Samsung SGH-Q105 Service Manual page 2

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1. SGH-Q105 MAIN Electrical Parts List
Level SEC Code
0
GH92-00976A -
1
3002-001103 AU501
1
2404-001134 C1001, C1002, C1003
1
2203-001239 C1005, C1015, C1023
1
2203-000696 C1006, C1016, C1020
1
2203-000254 C1008, C1009, C1019
1
2203-005571 C101, C103, C105, C112
1
2203-000466 C1010, C1050
1
2203-000995 C1011, C309, C942, C951
1
2203-000233 C1012, C1036, C1037
1
2203-000812 C1013, C1045, C211
1
2203-001072 C1014
1
2203-001124 C1017, C1024, U1011
1
2203-005065 C102, C104, C106, C110
1
2203-000628 C1021, C1035, C611
1
2203-000696 C1022
1
2203-000254 C1028, C1030, C111
1
2203-000278 C1029, C784
1
2203-000425 C1031, C938
1
2203-005061 C1033, C115, C201, C203
1
2203-000233 C1038, C1039, C1041
1
2203-001259 C1044
1
2404-001105 C107, C108, C117, C205
1
2203-005065 C113, C120, C204, C303
1
2203-002494 C116
1
2203-000233 C118, C617, C618, C619
1
2203-000254 C119, C510, C602, C603
1
2203-005496 C121
1
2203-005571 C126
1
2203-005562 C202
1
2404-001105 C206, C966
1
2203-005061 C207, C208, C210, C315
1
2203-000812 C212, C213, C214, C215
Design LOC
PBA MAIN-SGHQ105;SGH-Q105, LA, US A, -, -, -, -, -, -
BUZZER-MAGNETIC;93dB, 3.6 V, 90 m A, 2, 550Hz, BK
C-T A, CHIP;100 uF, 20 %, 6.3 V, LZ, TP, 4028
C-CERAMIC, CHIP;0.082 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP;0.002 nF, 0.25 pF, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP;10 nF, 10 %, 16 V, X7R, TP, 1005, -
C-CERAMIC, CHIP;10000 nF, +80-20 %, 6.3 V, Y5 V, TP, 2012
C-CERAMIC, CHIP;0.001 nF, 0.25 pF, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP;0.047 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP;0.1 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP;0.033 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP;0.056 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP;680 pF, 10 %, 50 V, X7R, TP, 1005, -
C-CERAMIC, CHIP;1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
C-CERAMIC, CHIP;0.022 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP;0.002 nF, 0.25 pF, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP;10 nF, 10 %, 16 V, X7R, TP, 1005, -
C-CERAMIC, CHIP;0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP;0.018 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP;100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP;0.1 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP;0.008 nF, 0.5 pF, 50 V, NP0, TP, 1005
C-T A, CHIP;10 uF, 20 %, 6.3 V, GP, TP, 2012
C-CERAMIC, CHIP;1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
C-CERAMIC, CHIP;470 nF, 10 %, 16 V, X7R, TP, 2012
C-CERAMIC, CHIP;0.1 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP;10 nF, 10 %, 16 V, X7R, TP, 1005, -
C-CERAMIC, CHIP;220 nF, +80-20 %, 10 V, Y5 V, TP, 1005
C-CERAMIC, CHIP;10000 nF, +80-20 %, 6.3 V, Y5 V, TP, 2012
C-CERAMIC, CHIP;10000 nF, +80-20 %, 10 V, Y5 V, TP, 3216
C-T A, CHIP;10 uF, 20 %, 6.3 V, GP, TP, 2012
C-CERAMIC, CHIP;100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP;0.033 nF, 5 %, 50 V, NP0, TP, 1005
SAMSUNG Proprietary-Contents may change without notice
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