THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• Y : parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Parts face side:
Parts on the parts face side seen from
(SIDE A)
the pattern face are indicated.
Pattern face side:
Parts on the pattern face side seen from
(SIDE B)
the parts face are indicated.
• MAIN and SW boards are multi-layer printed board.
However, the patterns of intermediate-layers have not
been included in diagrams.
• Indication of transistor.
C
Q
These are omitted.
B
E
• Lead layouts
Lead layout of conventional IC
CSP (Chip Size Package)
NWZ-A726/A726B/A728/A728B/A729
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise
4
specifi ed.
• C : panel designation.
• A : B+ Line.
• Power voltage is dc 3.7 V and fed with regulated dc pow-
er supply from CN901 pin 1 and pin 2 on the MAIN
board.
• Voltages and waveform are dc with respect to ground un-
der no-signal conditions.
no mark : PLAY BACK
• Waveform is taken with a oscilloscope.
Voltages variation may be noted due to normal production
tolerances.
• Voltages are taken with a VOM (Input impedance 10
MΩ).
• Voltage variations may be noted due to normal production
tolerances.
• Circled number refer to waveform.
• Signal path.
surface
F
: AUDIO
L
: VIDEO
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
19
19
NWZ-A726/A726B/A728/A728B/A729