Trusted Platform Module; Thermal Specifications; Thermal And Acoustic Improvements - Dell Latitude 7640 Technical Manualbook

Table 38. Dell ControlVault 3.0 specifications (continued)
Title
ROM
TPM included
Host Interface
Fingerprint procession
on chip
Windows WBF support
FIPS 140-2 level 3
complaint
FIPS 140-2 level 3
certified

Trusted Platform Module

The following table lists the Trusted Platform Module (TPM) of your Latitude 7640.
Table 39. Trusted Platform Module (TPM)
TPM: ST/ST33 HTPH2X32AHD8
Trusted Platform Module (TPM) 2.0 discrete
FIPS 140-2 certification for TPM
Trusted Computing Group (TCG) certification for TPM

Thermal specifications

The following table lists the thermal specifications of your Latitude 7640.
Table 40. Thermal specifications
100% single heat pipe (U15 processors)
Better system tuning/setting
Pro-OS enhanced thermal setting (Dynamic PL1)
Linear fan control
DDT SSD setting
IEC 60529 ingress protection: IP-54

Thermal and acoustic improvements

The following table lists the thermal and acoustic improvements of your Latitude 7640.
Table 41. Thermal and acoustic improvements
100% single heat pipe
Description
N/A
TPM enumeration included within ControlVault
N/A
Fingerprint processing occurs within secure
boundary of ControlVault
Support for Windows biometric framework when
Fingerprint reader is attached
Device complaint with FIPS 140-2 level 3
requirements
Device certified with FIPS 140-2 level 3
requirements
Dell ControlVault 3.0
16 MB
No
USB 3.2
Yes
Yes
Yes
Yes
Increase the heat capacity to improve thermal dissipation
Get higher performance and good user experience
Increases boot-up time
Fan speed ramp more smoothly for better user experience, no
more significant acoustic changing
Protecting the SSD device in high temperature and worse
cases to prevent blue screen of death (BSOD)
● Dust protected
● Protected against dripping water
Increase the heat capacity to improve thermal dissipation
Engineering specifications 33