Hitachi 51UWX20B Service Manual page 80

CAUTIONS WHEN CONNECTING/DIS CONNECTING THE HV CONNECTOR
During Removal
1. Roll out silicon cover from FBT's
contact area slowly.
2. While turning the connector about
90 degrees following the arrow
Silicon cover
(0 position). push the connector
slightly towards the case. (Fig.A)
L position
PS process
0
During Insertion
1. Please refer to direction for insertion as shown in Fig.B
(L position) Insert connector till "CLICK" sound is heard.
2. Make sure the connector is pressed right in, so that it
has a good contact with the spring.
Fig. A
3. Confirm the contact by pulling the connector slightly.
3. Pemove the connector slowly by (Don't pull hard because it may damage the connector.)
pulling it away from the case. 4. Cover the high voltage output by carefully pushing
silicon cover on to it. (Don't turn the connector.)
(REMARK)
1. Make sure the silicon cover is
covered the high voltage output.
AUTO SET UP SENSOR(EASO~EAS7)ASY.
1. CAUSES OF THE DAMAGE ON CHARACTERISTICS
Mainly 2 possibilities can be considered as major causes of
failure in charactenstics of amorphous silicon solar cell.
One possibility is mechanical stress against thin film and
the another is electrostatic damage on thin film.
Damage of thin film caused by mechanical stress is the
phenomenon like as following example. Certain sharp edged
tool makes a scratch at the place where resin is coated on
the cell backside. Because of this scratch, a pin-hole can be
created in the thin film, then affect open circuit voltage(Voc)
of cell in the rnd. Please refer to the page X/Y in which
possible mechanical damage to the thin film is described by
illustration.
On the other hand, electrostatic damage to the thin film is the
phenomenon that static electricity generated by some friction
between trays made of inconductive material affects of cell and
cause the decrease in open circuit voltage.
2. CAUTION IN HANDLING
There is a possibility that the resin on cell backside can be
scratched by certain sharp edged tool. Please pay necessary
attention on this point during handling. Also, in order to
prevent electrostatic damage to the thin film caused by friction
of trays made of inconductive material please make sure to use
to only kyocera's trays made of conductive material until start
assembling amorphous silicon solar cell.
Please make sure using surgical finger caps or tweezers while
handling cells. Do not touch the cells with naked fingers!
3. DROPPED CELL
When a cell is dropped to somewhere, please check open circuit
voltage by using voltage tester under FL2OOLux and check whether
Voc is over 0.5V or not. If Voc is less than 0.5V, please do not
use such cell as there is a high possibility that the thin film
is damaged at the time of drop.
DP23/DP23G FINAL WIRING DRAWING
(UFPK) FOCUS PACK ASY.
CONNECT EACH COLOR
SCREEN LEAD FROM CPT P.W.B.
LEAD COLOR:ORANGE
wing CONNECT EACH COLOR
wing
FOCUS LEAD FROM CPT P.W.B.
LEAD COLOR:IVORY
L position
CONNECT[FS]CONNECTOR
FROM FBT.
Fig.B
FOCUS PACK
BACK SIDE
(DF1)CONNECTOR BLACK
(DF1)CONNECTOR RED
Silicon Cover
(NFP1)UL TUBE No.3 L=50mm
less than 1mm
F.B.T
4. WIRING METHOD FOR SOLDERING TYPE TERMINALS
A. TOOLS
1) Soldering iron : Small tip type(EX.11.5W pen type)
2) Transformer : As long as voltage is adjustable in the range
of 70 to 100V. it would be sufficient.
If there is a voltage adjustable fuction in
the soldering iron. transformer is unnecessary.
3) Wire type solder:Less flux type solder is neceesary.
B. WIRING
1) Set the voltage of trasformer in the range of 70 to 100V and
wait 10 minutes. After 10 minutes from this setting, start
solderning work.
(Temperture of soldering iron tip should be 230 C. Find out
appropriate voltage in the range of 70 to 100V which can
realize maximum productivity in soldering work.)
2) Put the exposed part of lead wire onto soldering foundation
and connect lead wire with the terminal by melting soldering
foundation with soldering iron.
(Soldering duration should be within 2 seconds.)
3) When lead wire can not be soldered well, apply soldering iron
tip again for 1 second, then repeat this work several times
until lead wire is well connected with the terminal. Do not
apply soldering longer than 2 seconds.
4) Clean up stain and solder from the soldering iron tip every 3
to 5 times of soldering work.
5. ASSEMBLY OF SILICON SENSOR
1) SENSOR POLARITY
BACK SIDE
FRONT SIDE
P#:FT00011
- TERMINAL + TERMINAL
80
NOTE:(3) CPT SOCKET HOLDER ASSEMBLY.(R.G.B)
CPT SOCKET HOLDER ASSEMBLY SHOULD
BE FOLLOWED BELOW DIAG.
PAINT EACH COLOR
#234
GREEN RED
BLUE
CPT SOCKET
HLD BAND
BLUE GREEN RED
PAINT EACH COLOR
#231
CPT SOCKET HOLDER
WRAPPING & SOLDER
(NFP2)SK BAINDER
2) SOLDERING SENSOR & WIRE
SOLDERING
P#:FT00011
CONNECTOR No.1 PIN
(PRINTED WIRE SIDE)
(COLOR BAND SIDE)
CONNECTOR No.2 PIN
3) WIRE STRIP SPECIFICATION
PRESOLDERING
4mm+/-1
4) SENSOR INSERT DIRECTION TO HOLDER
SENSOR BACK SIDE
SENSOR FRONT SIDE
[SIDE VIEW] [BACK VIEW]
HOLDER
CONNECTOR AND SENSOR ASY.
EAS0 EAS1
PIN#2 PIN#3 PIN#5 PIN#6
(ES1)P#EF02233
PH 9PIN
P#FT00011
P#FT00011
P#FT00011
PIN#8
PIN#9
EAS2
EAS6 EAS7
PIN#2 PIN#3
PIN#5 PIN#6
(ES3)P#EF02253
PH 6PIN
P#FT00011
P#FT00011
EAS3 EAS4
PIN#2 PIN#3 PIN#5 PIN#6
(ES2)P#EF02242
PH 10PIN
P#FT00011 P#FT00011
P#FT00011
PIN#8
PIN#9
EAS5
DP23/23G/24