi HK.reg - 159 -...

  • Page 159: How To Use Hot Kimchi

    9. Calibration Program 9.2 How to use HOT KIMCHI * Flow 1. Click “Logic Operation” of “SETTING” menu bar 2. Select “UART Port” that PC can communicate with the phone 3. Select “LOGIC MODE” that you want - Logic Mode -> 1 : Calibration Only (Choose) 2 : Auto Only 3 : Calibration + Auto - 160 -...
  • Page 160 9. Calibration Program Click "Start" Select "L602i" * Flow 4. Select the model name “L602i” 5. Click “Start” button - 161 -...
  • Page 161 - 162 -...

  • Page 162: Exploded View & Replacement Part List

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.1 EXPLODED VIEW 6 8 10 11 12 13 14 21 22 24 27 28 29 30 91 92 94 95 84 85 86 87 88 89 90 - 163 -...
  • Page 163 - 164 -...

  • Page 164: Replacement Parts

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark IMT-2000(SLIDE) TISL0000801 Milk Without AAAY00 ADDITION AAAY0236701...
  • Page 165 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MCCE00 CAP,RECEPTACLE MCCE0034401 COMPLEX, (empty), , , , , Black MCJK00 COVER,FRONT MCJK0066301 MOLD, PC LUPOY GP-2100, , , , , Black Without MICE00 INSERT,NUT MICE0000201 COMPLEX, (empty), , , , , Color...
  • Page 166 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MICE00 INSERT,NUT MICE0000301 COMPLEX, (empty), , , , , Color Without MFBB00 FILTER,RECEIVER MFBB0019501 COMPLEX, (empty), , , , , Color Without MIAA00 INDICATOR,LED MIAA0020301 MOLD, PC LEXAN 141R, , , , , Color...
  • Page 167 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without MTAZ00 TAPE MTAZ0191201 COMPLEX, (empty), , , , , Color Without MTAZ01 TAPE MTAZ0194201 COMPLEX, (empty), , , , , Color Without MTAZ02 TAPE MTAZ0194301 COMPLEX, (empty), , , , , Color...
  • Page 168 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark Without ADCA00 DOME ASSY,METAL ADCA0060801 Color Without MCBA00 CAN,SHIELD MCBA0014201 PRESS, STS, 0.2, , , , Color Without MGAZ00 GASKET MGAZ0057601 COMPLEX, (empty), , , , , Color Without MGAZ01...

