Min - Murata GRM219R6YA475KA73 Series Reference Sheet

Item
No
10 Vibration Appearance
Capacitance
D.F.
11 Substrate Appearance
Bending test Capacitance
Change
12 Solderability
13 Resistance Appearance
to
Soldering
Heat
Capacitance
Change
D.F.
I.R.
Voltage proof No defects.
14 Temperature Appearance
Sudden Change
Capacitance
Change
D.F.
I.R.
Voltage proof No defects.
15 High Appearance
Temperature
High
Humidity Capacitance
(Steady) Change
D.F.
I.R.
JEMCGS-00047W
Specification
No defects or abnormalities.
Within the specified initial value.
Within the specified initial value.
No defects or abnormalities.
Within +/-10%
95% of the terminations is to be soldered evenly and
continuously.
No defects or abnormalities.
B1,R1,B3,R6,R7,C6,C7,C8,E7,D7,D8 : Within +/-7.5%
GRM188B30J106M
Within the specified initial value.
Within the specified initial value.
No defects or abnormalities.
B1,R1,B3,R6,R7,C6,C7,C8,D7,D8
E7
Within the specified initial value.
Within the specified initial value.
No defects or abnormalities.
Within +/-12.5%
0.2 max.
More than 12.5Ω ∙ F
Solder the capacitor on the test substrate shown in Fig.3.
Kind of Vibration
Total amplitude
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
Solder the capacitor on the test substrate shown in Fig.1.
Pressurization method
Flexure
Holding Time
Soldering Method
Test Method
Flux
Preheat
Solder
Solder Temp.
Immersion time
:
<GRM03 size min.>
Test Method
Solder
Solder Temp.
Immersion time
:
Exposure Time
: Within +/-12.5% Preheat
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
<GRM02 size only>
Test Method
Solder
Solder Temp.
Reflow Time
Test Substrate
Exposure Time
Preheat
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Solder the capacitor on the test substrate shown in Fig.3.
Perform the five cycles according to the four heat treatments
shown in the following table.
: Within +/-7.5%
Step
: Within +/-30%
1
2
3
4
Exposure Time
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· GRM188B30J106M Measurement after test:
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
Test Humidity
Test Time
Applied Voltage
Charge/discharge current : 50mA max.
Exposure Time
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
3
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
: A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
:1.5mm
: Shown in Fig.2
: 1mm
:5+/-1s
: Reflow soldering
: Solder bath method
Solution of rojin ethanol 25(wt)%
: 80℃ to 120℃ for 10s to 30s
: Sn-3.0Ag-0.5Cu
: 245+/-5℃
2+/-0.5s
: Solder bath method
: Sn-3.0Ag-0.5Cu
: 270+/-5℃
10+/-0.5s
: 24+/-2h
: GRM31 size max.: 120℃ to 150℃ for 1 min
GRM32 size : 100℃ to 120℃ for 1 min
and 170℃ to 200℃ for 1 min
: Reflow soldering (hot plate)
: Sn-3.0Ag-0.5Cu
: 270+/-5℃
: 10+/-0.5s
: Glass epoxy PCB
: 24+/-2h
: 120℃ to 150℃ for 1 min
Time
Temp.(C)

(min)

30+/-3
Min.Operating Temp.+0/-3
2 to 3
Room Temp
30+/-3
Max.Operating Temp.+3/-0
2 to 3
Room Temp
: 24+/-2h
: 40+/-2℃
: 90%RH to 95%RH
: 500+/-12h
: DC Rated Voltage
: 24+/-2h