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Samsung DVD-C700 Service Manual

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ELECTRONICS
© Samsung Electronics Co., Ltd. JAN. 2000
Printed in Korea
AH68-00314A
DVD PLAYER
DVD-C700
SERVICE
DVD PLAYER
DOLBY DIGITAL DECODER BUILT-IN
DVD / VIDEO-CD / CD PLAYER DVD-C700
DIGITAL VIDEO
5
SPATIALIZER
N-2-2
Manual
CONTENTS

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Summary of Contents for Samsung DVD-C700

  • Page 1: Table Of Contents

    4. Disassembly and Reassembly 5. Circuit Descriptions 6. Troubleshooting 7. Exploded Views and Parts List DOLBY DIGITAL DECODER BUILT-IN 8. Electrical Parts List DVD / VIDEO-CD / CD PLAYER DVD-C700 DIGITAL VIDEO 9. Block Diagrams SPATIALIZER N-2-2 10. PCB Diagrams 11.

  • Page 2: Precautions

    Melal Part cal return path to the chassis. Any current measured must not exceed 0.5mA. Reverse the instrument power cord plug in the out- ohmmeter let and repeat the test. See Fig. 1-1. Fig. 1-2 Insulation Resistance Test Samsung Electronics...
  • Page 3 (5) antenna wiring. Always inspect in all areas tinuously and new instructions are issued whenev- for pinched, out-of-place, or frayed wiring, Do not er appropriate. change spacing between a component and the printed-circuit board. Check the AC power cord for damage. Samsung Electronics...

  • Page 4: Servicing Precautions

    Components i-enti- fied by shading, by( ) or by ( ) in the circuit dia- gram are important for safety or for the characteris- tics of the unit. Always replace them with the exact replacement components. Samsung Electronics...
  • Page 5 (6) Do not remove a replacement ESD device from its protective package until immediately before your are ready to install it.(Most replacement ESD devices are packaged with leads electrically short- ed together by conductive foam, aluminum foil or comparable conductive materials). Samsung Electronics...
  • Page 6 Be sure to put on a wrist strap grounded to the sheet. Be sure to lay a conductive sheet made of copper etc. Which is grounded to the table. Samsung Electronics...
  • Page 7 4) Insert FPC into Main PCB MCN06 and switch SW1 4) Disassemble the Deck PCB. on Deck PCB to “ON”. (See Fig 1-4) Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged. TO MAIN PCB (MCN06) Fig. 1-4 Samsung Electronics...

  • Page 8: Reference Information

    "L":normal speed, "H":double speed DEM0 De-emphasis frequency select pin DZFR Rch zero input detect pin De-emphasis frequency select pin DZFL Lch zero input detect pin DEM1 Note : Allinput pins except internal pull-down pins should not be left floating. Samsung Electronics...
  • Page 9 DDVD1 ENV_SEL(02H) 58 BCA ACD1 GAIN_FE(03H) MIRR OFSTHOLD BCD1 ABCD_OFST(O6H) CCD1 56 DPDVCC FE_0FST(05H) DCD1 55 DFCT2 AVCC CDRSEL(00H) 54 DFCT1 LDONB(00H) TESEL(OOH) ANALOG VREFA VC AMP 53 DFCTTH1 ENVELOPE DEFECT 52 DFCTTH2 ALPC FOFST FOFST 51 DVCC Samsung Electronics...
  • Page 10 Reference Information Samsung Electronics...
  • Page 11 Reference Information 2-1-3 SIC1 (KS1452 ; Digital Servo) DIRC SSTOP /PSO SMON LOCK DFCT FOKB MIRR TZCA PHI1 XOUT TEST RSTB TILTO TILTI Samsung Electronics...
  • Page 12 Reference Information Samsung Electronics...
  • Page 13 Reference Information 2-1-4 DIC1 (KS1453 ; DVD Data Processor) Samsung Electronics...
  • Page 14 Reference Information Samsung Electronics...
  • Page 15 D a t a O u t p u t E n a b l e P o w e r ( + 5 V ) P o w e r ( + 3 . 3 V ) N . C No Connection Samsung Electronics...
  • Page 16 D V D - D A T A 7 / C D G - S C L K Global VREQUEST I n t e r f a c e VSTROBE A_VSS Signals ERROR A_VDD P10[10:0] V-DACK/ASTROBE AREQUEST R E S E T A-DACK ZiVA Decoder Samsung Electronics...
  • Page 17 Raster Contral 1 for video port. This pin receives/provides a VS/FS/FSEQ signal. RCV1 Raster Contral 2 for video port. This pin provides an HS pulse of programmable length or receives I / O RCV2 an HS pulse. 2-10 Samsung Electronics...
  • Page 18 The 12C-bus receiver waits for the START condition. S C L 12C serial clock input S D A I / O 12C serial data input/output TTXRQ Teletext Request output, indicating when text bits are requested T T X Teletext bit stream input Samsung Electronics 2-11...
  • Page 19 P30(RD) P31(WR) 8BIT PWM (T03)P73 P32(HWR) (TIMER 3) P33(WAIT) PORT 3 P34(BUSRQ) (INT4/T14)P80 P35(BUSAK) (INT5/T15)P81 16BIT TIMER P36(R/W) (T04)P82 (TIMER 4) P37(RAS) (T05)P83 16BIT TIMER (INT6/T16)P84 CS/WAIT P40(CS0/CAS0) (TIMER 5) (INT7/T17)P85 CONTROLLER P41(CS1/CAS1) (T06)P86 (3-BLOCK) P42(CX2/CAS2) (INTO)P87 2-12 Samsung Electronics...
  • Page 20 Reference Information Samsung Electronics 2-13...
  • Page 21 Chip Enable and Output Buffers Prog Logic Gating Decoder A0-A19 Address 2,097,152-Bit Inputs Cell Matrix Decoder TOP VIEW NAME FUNCTION A0-A19 Address Inputs Chip Enable Input Data Input/Outputs DQ0-DQ7 Output Enable Input Vcc Syply Voltage OE/VPP Ground 2-14 Samsung Electronics...
  • Page 22 Reference Information 2-1-10 FIC2 (LC866232 ; Front Micom) Samsung Electronics 2-15...
  • Page 23 Reference Information MEMO 2-16 Samsung Electronics...

