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Installation
9.2
Cooling
Cabinet cooling must be designed by the customer so that the ambient temperature immediately surrounding the drive will not exceed
temperature conditions specified in
Section 6.6.1, "Temperature."
The rack, cabinet, or drawer environment for the drive must provide heat removal from the electronics and head and disk assembly (HDA). Users
should confirm that adequate heat removal is provided using the temperature measurement guidelines described in
Section
6.6.1.
Forced air flow may be required to keep temperatures at or below the temperatures specified in
Section 6.6.1
in which case the drive should be
oriented, or air flow directed, so that the least amount of air flow resistance is created while providing air flow to the electronics and HDA. Also, the
shortest possible path between the air inlet and exit should be chosen to minimize the travel length of air heated by the drive and other heat
sources within the rack, cabinet, or drawer environment.
If forced air is determined to be necessary, possible air-flow patterns are shown in
Figure
9. The air-flow patterns are created by one or more fans,
either forcing or drawing air as shown in the illustrations. Conduction, convection, or other forced air-flow patterns are acceptable as long as the
temperature measurement guidelines of
Section 6.6.1
are met.
Above unit
Under unit
Note. Air flows in the direction shown (back to front)
or in reverse direction (front to back)
Above unit
Under unit
Note. Air flows in the direction shown or
in reverse direction (side to side)
Figure 9.
Air flow
Note
Image is for reference only, may not represent actual drive.
Seagate Exos X18 SAS Product Manual, Rev. G
46
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