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Only Reflow Soldering
Chip Monolithic Ceramic Capacitor High-Q Type for General
GJM1555C1H8R5DB01_ (0402, C0G:EIA, 8.5pF, DC50V)
_: packaging code
1.Scope
This product specification is applied to Chip Monolithic Ceramic Capacitor High-Q Type used for General Electronic equipment.
This product is applied for Only Reflow Soldering.
2.MURATA Part NO. System
(Ex.)
GJM
15
(1)L/W
Dimensions
3. Type & Dimensions
(1)-1 L
(1)-2 W
1.0±0.05
0.5±0.05
4.Rated value
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
Temp. coeff
or Cap. Change
0±30 ppm/°C
5.Package
mark
(8) Packaging
f180mm Reel
D
PAPER W8P2
f180mm Reel
W
PAPER W8P1
f330mm Reel
J
PAPER W8P2
Product specifications in this catalog are as of Mar.13,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GJM1555C1H8R5DB01-01
5
5C
(2)T
(3)Temperature
Dimensions
Characteristics
(2) T
e
0.5±0.05
0.15 to 0.35
(4)
Rated
Temp. Range
Voltage
(Ref.Temp.)
25 to 125 °C
DC 50 V
(25 °C)
Packaging Unit
10000 pcs./Reel
20000 pcs./Reel
50000 pcs./Reel
1H
8R5
(4)Rated
(6)Capacitance
(5)Nominal
Voltage
Capacitance
(Unit:mm)
g
0.3 min.
Specifications and Test
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
8.5 pF
±0.5 pF
1
Reference Sheet
D
B01
(7)Murata's Control
(8)Packaging Code
Tolerance
Code
Methods
(Operating
Temp. Range)
-55 to 125 °C
D
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Related Manuals for Murata GJM1555C1H8R5DB01 Series
Summary of Contents for Murata GJM1555C1H8R5DB01 Series
- Page 1 _: packaging code Reference Sheet 1.Scope This product specification is applied to Chip Monolithic Ceramic Capacitor High-Q Type used for General Electronic equipment. This product is applied for Only Reflow Soldering. 2.MURATA Part NO. System (Ex.) (2)T (7)Murata’s Control (1)L/W (4)Rated...
- Page 2 ■ Specifications and Test Methods Test Method Item Specification (Ref. Standard:JIS C 5101, IEC60384） Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. When AC voltage is superimposed on DC voltage, or V , whichever is larger, should be maintained within the rated voltage range.
- Page 3 Test Method Item Specification (Ref. Standard:JIS C 5101, IEC60384） 13 Resistance to Appearance No defects or abnormalities. <GJM02 size only> Soldering Heat Test Method : Reflow soldering (hot plate) Capacitance Within +/-2.5% or +/- 0.25pF Solder : Sn-3.0Ag-0.5Cu Change (Whichever is larger) Solder Temp.
- Page 4 Table A Capacitance Change from Value at Reference temp. (%) Char. -55℃ -25℃ -10℃ Max. Min. Max. Min. Max. Min. Max. Min. 0.54 -0.23 0.33 -0.14 0.22 -0.09 0.82 -0.45 0.49 -0.27 0.33 -0.18 1.37 -0.90 0.82 -0.54 0.55 -0.36 2.56 -1.88 1.54...
- Page 5 Package GJM Type 1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F) 1.1 Minimum Quantity(pcs./reel) φ180mm reel φ330mm reel Type Paper Tape Plastic Tape Paper Tape Code:L Code:D/E Code:W Code:J/F GJM02 40000 (W4P1) GJM03 15000(W8P2) 30000(W8P1) 50000(W8P2) 10000(W8P2) 20000(W8P1) 50000(W8P2) GJM15 1.2 Dimensions of Tape (in mm) (1)GJM02 <Plastic Tape W4P1 CODE:L>...
- Page 6 Package GJM Type (3)GJM03/GJM15 <Paper Tape W8P2 CODE:W> (in mm) 4.0±0.1 1.0±0.05 +0.1 φ1.5 Ａ 1.0±0.05 Dimensions(Chip) Type A *3 B *3 GJM03 0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67 0.5 max. GJM15 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max. *3 Nominal value JEMCGP-01914B...