  • Page 24: Product Specification

    Digital : 1.15Vp-p Audio Output 48KHz Sampling : 4Hz to 22 KHz * Frequency Response 96KHz Sampling : 4Hz to 44KHz * S/N Ratio 110dB * Dynamic Range 96dB * Total Harmonic Distortion 0.003% * : Nominal specification Samsung Electronics...
  • Page 25 Output Level Audio Output Digital : 1.15Vp-p 48KHz Sampling : 4Hz to 22KHz * Frequemvy Response 96KHz Sampling : 4Hz to 44KHz * S/N Ratio 110dB * Dynamic Range 96dB * Total Harmonic Distortion 0.003% * : Nominal specification Samsung Electronics...

  • Page 26: Disassembly And Reassembly

    Note : If Tray Œ doesn’t open, insert a Screw driver ¨ into the Emergency hole ˇ (as shown in detailed draw- ing) and then turn it in the direction of arrow “B”. Open Tray manually. Œ TRAY "A" ´ DOOR-TRAY "A" ¨ SCREW DRIVER ˇ EMERGENCY HOLE "B" CLOSE OPEN <Bottom View> Fig. 4-1 Door-Tray Removal Samsung Electronics...
  • Page 27 1) Remove 5 Screws Œ on the back Top Cabinet. 2) Remove 4 Screws ´, ˇ on the left and right side. 3) Lift up the Top Cabinet in direction of arrow. Œ 5 SCREWS ´ 2 SCREWS ˇ 2 SCREWS Fig. 4-2 Top Cabinet Removal Samsung Electronics...
  • Page 28 4) Remove 2 Screws ∏ and disassemble the Headphone PCB ”. Œ 2 SCREWS ´ ASS'Y FRONT-PANEL ˇ KNOB-SHUTTLE ¨ 6 SCREWS Ø FRONT PCB ” HEADPHONE PCB ∏ 2 SCREWS ˆ 5 SCREWS Fig. 4-3 Ass’y Front-Panel, Front PCB, Headphone PCB Removal Samsung Electronics...
  • Page 29 (Black color ; 3x8) ˆ MAIN PCB ” S.M.P.S. PCB FPC (Pin 36) Œ 2 SCREWS (Black color) ; Region - America <Region - Europe> Œ 4 SCREWS (Black color) Fig. 4-4 Main PCB, Jack PCB, S.M.P.S. Removal Samsung Electronics...
  • Page 30 Disassembly and Reaasembly Wire Arrangement JACK PCB S.M.P.S. PCB CORE-FERRITE MAIN PCB TO HEADPHONE PCB CON23 Fig. 4-5 Wire Arrangement (Top View) Samsung Electronics...
  • Page 31 1) Remove 4 Screws Œ, ´ and Bracket-PCB ˇ. 2) Remove 4 Screws ¨ from the Ass’y Deck and lift it up. ˇ BRACKET-PCB Œ 2 SCREWS ´ 2 SCREWS ¨ 4 SCREWS Fig. 4-6 Ass’y Deck Removal Samsung Electronics...

