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HP 7506 Product End-Of-Life Disassembly Instructions
HP 7506 Product End-Of-Life Disassembly Instructions

HP 7506 Product End-Of-Life Disassembly Instructions

Switch chassis
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Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP 7506 Switch Chassis (JD239C)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as
defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardants weighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium
coin or button style batteries
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
Includes background illuminated displays with
gas discharge lamps
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Quantity
of items
included
in
product
2
0
0
0
0
0
0
0
0
0
0
Page 1

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Summary of Contents for HP 7506

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 3.1.1 Guidance of treatments to the product: Figure 1 Front of HP 7506 EL-MF877-00 Page 2 Template Revision B...
  • Page 3 Figure 2 Rear of HP 7506 Unscrew the screws on mounting angle 2, and then remove mounting angle 2; Unscrew the screws on cabling rack 3, and then remove cabling rack 3 from mounting; Unscrew the screws on front panel 4, and then remove front panel 4;...
  • Page 4 Unscrew the screws on PCB 4-2, and then remove PCB 4-2; Unscrew the screws on PCB support plate 4-3, and then remove PCB support plate; Unscrew the screws on PCB 4-4, and then remove PCB 4-4; Remove shielding finger 4-5 from front panel 4-1; Remove film 4-6 from front panel 4-1.
  • Page 5 Figure 6 Treatments to fan module 9 Remove the nine fans 9-2 from fan frame 9-1; Unscrew the screws on PCB 9-3, and then remove PCB 9-3; Remove all of the inner cables; Unscrew the screws on handle 9-4, and then remove handle 9-4; Remove film 9-5 from fan frame 9-1;...
  • Page 6 capacitor height is more than 25 1.08% Fe recycling 1112 2.29% Fe recycling 98*9 1.82% Pla recycling Complex PWB 0.22% The surface of PCB is greater than 10 square centimeters 2667 5.50% Fe recycling Complex PWB 2550 5.26% The surface of PCB is greater than 10 square centimeters cables...

This manual is also suitable for:

Jd239c