Product Description; Overview; Feature Summary - Intel BLKDP67DE Specification

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Product Description

1.1

Overview

1.1.1

Feature Summary

Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Graphics
Audio
Peripheral
Interfaces
MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
• Intel ® Core™ i7, Intel ® Core™ i5, and Intel
95W TDP in an LGA1155 socket
― One PCI Express* 2.0 x16 graphics interface
― Integrated memory controller with dual channel DDR3 memory support
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 32 GB of system memory with four DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
®
Intel P67 Express Chipset consisting of the Intel
Controller Hub (PCH)
Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
10-channel (7.1 + 2) Intel High Definition Audio via the Realtek ALC892 audio
codec
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Fourteen USB 2.0 ports:
― Six ports are implemented with stacked back panel connectors (black)
― Eight front panel ports implemented through four internal headers
• Two SATA 6.0 Gb/s interfaces through Intel P67 Express Chipset with Intel
Rapid Storage Technology RAID support (blue)
• Four Serial ATA (SATA) 3.0 Gb/s interfaces through Intel P67 Express Chipset
with Intel Rapid Storage Technology RAID support:
― Two internal SATA ports (black)
― One internal eSATA port (red)
― One back panel eSATA port (red)
• Two IEEE 1394a ports:
― One port via a back panel connector
― One port via an internal header for front panel cabling
® Core™ i3 processors with up to
®
P67 Express Platform
®
continued
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