Table Of Contents - Sony ICD-MX20DR9 Service Manual

ICD-MX20DR9

TABLE OF CONTENTS

1. GENERAL
................................................................... 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 5
2-2. Chassis (Microphone) Assembly ..................................... 5
2-3. Center Mic (MIC302), Side Mic (MIC301, MIC303) .... 6
2-4. Case (Front) Assembly .................................................... 6
2-5. Speaker (SP3001) Assembly ........................................... 7
2-6. Case (Rear), Ornamental Belt (L), Ornamental Belt (R)
2-7. SWITCH Board ............................................................... 8
2-8. MAIN Board, Switch Unit .............................................. 8
2-9. AUDIO Board, MEMORY Board ................................... 9
3. TEST MODE
............................................................... 10
4. DIAGRAMS
4-1. Block Diagram - MAIN Section-1 - ............................. 13
4-2. Block Diagram - MAIN Section-2 - ............................. 14
4-3. Block Diagram - PANEL Section - ............................... 15
4-4. Printed Wiring Board - MAIN Board (Side A) - ........... 16
4-5. Printed Wiring Board - MAIN Board (Side B) - ........... 17
4-6. Schematic Diagram - MAIN Board (1/4) - ................... 18
4-7. Schematic Diagram - MAIN Board (2/4) - ................... 19
4-8. Schematic Diagram - MAIN Board (3/4) - ................... 20
4-9. Schematic Diagram - MAIN Board (4/4) - ................... 21
4-10. Printed Wiring Board - AUDIO Board - ....................... 22
4-11. Schematic Diagram - AUDIO Board - .......................... 23
4-12. Printed Wiring Board - MEMORY Board - .................. 24
4-13. Schematic Diagram - MEMORY Board - ..................... 25
4-14. Printed Wiring Board - SWITCH Board - .................... 26
4-15. Schematic Diagram - SWITCH Board - ....................... 27
5. EXPLODED VIEWS
5-1. Case (Front) Assembly,
Chassis (MIC) Assembly Section .................................... 29
5-2. Case (Rear) Assembly Section ........................................ 30
6. ELECTRICAL PARTS LIST
Trademarks
• Microsoft, Windows and Outlook are trademarks of
Microsoft Corporation, registered in the USA and
other countries.
Copyright ©1995 Microsoft Corporation.
All rights reserved.
Portion Copyright ©1995 Microsoft Corporation
• Apple and Macintosh are trademarks of Apple
Computer Inc., registered in the USA and other
countries.
• Pentium is a registered trademark of Intel Corporation.
• NaturallySpeaking, Dragon Systems are trademarks
owned by ScanSoft, Inc. and are registered in the
United States and/or other countries.
• All other trademarks and registered trademarks are
trademarks or registered trademarks of their
respective holders. Furthermore, "™" and "
mentioned in each case in this manual.
The "Digital Voice Editor" uses software modules as
shown below:
® ®
Microsoft DirectX
©2001 Microsoft Corporation. All rights reserved.
2
7
.................................. 31
® " are not
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Replacement of IC6001, IC8101 and IC8201 used in this set
requires a special tool.
• The voltage and waveform of CSP (chip size package) cannot
be measured, because its lead layout is different from that of
conventional IC.
• Lead layouts
Lead layout of
conventional IC
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder. Operating instructiondd
surface
CSP (chip size package)