  • Page 32: Pcb Location

    Disassembly and Reaasembly 4-2 PCB Location FRONT PCB JACK PCB MAIN PCB S.M.P.S. PCB HEADPHONE PCB KEY PCB Fig. 4-7 PCB Location Samsung Electronics...
  • Page 33 MAIN PCB MCN01 Ô  JCN04 JACK PCB HEADPHONE PCB CON23 Ò Ú FCN01 FRONT PCB JACK PCB JCN02 Æ ı FCN04 FRONT PCB MAIN PCB MCN04 ˜ ¯ TCN03 DECK PCB MAIN PCB MCN05 Fig. 4-8 Connector Diagram Samsung Electronics...
  • Page 34 CAUTION ; Do not stain with grease Pick-Up Lens, Turn table, Roulette Disc, Tray Disc, Belt. ˆ STOPPER "C" ˇ GEAR LOAD "C" "B" ¨ TRAY DISC ˆ STOPPER Ø FLAT CABLE ´ SCREW DRIVER Œ EMERGENCY HOLE "A" CLOSE OPEN <Bottom View> Fig. 4-9 Tray Removal Samsung Electronics...
  • Page 35 Disassembly and Reaasembly 4-4-2 Tray Roulette Removal 1) Remove Screw Œ. 2) Lift up the Tray Roulette ´. Œ SCREW ´ TRAY ROULETTE ´ TRAY ROULETTE TRAY DISC <Assembly Point> TRAY DISC Fig. 4-10 Tray Roulette Removal 4-10 Samsung Electronics...
  • Page 36 ˝ SHAFT WORM ASS'Y Ô 2 SCREWS  WORM MOTOR ’ 2 SCREWS ˇ HOOK Œ LCN02 ˇ HOOK ˇ HOOK ˇ HOOK ´ SENSOR PCB ˇ HOOK ´ SENSOR PCB <Bottom View> Fig. 4-11 Bracket Worm Ass’y Removal Samsung Electronics 4-11...
  • Page 37 Œ RUBBER PAD PROTECT CAUTION ; <Assemlby Point> Suface of adhesion. ˆ HOOK "B" SLIDER RACK ˆ HOOK "B" <DETAIL-A> ˇ SCREW DRIVER ´ EMERGENCY HOLE "A" ¨ GEAR LOAD CLOSE OPEN <Bottom View> Fig. 4-12 Ass’y P/U Deck Removal 4-12 Samsung Electronics...
  • Page 38 1) Remove the Slider Rack ´ in direction of arrow “B”, while simultaneously pushing the Lever Locker Œ in direction of arrow “A”. <Assembly Point> "B" ´ SLIDER RACK ´ SLIDER RACK Œ LEVER LOCKER "A" Œ LEVER LOCKER Fig. 4-13 Slider Rack Removal Samsung Electronics 4-13...
  • Page 39 CAUTION ; Do not stain with grease Pick-Up Lens, Turn table, Roulette Disc, Tray Disc, Belt. Œ BELT PULLEY ¨ GEAR PULLEY ´ BOSS ˇ HOOK ´ BOSS ¨ GEAR PULLEY Fig. 4-14 Belt Pulley, Gear Pulley Removal 4-14 Samsung Electronics...
  • Page 40 3) Push the Hook ´ below the Gear Cam ¨ in the direction of arrow and lift up Gear Cam ¨. 4) Remove Gear Load ˆ. ¨ GEAR CAM ˆ GEAR LOAD ˇ GEAR CONVERT Œ GEAR TRAY ´ HOOK <Bottom Side> Fig. 4-15 Gear Tray, Gear Convert, Gear Cam, Gear Load Removal Samsung Electronics 4-15...
  • Page 41 3) Remove the Gear Syncro ¨ in direction of arrow “B”, while simultaneously pushing the 2 Hooks ˇ. ¨ GEAR SYNCRO ´ LEVER LOCKER "A" Œ SPRING LOCKER "B" ˇ HOOKS Fig. 4-16 Spring Locker, Lever Locker Removal 4-16 Samsung Electronics...
  • Page 42 2) Push the 3 Hooks ¨, ˆ, Ø in the direction of arrow “C” and lift up PCB Switch Ass’y ∏. ˇ PCB MOTOR ASS'Y ´ 2 HOOKS "B" ∏ PCB SWITCH "B" ´ 2 HOOKS Œ HOOK "A" ¨ HOOK "C" ˆ HOOK Ø HOOK "C" "C" Fig. 4-17 PCB Motor Ass’y, PCB Switch Removal Samsung Electronics 4-17...
  • Page 43 1) Pull the Clamper ´ by hand in the direction of arrow ”B”, while simultaneously pushing the 4 Hooks Œ in direction of arrow “A”. 2) Remove the Magnet ˇ. 3) Lift up the Plate Chuck ¨. ¨ PLATE CHUCK "B" "A" "A" ˇ MAGNET Œ 4 HOOKS ´ CLAMPER "A" "A" Fig. 4-18 Clamper Removal 4-18 Samsung Electronics...
  • Page 44 CAUTION ; Do not stain with grease Pick-Up Lens, Turn table, Roulette Disc, Tray Disc, Belt. Œ WASHER ´ GEAR FEED U Ø PICK-UP ASS'Y ˇ FPC ˆ SHAFT P/U "B" "C" ˆ SHAFT P/U "A" ¨ STOPPER Fig. 4-19 Pick-Up Ass’y Removal Samsung Electronics 4-19...
  • Page 45 3) Remove 3 Screws ˇ. 4) Remove the FPC ¨ from Motor Spindle Ass’y side. 5) Remove PCB Deck ˆ. ˇ 3 SCREWS ¨ FPC Œ CN4 ˆ PCB DECK ´ FEED MOTOR Fig. 4-20 PCB Deck Removal 4-20 Samsung Electronics...
  • Page 46 Disassembly and Reaasembly 4-4-13 Spindle Motor Removal 1) Remove 3 Screws Œ. 2) Lift up the Spindle Motor ´. ´ SPINDLE MOTOR Œ 3 SCREWS Fig. 4-21 Spindle Motor Removal Samsung Electronics 4-21...
  • Page 47 Disassembly and Reaasembly 4-4-14 Bracket Deck Ass’y Removal 1) Remove 4 Screws Œ. 2) Lift up the Bracket Deck Ass’y ´. Œ 4 SCREWS ´ BRACKET DECK ASS'Y ˇ SUB CHASSIS Fig. 4-22 Bracket Deck Ass’y Removal 4-22 Samsung Electronics...
  • Page 48 4-4-15 Assembly of Gear Œ GEAR CAM TIMING POINT-1 ´ GEAR TRAY Œ GEAR CAM ˇ GEAR CONVERT ´ GEAR TRAY TIMING POINT-2 Œ GEAR CAM ˇ GEAR CONVERT ´ GEAR TRAY ¨ TRAY DISC Fig. 4-23 Assembly of Gear Samsung Electronics 4-23...
  • Page 49 Disassembly and Reaasembly MEMO 4-24 Samsung Electronics...

