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Ref. No.
Part No.
Description
R1161
1-216-864-11
SHORT CHIP
R1162
1-216-864-11
SHORT CHIP
R1163
1-216-864-11
SHORT CHIP
R1164
1-216-829-11
METAL CHIP
R1165
1-216-832-11
METAL CHIP
R1166
1-216-827-11
METAL CHIP
R1167
1-216-827-11
METAL CHIP
R1168
1-250-630-11
METAL CHIP
R1169
1-216-827-11
METAL CHIP
R1170
1-216-198-91
METAL CHIP
R1171
1-216-198-91
METAL CHIP
< RELAY >
RY001
1-755-307-21
RELAY
< TERMINAL >
TB001
1-780-932-11
TERMINAL BOARD
*************************************************************
LCD BOARD
*********
< CAPACITOR >
C3000
1-115-416-11
CERAMIC CHIP 0.001uF
C3001
1-116-734-11
CERAMIC CHIP 1uF
C3002
1-118-347-11
CERAMIC CHIP 0.1uF
C3008
1-118-347-11
CERAMIC CHIP 0.1uF
C3009
1-118-347-11
CERAMIC CHIP 0.1uF
C3010
1-162-919-11
CERAMIC CHIP 22PF
C3011
1-162-919-11
CERAMIC CHIP 22PF
C3012
1-162-919-11
CERAMIC CHIP 22PF
< CONNECTOR >
CN3000
1-779-550-21
CONNECTOR, FFC (LIF (NON-ZIF)) 13P
< DIODE >
D3001
6-503-770-11
DI 1L043RW32E0CIE11 (WHITE)
< IC >
IC3000
6-600-768-01
IC PNA4823M03S0 ( )
IC3004
6-720-239-01
IC BU9795AKS2
< JUMPER RESISTOR >
JR3000
1-216-296-11
SHORT CHIP
< LIQUID CRYSTAL DISPLAY >
ND3000
1-812-078-11
LIQUID CRYSTAL DISPLAY
< TRANSISTOR >
Q3000
6-552-936-01
TR
< RESISTOR >
R3000
1-216-809-11
METAL CHIP
R3001
1-216-805-11
METAL CHIP
R3002
1-216-811-11
METAL CHIP
R3003
1-216-815-11
METAL CHIP
R3004
1-216-817-11
METAL CHIP
R3011
1-216-296-11
SHORT CHIP
Note : When the RY001 on the DAMP board is replaced,
spread the bond referring to "BOND FIXATION OF
ELECTRIC PARTS" on servicing notes (page 6).
Remark
0
0
0
4.7K
5%
1/10W
8.2K
5%
1/10W
3.3K
5%
1/10W
3.3K
5%
1/10W
3.9K
1%
1/10W
3.3K
5%
1/10W
1K
5%
1/8W
1K
5%
1/8W
(MID/TWEETERS L/R IMPEDANCE USE 2Ω)
5%
25V
20%
16V
10%
25V
10%
25V
10%
25V
5%
50V
5%
50V
5%
50V
0
LTC014EUBFS8TL
100
5%
1/10W
47
5%
1/10W
150
5%
1/10W
330
5%
1/10W
470
5%
1/10W
0
Ref. No.
Part No.
Description
R3022
1-216-864-11
SHORT CHIP
R3025
1-216-296-11
SHORT CHIP
R3026
1-216-821-11
METAL CHIP
R3028
1-216-821-11
METAL CHIP
R3030
1-216-821-11
METAL CHIP
R3033
1-216-809-11
METAL CHIP
R3034
1-216-864-11
SHORT CHIP
R3035
1-216-295-91
SHORT CHIP
*************************************************************
MIC BOARD
*********
< CAPACITOR >
C3201
1-124-463-00
ELECT
C3202
1-124-261-00
ELECT
C3203
1-100-756-91
CERAMIC CHIP 0.047uF
C3204
1-126-382-11
ELECT
C3206
1-115-872-11
ELECT
* C3207
1-116-720-11
CERAMIC CHIP 10uF
C3208
1-118-345-11
CERAMIC CHIP 0.01uF
C3210
1-124-463-00
ELECT
C3211
1-124-463-00
ELECT
C3215
1-162-925-11
CERAMIC CHIP 68PF
C3216
1-118-290-11
CERAMIC CHIP 0.001uF
C3217
1-162-960-11
CERAMIC CHIP 220PF
C3218
1-162-963-11
CERAMIC CHIP 680PF
C3221
1-118-347-11
CERAMIC CHIP 0.1uF
C3222
1-126-176-11
ELECT
C3223
1-118-347-11
CERAMIC CHIP 0.1uF
C3224
1-118-347-11
CERAMIC CHIP 0.1uF
C3225
1-126-176-11
ELECT
C3226
1-162-960-11
CERAMIC CHIP 220PF
C3227
1-118-290-11
CERAMIC CHIP 0.001uF
C3229
1-118-290-11
CERAMIC CHIP 0.001uF
C3230
1-115-872-11
ELECT
C3231
1-124-257-00
ELECT
C3232
1-115-872-11
ELECT
C3234
1-118-290-11
CERAMIC CHIP 0.001uF
C3235
1-118-290-11
CERAMIC CHIP 0.001uF
C3236
1-118-290-11
CERAMIC CHIP 0.001uF
C3237
1-118-290-11
CERAMIC CHIP 0.001uF
< CONNECTOR >
CN3200
1-564-720-11
PIN, CONNECTOR (SMALL TYPE) 4P
CN3203
1-822-423-11
CONNECTOR, USB (A) (REC/PLAY
< DIODE >
D3200
6-502-970-01
DI DZ2J068M0L
D3201
6-502-961-01
DI DA2J10100L
D3202
6-502-970-01
DI DZ2J068M0L
D3204
6-502-970-01
DI DZ2J068M0L
D3205
6-500-400-01
DIODE BAV99-215
D3206
6-500-400-01
DIODE BAV99-215
D3207
6-500-400-01
DIODE BAV99-215
D3208
6-500-400-01
DIODE BAV99-215
D3209
6-500-400-01
DIODE BAV99-215
< FERRITE BEAD >
FB002
1-469-670-21
FERRITE, EMI (SMD) (2012)
FB003
1-469-670-21
FERRITE, EMI (SMD) (2012)
HCD-GT3D
Ver. 1.1
DAMP
LCD
MIC
Remark
0
0
1K
5%
1/10W
1K
5%
1/10W
1K
5%
1/10W
100
5%
1/10W
0
0
0.1uF
20%
50V
10uF
20%
50V
10%
50V
100uF
20%
16V
2.2uF
20%
50V
20%
6.3V
10%
25V
0.1uF
20%
50V
0.1uF
20%
50V
5%
50V
10%
50V
10%
50V
10%
50V
10%
25V
220uF
20%
10V
10%
25V
10%
25V
220uF
20%
10V
10%
50V
10%
50V
10%
50V
2.2uF
20%
50V
2.2uF
20%
50V
2.2uF
20%
50V
10%
50V
10%
50V
10%
50V
10%
50V
5V
1A)
83
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