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Circuit Description
2-6 AUDIO
2-6-1 Audio Inputs
The Handset provides two audio inputs:
¥ Built in microphone
¥ Connection for external microphone
A microphone biasing amplifier reduces component count in the overall system design:
¥ Supply: 2.2 V regulated to ±20 %
¥ Different output to eliminate possible coupling noise problems, MICBIASP and MICBIASN
¥ Maximum current: 500 uA
¥ Maximum load: 200 pF
2-7 EXTERNAL INTERFACE
A 18 pin connector is mounted on the bottom corner of the PCB. The antenna external connection is on the
right hand side of this connector.
2-8 KERNEL SPECIFICATION
2-8-1 FEATURES
¥ Complete Layer 1 support
¥ TDMA burst building (ETSI Rec.5-02)
¥ Coding and interleaving (Rec. 5-03)
¥ GMSK with differential coding (Rec. 5-04)
¥ Programmable power template for Tx burst control
¥ AGC in Receive mode
¥ I,Q inputs or single intermediate frequency (IF) input
¥ Detection of FCCH, SCH, Normal and Dummy Bursts
¥ Flash ROM programming abilities
¥ Auxiliary ADC for battery voltage and temperature monitoring
2-6
Samsung Electronics
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