  • Page 50: Circuit Descriptions

    Input : Common power to transformer (Vp). Fig. 5-2 The output Vs of transformer is determined by the ratio of 1st Np and 2nd Ns. Vs = (Ns/Np) x Vp Fig. 5-3 Vout Vout is output (DC) by diode and condensor. Fig. 5-4 Samsung Electronics...
  • Page 51 I switch Fig. 5-6 Terms 1) 1st : Common power input to 1st winding. 2) 2nd : Circuit followings output winding of transformer. 3) f (Frequency) : Switching frequency (T : Switching cycle) 4) Duty : (Ton/T) x 100 Samsung Electronics...
  • Page 52 ´ Rectify to PD12 and smooth to PE6. ˇ Use the output of transformer as PIC1 Vcc : The loads are different before and after PIC1 driving. (Vcc of PIC1 decreases below OFF voltage, using only the resistance due to load increase after PIC1 driving.) Samsung Electronics...
  • Page 53 Reverse sequence of the above description --> Duty down --> Vout down --> Maintain 5.8V (i.e., the feedback to maintains 5.8V). Œ PR35, PR36 : Reduce 5.8V overshoot ´ PR37, PC44 : Prevent PIC3 oscillation(for phase correction) ˇ PC09 : Adjust feedback response rate Samsung Electronics...
  • Page 54 5-1-3 (b) PIC1 (STR-G6153T) Internal Block Diagram V c c Voltage Sync. 6.3V UVLO Ref. OSC. Drain Feedback 2.5R Source Voffset S e n s e Rsense Reset Sense Sense 7.5V Reset Thermal Protection Control IC Control IC O C P Fig. 5-10 Samsung Electronics...
  • Page 55 RF SUM & AGC. It controls RF SUM & AGC gain by means of Pin 89-95 and interfaces with PWM signal, (output from PWM terminal of KS1453, via low-pass filter to adjust boost gain and peak frequency. EQout terminal is connected with EQin (Pin 86). Samsung Electronics...
  • Page 56 Œ EQG (Pin 97) : Changes the gain of peak frequency with EQ frequency characteristic. Convert PWM signal, output from KS1453, into DC via low-pass filter. ´ EQF (Pin 98) : Changes the peak frequency with EQ frequency characteristic. Convert PWM signal, output from KS1453, into DVD via low-pass filter. Samsung Electronics...