- Page 7 態 ( 単位： mm) Package GJM Type Fig.1 Package Chips (in mm) Chip Fig.2 Dimensions of Reel 2.0±0.5 φ21±0.8 ｗ Fig.3 Taping Diagram GJM02 8.0 max. 5±1.5 GJM03/GJM15 16.5 max. 10±1.5 Top Tape : Thickness 0.06 Feeding Hole :As specified in 1.2. Hole for Chip : As specified in 1.2.
- Page 8 Package GJM Type ﾌﾟ詰め状態 ( 単位： mm) 1.3 Tapes for capacitors are wound clockwise shown in Fig.3. (The sprocket holes are to the right as the tape is pulled toward the user.) 1.4 Part of the leader and part of the vacant section are attached as follows. (in mm) Tail vacant Section Chip-mounting Unit...
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Page 9: Limitation Of Applications
Caution ■Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. ①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment... - Page 10 Caution 2.Measurement of Capacitance 1. Measure capacitance with the voltage and frequency specified in the product specifications. 1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high. Please confirm whether a prescribed measured voltage is impressed to the capacitor. 1-2.
- Page 11 Caution 5. DC Voltage and AC Voltage Characteristic 1. The capacitance value of a high dielectric constant type [Example of DC Voltage Characteristics] capacitor changes depending on the DC voltage applied. 0.1μF, Rated Voltage 50VDC Sample: X7R(R7) Characteristics Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
- Page 12 Caution ■Soldering and Mounting 1.Mounting Position 1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing or bending the printed circuit board. 1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. ...
- Page 13 Caution 3.Maintenance of the Mounting (pick and place) Machine 1. Make sure that the following excessive forces are not applied to the capacitors. 1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept to a minimum to prevent them from any damage or cracking.
- Page 14 Caution 4-1.Reflow Soldering 1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering] mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. In order to prevent Temperature(℃) mechanical damage to the components, preheating is Soldering Peak Temperature...
- Page 15 Caution 4-2.Flow Soldering 1. This product is not apply flow soldering. 4-3.Correction of Soldered Portion When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally, and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
- Page 16 Caution 5.Washing Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs. 6.Electrical Test on Printed Circuit Board 1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a capacitor after mounting on the printed circuit board.
- Page 17 Caution (1) Example of a suitable jig [In the case of Single-side Mounting] An outline of the board separation jig is shown as follows. Recommended example: Stress on the component mounting position can be minimized by holding the portion close to the jig, and bend in the direction towards the side where the capacitors are mounted. Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress being applied to the component mounting position, if the portion away from the jig is held and bent in the direction opposite the side where the capacitors are mounted.
- Page 18 Caution (3) Example of Router Type Separator [ Outline Drawing ] Router The router type separator performs cutting by a router rotating at a high speed. Since the board does not bend in the cutting process, stress on the board can be suppressed during board separation.
- Page 19 Caution ■ Others 1. Under Operation of Equipment 1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock. 1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
- Page 20 Notice ■ Rating 1.Operating Temperature 1. The operating temperature limit depends on the capacitor. 1-1. Do not apply temperatures exceeding the maximum operating temperature. It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range. It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable factor.
- Page 21 Notice ■Soldering and Mounting 1.PCB Design 1. Notice for Pattern Forms 1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate. They are also more sensitive to mechanical and thermal stresses than leaded components. Excess solder fillet height can multiply these stresses and cause chip cracking.
- Page 22 Notice 2. Land Dimensions Chip Capacitor 2-1. Chip capacitors can be cracked due to the stress Land of PCB bending , etc. if the land area is larger than needed and has an excess amount of solder. Please refer to the land dimensions in table 1 for reflow soldering.
- Page 23 Notice 2.Reflow soldering The halogen system substance and organic acid are included in solder paste, and a chip corrodes by this kind of solder paste. Do not use strong acid flux. Do not use water-soluble flux.* (*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.) 3.Washing 1.
- Page 24 Notice ■ Others 1.Transportation 1. The performance of a capacitor may be affected by the conditions during transportation. 1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation. (1) Climatic condition ･ low air temperature : -40℃ ･...
- Page 25 NOTE 1.Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 2.Your are requested not to use our product deviating from this product specification. 3.We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents.