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4-1.
SECTION
4
MOUNTING DIAGRAM
DIAGRAMS
e Refer to page 14 for semiconductor lead layouts and location.
TC-D3/WM-D3
TC-D3/WM-D3
1
2
3
4
~)
6
a
TC-D3/WM-D3
TC-D3/WM-D3
e
[MAIN
BOARD]
(CONDUCTOR
SIDE)
@
[MAIN
BOARD]
(COMPONENT
SIDE)
: Component-side
Pattern.
: Conductor-side Pattern.
14
15
16
una
)
$902
2.
(FF/REW)
~
D>
YEL
{MAIN BOARD]
(COMPONENT SIDE)
vio
"=
FG90!
FG COIL
DRY BATITERY
SIZE"AA"
(EC DESIGNATION R6)
2PCS, 3N
Z,
Zz,
18
19
20
TOTAL
CURRENT
P8 :120mA
FF .100mA
RaW: 70mA
RFC: HOmA
HES!
ERASE
HEAD
22
|
24
29
NORM:(0)
Cr02
ME TAL{PB)
(0.7)
MgO!
MOTOR
MNR-IGOIA
Cy
NOAMHL8I%
Cho2 | 448 454)
a
Sa.
Hen
eee
@ (ea
102
O85
» (Poise
=
ge
s
eee
tone
e e
sea
Ree
part mounted
on the conductor si
Through hole.
26
parts extracted from the conduct
r side.
e.
PAUSE +—
J302
af
28
29
{R
(CC
C | BOARD)
DMPONENT SIDE)
(REC | BOARD)
(CONDUCTOR SIDE
=
NI
NE-OU
ca)
(pe ony)
J303
EITAL(PB)
S303
ON
—
RV30i
31
Le
( MECHANISM
CHASSIS)
(GRY)
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