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Murata GJM0335C1E3R5BB01 Series Reference Sheet page 2

Chip monolithic ceramic capacitor high-q type for general

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■ Specifications and Test Methods
No
Item
1
Rated Voltage
2
Appearance
3
Dimension
4
Voltage proof
5
Insulation Resistance(I.R.)
6
Capacitance
7
Q
8
Temperature Characteristics
of Capacitance
9
Adhesive Strength
of Termination
10 Vibration
Appearance
Capacitance
Q
11 Substrate
Appearance
Bending test
Capacitance
Change
12 Solderability
JEMCGS-0004M
Specification
Shown in Rated value.
No defects or abnormalities.
Within the specified dimensions.
No defects or abnormalities.
C≦0.047µF:More than 10000MΩ
C>0.047µF:More than 500Ω·F
C:Nominal Capacitance
Shown in Rated value.
30pF and over:Q≧1000
30pF and below:Q≧400+20C
C:Nominal Capacitance(pF)
Nominal values of the temperature coefficient is shown in Rated value. The capacitance change should be measured after 5 minutes
But,the Capacitance Change under 20℃ is shown in Table A.
Capacitance Drift
Within +/-0.2% or +/-0.05pF
(Whichever is larger.)
No removal of the terminations or other defect
should occur.
No defects or abnormalities.
Within the specified initial value.
Within the specified initial value.
No defects or abnormalities.
Within +/-5% or +/-0.5pF
(Whichever is larger)
95% of the terminations is to be soldered evenly and continuously.
The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
P-P
O-P
V
or V
within the rated voltage range.
Visual inspection.
Using Measuring instrument of dimension.
Measurement Point
Test Voltage
Applied Time
Charge/discharge current : 50mA max.
Measurement Point    : Between the terminations
Measurement Voltage : DC Rated Voltage
Charging Time
Charge/discharge current : 50mA max.
Measurement Temperature : Room Temperature
Measurement Temperature : Room Temperature
Capacitance
C≦1000pF
at each specified temp. stage.
Capacitance value as a reference is the value in step 3.
The capacitance drift is calculated by dividing the differences
between the maximum and minimum measured values in the
step 1,3 and 5 by the cap. value in step 3.
Step
Temperature(C)
1
Reference Temp.+/-2
2
Min. Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max. Operating Temp.+/-3
5
Reference Temp.+/-2
Solder the capacitor on the test substrate shown in Fig.3.
Holding Time
Applied Direction : In parallel with the test substrate and vertical with
Solder the capacitor on the test substrate shown in Fig.3.
Kind of Vibration
Total amplitude
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
Solder the capacitor on the test substrate shown in Fig.1.
Pressurization method : Shown in Fig.2
Flexure 
Holding Time
Soldering Method
Test Method
Flux
Preheat
Solder
Solder Temp.
Immersion time
2
Test Method
(Ref. Standard:JIS C 5101, IEC60384)
, whichever is larger, should be maintained
: Between the terminations
: 300% of the rated voltage
: 1s to 5 s
: 2 min
Frequency
Voltage
1.0+/-0.1MHz 0.5 to 5.0Vrms
Step
Temperature(C)
1
Reference Temp.+/-2
2
Min. Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max. Operating Temp.+/-3
5
Reference Temp.+/-2
Type
Applied Force(N)
GJM02
1
GJM03
2
GJM15
5
: 10+/-1s
the capacitor side.
: A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
: 1.5mm
   : 1mm
:
5+/-1s
: Reflow soldering
: Solder bath method
Solution of rosin ethanol 25(mass)%
: 80℃ to 120℃ for 10s to 30s
: Sn-3.0Ag-0.5Cu
: 245+/-5℃
: 2+/-0.5s

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