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Murata GJM0335C1E6R1CB01 Series Reference Sheet page 16

Chip monolithic ceramic capacitor high-q type for general

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5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips
or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide support pins on the back side of the PCB to prevent warping or flexing.
Install support pins as close to the test-probe as possible.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[Not Recommended]
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
[Bending]
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router
type separator, etc.) to prevent the mechanical stress that can occur to the board.
Board Separation Method
Level of stress on board
Recommended
Hand and nipper
separation apply a high
Notes
level of stress.
Use another method.
* When a board separation jig or disc separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
JEMCGC-2703M
Peeling
Test-probe
Hand Separation
(1) Board Separation Jig
Nipper Separation
High
×
· Board handling
· Board bending direction
· Layout of capacitors
[Recommended]
Support Pin
[Twisting]
2) Disc Separator
Medium
Medium
△*
· Board handling
· Layout of slits
· Design of V groove
· Arrangement of blades
· Controlling blade life
16
Test-probe
1A
Board Separation Apparatus
3) Router Type Separator
Low
△*
Board handling
!
Caution

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