  • Page 57: System Control

    AK4324 DRIC3 ROULETTE MOTOR DRIVE Ka3082 FIC1 MIC1 MIC2 FRONT MICOM MAIN MICOM ADDR LATCH LC86P6232 TMP93CM41F 74AC573 MIC7 ADDR DECODER DATA BUS 74HC00 MIC5 MIC8 EEPROM EPROM KS24C020 AT27C080 MICOM BLOCK LOW ADDRESS HIGH ADDRESS Fig. 5-13 Samsung Electronics...
  • Page 58 • CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT) • CH3 : DVDCS (VIC1-206, A/V DECODER CHIP SELECT) • CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT) • CH5 : WR (MIC1-73, MICOM OUTPUT WRITE SIGNAL) • CH6 : RD (MIC1-72, MICOM OUTPUT READ SIGNAL) Samsung Electronics...
  • Page 59 • CH2 : DSPCS (DIC1-2, DATA PROCESSOR CHIP SELECT) • CH3 : DVDCS (VIC1-206, A/V DECODER CHIP SELECT) • CH4 : SRVCS (SIC1-10, DIGITAL SERVO CHIP SELECT) • CH5 : WR (MIC1-73, MICOM OUTPUT WRITE SIGNAL) • CH6 : RD (MIC1-72, MICOM OUTPUT READ SIGNAL) 5-10 Samsung Electronics...
  • Page 60 KS1452 OPEN/CLOSE ROULETTE & MOTOR MOTOR DRIC2 DRIC2 DRIC3 FOCUSING KA3010D KA3082 KA3010D F– MOTOR DRIVE ROULETTE MOTOR DRIVE TRACKING T– DRIC1 KA3011D “ SPINDLE FIC1 LC86P6232 FRONT MICOM OPEN/CLOSE S/W ROLUETTE SENSOR DISC SENSOR Fig. 5-17 Samsung Electronics 5-11...
  • Page 61 Meanwhile, DVD repeats the track jump from 1 to 4 in inner direction at normal play (because data- read speed from disc is faster than data output speed on screen). ´ For CD, VCD Receive the signal output through E, F of Pick-up, from RIC1. The tracking error signal is similar to DVD. 5-12 Samsung Electronics...
  • Page 62 If the existing track count is within fine seek range, tracking begins using fine seek. 4) CLV SERVO(DISC MOTOR CONTROL SERVO) Input RF signal (from Pick-up) to SIC1 pin59. Detect SYNC signal from RF in SIC1, and output PWM signal to SIC1 pin 55 for constant linear velocity. Samsung Electronics 5-13...
  • Page 63 177, 178 SDATA[7..0] DVD-D[7..0] VIC1 EFMI PLCK CSTROBE VSTROBE (ZiVA-3) PLCK DATREQ REQUEST DIC1 DATACK DACK (KS1453) HDATA[7..0] DTER *ERR HADDR[3..0] MDAT[7:0] MRZA(3) ZCS(2) /INT MWR(128) MRD(127) ZIRQZD(126) AD[7..0] INTO(ZIRQZD) HA[23..8] INT4(/INT) *RD(72) *WR(73) MIC1 TMP93CM41F Fig. 5-19 5-14 Samsung Electronics...
  • Page 64 It measures the timing that data processed in DIC1 at DVD playback. STROBE DACK SDATA all Fig. 6-20 • CH1 : STROBE (DIC1-69, CLOCK) • CH2 : REQ (DIC1-70, DATA REQUEST) • CH3 : DACK (DIC1-58, DATA ACKNOWLEDGE) • CH4 : SDATA (DIC1-60~67, DATA) Samsung Electronics 5-15...
  • Page 65 Video signal converted into analog signal is outputted via amplifier of analog part. (Main Board) (Output Board) CVBS-1 Video VIC1 CVBS-2 VIC52 data A/V Decoder Amplifier ZiVA-3 BA7660 VIC50 SAA7128 Video encoder MIC1 VIC51 Main Micom Amplifier TMP93CM41F BA7660 Fig. 5-21 Video Output Block Diagram 5-16 Samsung Electronics...
  • Page 66 13). Pin9, Pin12 and Pin14 of VIC51 and VIC52 are feedback pin to SAG compensation(DC characteristic compen- sation of signal). Resistance(VR3-VR14) which is inserted to input terminal is bias resistance for input offset. The signal to which gain is adjusted by amplifier is outputted from jack via 75ohm. Samsung Electronics 5-17...
  • Page 67 CVBS/Y_VCR_OUT SIC2 SIC3 SIC4 R_TV_OUT (14053) (14053) (NJM2267) G_TV_OUT Switch Switch Amplifier CVBS_VCR_OUT CVBS_S B_TV_OUT CVBS_TV_IN R/C_TV_OUT R_VCR_IN R_VCR_IN SIC1 SIC5 SIC6 G_TV_OUT (14053) (14053) (BA7660) G_VCR_IN G_VCR_IN B_TV_OUT Switch Switch Amplifier B_VCR_IN B_VCR_IN CVBS_VCR_OUT Fig. 5-23 5-18 Samsung Electronics...
  • Page 68 D/A CONVERTER FRONT-R FILTER VIC1 (ZiVA-3) A/V Decoder DATA2 POST AIC3 SURROUND-L FILTER AK4324 POST D/A CONVERTER SURROUND-R FILTER DATA3 POST AIC4 CENTER FILTER AK4324 POST D/A CONVERTER SUB WOOFER FILTER Fig. 5-24 Audio Output Block Diagram Samsung Electronics 5-19...
  • Page 69 The 2 channels data is converted through audio decoder 2-channel data and Data 0 and Data 1 are outputted in digital audio interface.Via IEC-958 output process, they is transmitted to digital amplifier or AC-3/MPEG/DTS amplifier built in the external digital input source with IEC-958/1937 transmission format. 5-20 Samsung Electronics...

  • Page 70: Troubleshooting

    6. Troubleshooting Samsung Electronics...
  • Page 71 Troubleshooting Samsung Electronics...
  • Page 72 Troubleshooting Samsung Electronics...
  • Page 73 Troubleshooting Samsung Electronics...
  • Page 74 Troubleshooting Samsung Electronics...
  • Page 75 Troubleshooting Samsung Electronics...
  • Page 76 Troubleshooting Samsung Electronics...
  • Page 77 Troubleshooting Samsung Electronics...
  • Page 78 Troubleshooting Samsung Electronics...
  • Page 79 Troubleshooting 6-10 Samsung Electronics...
  • Page 80 Troubleshooting Samsung Electronics 6-11...
  • Page 81 Troubleshooting 6-12 Samsung Electronics...
  • Page 82 Troubleshooting Samsung Electronics 6-13...
  • Page 83 Troubleshooting MEMO 6-14 Samsung Electronics...
  • Page 84 7-2 Deck Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Samsung Electronics...

