Product Description; Overview; Feature Summary - Intel DQ77CP Specification

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Product Description

1.1

Overview

1.1.1

Feature Summary

Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Graphics
Audio
Micro-ATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
rd ®
• 3 generation Intel Core processor family and 2
processor family processors with up to 95 W TDP in an LGA1155 socket
― One PCI Express* 3.0 x16 graphics interface
― Integrated memory controller with dual channel DDR3 memory support
― Integrated graphics processing (processors with Intel
― External graphics interface controller
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory
• Support for XMP memory
Note: DDR3 1600 MHz DIMMs are only supported by 3
processor family processors
®
Intel Q77 Express Chipset consisting of the Intel
Controller Hub (PCH)
• Integrated graphics support for processors with Intel
― VGA
― DVI-D
• Support for a PCI Express 3.0 x16 add-in graphics card
Note: PCI Express 3.0 is only supported by 3
processor family processors
8-channel (6+2) Intel High Definition Audio via the Realtek* ALC892 audio codec
nd ®
generation Intel Core
® HD Graphics)
rd
generation Intel Core
®
Q77 Express Platform
® Graphics Technology:
rd
generation Intel Core
continued
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