Table Of Contents - Sony KLV-21SR2 Service Manual

1. DISASSEMBLY ...................................... 1-1
1-1. REAR COVER AND STAND ASSY REMOVAL
1-2. REAR CABINET ASSY REMOVAL .................... 1-1
1-3. H1 BOARD REMOVAL ....................................... 1-2
1-4. D2 BOARD REMOVAL ....................................... 1-2
1-5. U1 BOARD REMOVAL ....................................... 1-3
1-6. G BOARD REMOVAL ......................................... 1-3
1-7. A AND TU BOARDS REMOVAL ........................ 1-4
1-8. B BOARD REMOVAL ......................................... 1-4
1-9. H3 BOARD REMOVAL ....................................... 1-5
1-10. H4 BOARD REMOVAL ..................................... 1-5
1-11. H2 BOARD REMOVAL ..................................... 1-6
2. ADJUSTMENTS .................................... 2-1
2-1. Adjustment of signal level. .................................. 2-1
2-1-1. Check AD calibration registration items. ........... 2-1
2-1-2. Y signal AD calibration of 2163 decode. ........... 2-1
2-1-3. C signal AD calibration of 2163 decode. ............ 2-1
2-1-4. Check AD calibration registration items. ........... 2-2
2-1-5. Y signal AD calibration of CCP2 decode. .......... 2-2
2-1-6. C signal AD calibration of CCP2 decode. .......... 2-2
2-2. White Balance Adjustment ................................. 2-2
2-2-1. White Balance of color temperature "normal" ... 2-2
2-2-2. White Balance of color temperature "cool" ........ 2-3
2-2-3. White Balance of color temperature "warm" ..... 2-3
3. DIAGRAMS ............................................ 3-1
3-1. CIRCUIT BOARDS LOCATION ......................... 3-1
3-2. SCHEMATIC DIAGRAMS AND PRINTED
WIRING BOARDS .............................................. 3-1
(1) A Board ................................................................. 3-2
(2) B Board ................................................................. 3-7
(3) D2 Board ............................................................... 3-14
(4) G Board ................................................................. 3-15
(5) H1, H2 Boards ...................................................... 3-16
(6) H3, H4 Boards ...................................................... 3-17
(7) TU Board ............................................................... 3-18
(8) U1 Board ............................................................... 3-19
3-3. SEMICONDUCTORS ......................................... 3-20
4. EXPLODED VIEWS ............................... 4-1
4-1. CHASSIS ............................................................ 4-2
4-2. PACKING MATERIALS (Made in Spain) ........... 4-4
4-3. PACKING MATERIALS (Made in Japan) ........... 4-5
5. ELECTRICAL PARTS LIST................... 5-1

TABLE OF CONTENTS

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KLV-21SR2 (AEP) 4