  • Page 169: Main Component

    10. EXPLODED VIEW & REPLACEMENT PART LIST 10.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Main component> Location Level Description Part Number Specification Color Remark 3.0 ,-2.0 dBd, ,EGMS+DCS+PCS+W-BAND I+W-BAND VI, SNGF00 ANTENNA,GSM,FIXED SNGF0026901...
  • Page 170 44 PIN,0.4 mm,ETC , ,H=0.9, Header BOARD LD800 DIODE,LED,ARRAY EDLA0000201 RED, YELLOW GREEN ,2 COLOR,1.5*1.2*0.7 ,R/TP , SPCY00 PCB,FLEXIBLE SPCY0087401 POLYI ,0.45 mm,MULTI-4 ,L602i F_LCD ,; , , , , , , , , , SAEY00 PCB ASSY,KEYPAD SAEY0053001 Milk PCB ASSY, SAEB00 SAEB0018401 Milk...
  • Page 171 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA700 DIODE,TVS EDTY0008610 SOD-523 ,5 V,250 W,R/TP ,PB-FREE VA701 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA702 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA703 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005...
  • Page 172 PCB ASSY,MAIN,INSERT SAFB0064501 Milk SPKY00 PCB,SIDEKEY SPKY0042401 POLYI ,0.58 mm,DOUBLE ,L602i SK-VOL ,; , , , , , , , , , SPKY01 PCB,SIDEKEY SPKY0042501 POLYI ,0.58 mm,DOUBLE ,L602i SK-CAM ,; , , , , , , , , , SAFF00...
  • Page 173 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1016 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1017 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C1018 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1019 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 174 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1050 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP C1051 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP C1052 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C1053 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C1054 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C1055 CAP,TANTAL,CHIP ECTH0004801...
  • Page 175 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1086 CAP,CHIP,MAKER ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1087 CAP,CERAMIC,CHIP ECCH0003002 10 uF,10V ,Z ,Y5V ,HD ,2012 ,R/TP C1088 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1089 CAP,CHIP,MAKER ECZH0000813...
  • Page 176 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C227 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C228 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C229 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C230 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C231 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 177 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C401 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP C402 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C404 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,;...
  • Page 178 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C435 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C436 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C437 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C438 CAP,CERAMIC,CHIP ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP C439 CAP,CERAMIC,CHIP ECCH0002002...
  • Page 179 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark 1950 MHz,2140 MHz,1.8 dB,2.4 dB,43 dB,45 FL1002 DUPLEXER,IMT SDMY0001201 dB,3.0*2.5*1.1 ,SMD ,SAW ,; ,2140 ,45 ,1950 ,43 ,2.4 ,1.8 ,3.0x2.5x1.1 ,DUAL ,SMD ,P/TP FL1003 FILTER,SAW SFSY0030301 836.5 MHz,1.4*1.1*0.6 ,SMD ,Pb-free_DCN_Tx_SAW 835 MHz,880 MHz,1.35 dB,1.75 dB,53 dB,42...
  • Page 180 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L1031 INDUCTOR,CHIP ELCH0001428 10 nH,J ,1005 ,R/TP , L1033 CAP,CERAMIC,CHIP ECCH0001001 6.8 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP L1034 INDUCTOR,CHIP ELCH0001413 22 nH,J ,1005 ,R/TP ,PBFREE L1035 INDUCTOR,CHIP ELCH0005018...
  • Page 181 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R1015 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP R1016 RES,CHIP,MAKER ERHZ0000522 24 ohm,1/16W ,J ,1005 ,R/TP R1017 RES,CHIP,MAKER ERHZ0000419 15 ohm,1/16W ,J ,1005 ,R/TP R1018 RES,CHIP,MAKER ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP...
  • Page 182 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R205 RES,CHIP,MAKER ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP R206 RES,CHIP,MAKER ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP R207 RES,CHIP,MAKER ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP R208 RES,CHIP,MAKER ERHZ0000231 180 Kohm,1/16W ,F ,1005 ,R/TP...
  • Page 183 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R510 RES,CHIP,MAKER ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP R511 RES,CHIP,MAKER ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP R514 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP R618 RES,CHIP,MAKER ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP...
  • Page 184 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW VA504 DIODE,TVS EDTY0009401 ,[empty] ,[empty] ,2P ,1 VA601 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA602 VARISTOR SEVY0001001...
  • Page 185 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C1102 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C1103 CAP,CERAMIC,CHIP ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C1104 CAP,CERAMIC,CHIP ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP C1105 CAP,CERAMIC,CHIP ECCH0000143...
  • Page 186 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C603 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C604 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C605 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C606 CAP,TANTAL,CHIP ECTH0001901...
  • Page 187 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L1043 INDUCTOR,CHIP ELCH0003824 10 nH,J ,1005 ,R/TP ,chip inductor,PBFREE L1044 INDUCTOR,CHIP ELCH0001406 4.7 nH,S ,1005 ,R/TP ,PBFREE L1045 INDUCTOR,CHIP ELCH0001004 8.2 nH,J ,1005 ,R/TP ,Pb Free L1046 INDUCTOR,CHIP ELCH0003813...
  • Page 188 MCBA0014101 PRESS, STS, 0.15, , , , Color SPFY00 PCB,MAIN SPFY0137501 FR-4 ,0.8 mm,STAGGERED-8 ,L602i MAIN ,; , , , , , , , , , U1009 EUSY0160902 BCCP ,16 PIN,R/TP ,WCDMA LNA IC U1010 EUSY0161002 BCCP ,40 PIN,R/TP ,WCDMA RF TO B/B RECEIVER IC QFN ,9 PIN,R/TP ,9 PIN,R/TP ,2.5W Mono D-Class Audio...
  • Page 189 10. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA609 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA610 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW VA612 DIODE,TVS EDTY0009401...

  • Page 190: Accessory

    SBOM standard on GCSC Location Level Description Part Number Specification Color Remark 3.7 V,860 mAh,1 CELL,PRISMATIC ,LG-L601i BATTERY PACK,LI- SBPP00 SBPP0017101 BATTERY(I/P), NTT, Pb-Free , , , , ,PRISMATIC , , ,SILVER , POLYMER - 191 -...
  • Page 191 Note...
  • Page 192 Note...

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