  • Page 85: Exploded Views And Parts List

    Exploded Views and Parts List 7-1 Cabinet Assembly Samsung Electronics...
  • Page 86 SCREW-TAPTITE;BH,+,B,M3,L10,BLK,SWCH1018 6003-000276 SCREW-TAPTITE;BH,+,B,M3,L10,ZPC(YEL),SWC Refer to table below ASSY-PCB-MAIN;DVD-C700,MAIN PCB Refer to table below ASSY-PCB-JACK;DVD-C700,JACK PCB Refer to table below ASSY PCB-SMPS;DVD-C700,SMPS PCB AH63-00040A GROUND-REAR;-,PBS,T0.2,-,DVD-909 Refer to table below POWER CORD;KJ-10W,-,1.83M,CONNECTOR, Refer to table below ASSY-PCB-FRONT;DVD-C700,FRONT PCB Refer to table below ASSY PCB-KEY;DVD-C700/XAA,KEY PCB...

  • Page 87: Deck Assembly

    Exploded Views and Parts List 7-2 Deck Assembly Samsung Electronics...
  • Page 88 SHAFT-ROLLER;STS,PI1.5,RCD-C1 H514 AH66-00036A TRAY-ROULETTE;-,ABS,-,BLK,-,DP-4 H520 AH61-00333A BRACKET-WORM ASSY;-,SECC+SUM,-,-,-,-,DP- H521 AH61-00360A BRACKET-ASSY;-,SECC+SUM,-,-,-,-,DP-4,- H522 AH97-00238A ASSY-WORM MOTOR;DP-4,-,- H523 AH61-00334A SHAFT-WORM ASSY;-,SUS+POM,-,-,-,-,DP-4 H525 AH66-00040A GEAR-ROULETTE;-,POM,M0.5,60,-,-,DP-4 H526 6031-001159 WASHER-PLAIN;POLYSLIDE,-,ID3.6,OD8,T0.4, H527 AH66-00042A BELT-WORM;-,CR,-,10%,-,BLK,DP-4 H530 AH41-00129A PCB-SENSOR ASSY;DP-4,-,-,-,-,34*22*1.6T, LCN01A 3809-001152 CABLE-FLAT;30V,-20to+80C,200mm,6P,1.25mm TCN03A 3809-001153 CABLE-FLAT;30V,-20to+80C,330mm,11P,1.25m Samsung Electronics...
  • Page 89 Exploded Views and Parts List MEMO Samsung Electronics...

