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HP A12500 Product End-Of-Life Disassembly Instructions page 2

Taa main processing unit

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Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
screwdriver
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Unscrew the screws on pcb 1,and then remove pcb 1
2. Unscrew the screws on pcb 2,and then remove pcb 2
3. Unscrew the screws on pcb 3,and then remove pcb 3
4. Remove shielding finger 4 from panel 5
5. Remove film 6 from pane 5l
6.
7.
8.
9.
10.
11.
12.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Tool Size (if
applicable)
2#
Page 2

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