THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(SIDE B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(SIDE A)
the parts face are indicated.
• Indication of transistor.
C
Q
These are omitted.
B
E
• Lead layouts
Lead layout of conventional IC
CSP (Chip Size Package)
• Abbreviation
LA
: Latin American model
ICD-UX71/UX71F/UX81/UX81F/UX91F
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
•
: internal component.
f
• C : panel designation.
Note: The components identifi ed by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specifi ed.
• A : B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : REC
(
) : PLAY
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
surface
• Signal path.
J
: AUDIO (DIGITAL)
F
: AUDIO (ANALOG)
: MIC
L
g : FM
c
: USB
• Abbreviation
LA
: Latin American model
13
13
ICD-UX71/UX71F/UX81/UX81F/UX91F