  • Page 90: Electrical Parts List

    8. Electrical Parts List Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark ASSY-PCB-MAIN;DVD-C700,MAIN PCB DC16 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, AAC1 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP, AAC16 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, DC23 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, AAC17 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, DC24 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP,...
  • Page 91 AH13-10030M IC-ASIC;-,KS1461,VQFP,100P,RF IC 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 RIC2 0801-002279 IC-CMOS LOGIC;74VHC4053,MUX,SOP,16P,150M 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 RIC3 1202-000121 IC-VOLTAGE COMP.;2903,SOP,8P,150MIL,DUAL 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 RIC4 1201-000163 IC-OP AMP;4560,SOP,8P,173MIL,DUAL,100V/m 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, RL01 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- RC10 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608 2703-000398 INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm RC11 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, 3301-000353 CORE-FERRITE BEAD;AB,2.0x1.25x0.9mm,-,- Samsung Electronics...
  • Page 92 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608 SR16 2007-000131 R-CHIP;91Kohm,5%,1/16W,DA,TP,1608 RR68 2007-000458 R-CHIP;18Kohm,5%,1/16W,DA,TP,1608 SR17 2007-000093 R-CHIP;20Kohm,5%,1/16W,DA,TP,1608 RR69 2007-000431 R-CHIP;16Kohm,5%,1/16W,DA,TP,1608 SR18 2007-000093 R-CHIP;20Kohm,5%,1/16W,DA,TP,1608 2007-000072 R-CHIP;47ohm,5%,1/16W,DA,TP,1608 SR19 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608 RR70 2007-000134 R-CHIP;33Kohm,5%,1/16W,DA,TP,1608 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608 RR72 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 SR20 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608 RR73 2007-000130 R-CHIP;39Kohm,5%,1/16W,DA,TP,1608 SR21 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608 Samsung Electronics...
  • Page 93 VR34 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608 VC33 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, VR35 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608 VC34 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, VR36 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608 VC35 2203-000189 C-CERAMIC,CHIP;100nF,+80-20%,25V,Y5V,TP, VR37 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608 VC36 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP, VR38 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608 VC37 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP, VR39 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608 VC38 2203-000560 C-CERAMIC,CHIP;220nF,+80-20%,25V,Y5V,TP, 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608 Samsung Electronics...
  • Page 94 VVR72 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5 VR47 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 2801-003554 CRYSTAL-UNIT;27MHz,10ppm,28-AAM,12pF,40o VR48 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 0403-001079 DIODE-ZENER;UDZ3.9B,7%,200MW,SOD-323,TP VR49 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 VR50 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 ASSY-PCB-JACK;DVD-C700,JACK PCB VR51 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 AC10 2203-000444 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,2012,- VR52 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 AC11 2202-000806 C-CERAMIC,MLC-AXIAL;220pF,10%,50V,Y5P,TP VR54 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608 AC12 2203-000595 C-CERAMIC,CHIP;0.22nF,5%,50V,NP0,TP,2012 VR55 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608...
  • Page 95 AQ15 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT- AR25 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012 AQ16 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT- AR26 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012 AQ17 0504-000118 TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TO- AR27 2007-000300 R-CHIP;10KOHM,5%,1/10W,DA,TP,2012 AQ18 0504-000118 TR-DIGITAL;KSR1003,NPN,300MW,22K/22K,TO- AR28 2001-000003 R-CARBON;330ohm,5%,1/8W,AA,TP,1.8x3.2mm AQ19 0504-001003 TR-DIGITAL;KSR2003,PNP,300MW,22K/22K,TO- AR29 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT- AR30 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3.2MM Samsung Electronics...
  • Page 96 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM SCE17 2401-001353 C-AL;470uF,20%,10V,GP,TP,8x11.5,5 PAL ONLY AR95 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M SCE2 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m PAL ONLY AR96 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M SCE3 2401-000369 C-AL;100UF,20%,6.3V,GP,-,6.3X11,5 PAL ONLY AR97 2001-000878 R-CARBON;6.2KOHM,5%,1/8W,AA,TP,1.8X3.2M SCE4 2401-002299 C-AL;4.7uF,20%,50V,GP,TP,5x7,5 PAL ONLY AR98 2007-001055 R-CHIP;6.2KOHM,5%,1/10W,DA,TP,2012 SCE5 2401-000913 C-AL;22uF,20%,16V,GP,TP,5x11mm,2.5m PAL ONLY Samsung Electronics...
  • Page 97 R-CHIP;33KOHM,5%,1/10W,DA,TP,2012 PAL ONLY VZD11 0403-001211 DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D NTSC ONLY SCR51 2007-000774 R-CHIP;33KOHM,5%,1/10W,DA,TP,2012 PAL ONLY VZD12 0403-001211 DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D NTSC ONLY SCR52 2007-000774 R-CHIP;33KOHM,5%,1/10W,DA,TP,2012 PAL ONLY VZD13 0403-001211 DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D NTSC ONLY SCR53 2007-000981 R-CHIP;5.6KOHM,5%,1/10W,DA,TP,2012 PAL ONLY VZD14 0403-001211 DIODE-ZENER;MTZJ12B,11.44-12.03V,500MW,D NTSC ONLY Samsung Electronics...
  • Page 98 2201-000812 C-CERAMIC,DISC;2.2nF,20%,400V,Y5U,BK,12. PE13 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5 RC13 2201-000812 C-CERAMIC,DISC;2.2nF,20%,400V,Y5U,BK,12. 2401-001682 C-AL;82uF,20%,400V,GP,BK,22x25,10mm RL03 3301-000297 CORE-FERRITE BEAD;AA,3.6x1.2x5.7mm,1400, PE31 2401-000302 C-AL;100uF,20%,25V,GP,TP,6.3x11,5 PE32 2401-001998 C-AL;1000uF,20%,25V,GP,TP,10x20,5mm ASSY-PCB-FRONT;DVD-C700,FRONT PCB PE33 2401-000133 C-AL;1000uF,20%,16V,GP,TP,10x20,5 FC01 2202-000807 C-CERAMIC,MLC-AXIAL;22nF,+80-20%,25V,Y5V PE35 2401-000360 C-AL;100uF,20%,50V,GP,TP,8x11.5,5 FC02 2202-000807 C-CERAMIC,MLC-AXIAL;22nF,+80-20%,25V,Y5V PE36 2401-000133 C-AL;1000uF,20%,16V,GP,TP,10x20,5 FC03 2202-000807 C-CERAMIC,MLC-AXIAL;22nF,+80-20%,25V,Y5V...
  • Page 99 FSW06 3404-000165 SWITCH-TACT;12V,50mA,160gf+-50gf,6x6mm,S 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5 2802-000108 RESONATOR-CERAMIC;12MHZ,0.5%,BK,10.0X5.0 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5 VFD1 AH07-00014A VF-DISPLAY;-,-,25X104MM,DVD-909/DOM 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5 FIC1 AH09-00010C IC MICOM;LC866232,SANYO,100PIN,QFP,QIP, ASSY PCB-KEY;DVD-C700/XAA,KEY PCB FIC2 1203-001252 IC-VOL. DETECTOR;7545,TO-92,3P,-,PLASTIC 2203-000389 C-CERAMIC,CHIP;0.015nF,5%,50V,NP0,TP,201 FIC3 0801-002166 IC-CMOS LOGIC;7SHU04,INVERTER,SSOP,5P,63 FCN03 3711-004388 CONNECTOR-HEADER;NOWALL,8P,2R,2mm,ANGLE, 2701-000114 INDUCTOR-AXIAL;10uH,10%,2.5x3.4mm FCN03A 3711-004388 CONNECTOR-HEADER;NOWALL,8P,2R,2mm,ANGLE, FLD01 0601-001238 LED;ROUND,RED,3.1mm,697nm...
  • Page 100 H530 AH41-00129A PCB-SENSOR ASSY LC01 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V LC02 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-20%,50V,Y5V LCN01 3708-001443 CONNECTOR-FPC/FC/PIC;6P,1.25mm,ANGLE,SN LCN01A 3809-001152 CABLE-FLAT;30V,-20to+80C,200mm,6P,1.25mm LCN02 3711-000826 CONNECTOR-HEADER;BOX,2P,1R,2mm,ANGLE,SN LR01 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM LR02 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X3.2MM LR03 2001-000660 R-CARBON;33KOHM,5%,1/8W,AA,TP,1.8X3.2MM LR04 2001-000660 R-CARBON;33KOHM,5%,1/8W,AA,TP,1.8X3.2MM LSS01 AH32-00002A SENSOR-ROULETTE;-,-,DP-4,-,-,-,-,-,- LSS02 0604-001005 PHOTO-INTERRUPTER;TR,-,-,DIP-4,BK Samsung Electronics 8-11...
  • Page 101 Electrical Parts List MEMO 8-12 Samsung Electronics...

  • Page 102: Block Diagrams

    (AK4324) Sled Motor Driver Audio DAC VIC4/10 32M SDRAM DIC1 (KS1453) AIC1 DVD & CD Processor (AK4324) Audio DAC VIC1 SIC1 (ZiVA-3) (KS1452) A/V Decoder AMP/VR HEAD PHONE Digital Servo CVBS1 CVBS2 Yout VIC50 Cout (SAA7128) Video Encoder Samsung Electronics...
  • Page 103 VIC4/10 32M SDRAM Sled Motor Driver Audio DAC DIC1 (KS1453) AIC1 DVD & CD Processor (AK4324) Audio DAC VIC1 SIC1 (ZiVA-3) (KS1452) AMP/VR HEAD PHONE A/V Decoder Digital Servo CVBS1 CVBS2 Yout VIC50 Cout (SAA7128) Video Encoder SCART JACK Samsung Electronics...
  • Page 104 10-9 Motor - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 10-8 Samsung Electronics 10-1...

  • Page 105: Pcb Diagrams

    PCB Diagrams 10-1 Main 10-2 Samsung Electronics...

  • Page 106: Jack

    PCB Diagrams 10-2 Jack Samsung Electronics 10-3...
  • Page 107 PCB Diagrams 10-3 S.M.P.S. 10-4 Samsung Electronics...

  • Page 108: Front

    PCB Diagrams 10-4 Front Samsung Electronics 10-5...

  • Page 109: Key

    PCB Diagrams 10-5 Key 10-6 Samsung Electronics...
  • Page 110 PCB Diagrams 10-6 Head Phone 10-7 Deck COMPONENT SIDE SOLDER SIDE Samsung Electronics 10-7...
  • Page 111 PCB Diagrams 10-8 Sensor 10-9 Motor 10-8 Samsung Electronics...

  • Page 112: Wiring Diagram

    11. Wiring Diagram JACK PCB DECK PCB S.M.P.S. PCB MAIN PCB SENSOR PCB SWITCH PCB MOTOR PCB FRONT PCB KEY PCB HEAD PHONE PCB Samsung Electronics 11-1...
  • Page 113 Wiring Diagram MEMO 11-2 Samsung Electronics...

  • Page 114: Schematic Diagrams

    12-18 Remote Control - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 12-19 Jack PCB (Conductor Side) Samsung Electronics 12-1...
  • Page 115 Schematic Diagrams 12-1 S.M.P.S. 12-2 Samsung Electronics...

  • Page 116: Main Power Supply

    Schematic Diagrams 12-2 Main Power Supply Samsung Electronics 12-3...

  • Page 117: Main Micom

    Schematic Diagrams 12-3 Main Micom 12-4 Samsung Electronics...

  • Page 118: Servo

    Schematic Diagrams 12-4 Servo Samsung Electronics 12-5...

  • Page 119: Video Encoder

    Schematic Diagrams 12-5 Video Encoder 12-6 Samsung Electronics...

  • Page 120: Video

    Schematic Diagrams 12-6 Video CVBS Output Y Output C Output Samsung Electronics 12-7...

  • Page 121: Audio Dac

    Schematic Diagrams 12-7 Audio DAC 12-8 Samsung Electronics...

  • Page 122: Audio

    Schematic Diagrams 12-8 Audio Samsung Electronics 12-9...
  • Page 123 Schematic Diagrams 12-9 RF 12-10 Samsung Electronics...

  • Page 124: Ziva

    Schematic Diagrams 12-10 ZiVA Samsung Electronics 12-11...

  • Page 125: Dsp

    Schematic Diagrams 12-11 DSP 12-12 Samsung Electronics...

  • Page 126: Front Micom/Vfd Display

    Schematic Diagrams 12-12 Front Micom/VFD Display Samsung Electronics 12-13...

  • Page 127: Scart Jack (Europe Only)

    Schematic Diagrams 12-13 Scart Jack (Europe Only) G Output (Scart Jack) B Output (Scart Jack) R Output (Scart Jack) 12-14 Samsung Electronics...

  • Page 128: Head Phone

    Schematic Diagrams 12-14 Head Phone Samsung Electronics 12-15...

  • Page 129: Key

    Schematic Diagrams 12-15 Key 12-16 Samsung Electronics...

  • Page 130: Deck

    Schematic Diagrams 12-16 Deck Samsung Electronics 12-17...

  • Page 131: Deck Control

    Schematic Diagrams 12-17 Deck Control 12-18 Samsung Electronics...

  • Page 132: Remote Control

    Schematic Diagrams 12-18 Remote Control Samsung Electronics 12-19...
  • Page 133 Schematic Diagrams MEMO 12-20 Samsung Electronics...

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