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EAX61532102
LP91H
THE
SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE
SYMBOL MARK OF THE SCHEMETIC.
Copyright © 2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
DDR2
DDR2_D[0-15]
+1.8V_DDR
V_REF
C904
C905
C918
0.01uF
1000pF
0.1uF
50V
V_REF
Close to DDR2 IC
DDR2_A[0-12]
DDR2_A[0]
DDR2_A[1]
DDR2_A[2]
DDR2_A[3]
DDR2_A[4]
DDR2_A[5]
DDR2_A[6]
DDR2_A[7]
DDR2_A[8]
DDR2_A[9]
DDR2_A[10]
DDR2_A[11]
DDR2_A[12]
DDR2_BA0
DDR2_BA1
R906
150
DDR2_MCLK
DDR2_MCLKZ
READY
DDR2_CKE
DDR2_ODT
DDR2_RASZ
DDR2_CASZ
DDR2_WEZ
R900
DDR2_DQS0P
56
R901
DDR2_DQS1P
56
R902
DDR2_DQM0
56
R903
DDR2_DQM1
56
R904
DDR2_DQS0M
56
R905
DDR2_DQS1M
56
+1.8V_DDR
C900
C919
0.01uF
10uF
50V
10V
DDR2_D[0-15]
IC900
H5PS5162FFR-S6C
DDR2_D[0]
VREF
DQ0
J2
G8
DDR2_D[1]
DQ1
G2
DDR2_D[2]
DQ2
H7
A0
M8
DDR2_D[3]
DQ3
H3
A1
M3
DDR2_D[4]
DQ4
H1
A2
M7
DDR2_D[5]
DQ5
H9
A3
N2
DDR2_D[6]
DQ6
F1
A4
N8
DDR2_D[7]
DQ7
F9
A5
N3
DDR2_D[8]
DQ8
C8
A6
N7
DDR2_D[9]
DQ9
C2
A7
P2
DDR2_D[10]
DQ10
D7
A8
P8
DDR2_D[11]
DQ11
D3
A9
P3
DDR2_D[12]
DQ12
D1
A10/AP
M2
DDR2_D[13]
DQ13
D9
A11
P7
DDR2_D[14]
DQ14
Close to DDR2 IC
B1
A12
R2
DDR2_D[15]
DQ15
B9
+1.8V_DDR
+1.8V_DDR
BA0
L2
BA1
L3
VDD5
A1
VDD4
E1
C901
CK
VDD3
J8
J9
0.01uF
CK
VDD2
K8
M9
CKE
VDD1
K2
R1
ODT
K9
CS
VDDQ10
L8
A9
RAS
VDDQ9
K7
C1
CAS
VDDQ8
L7
C3
WE
VDDQ7
K3
C7
VDDQ6
C9
VDDQ5
E9
LDQS
F7
VDDQ4
G1
UDQS
B7
VDDQ3
G3
VDDQ2
G7
LDM
VDDQ1
F3
G9
UDM
B3
LDQS
VSS5
E8
A3
UDQS
VSS4
A8
E3
VSS3
J3
VSS2
N1
NC4
L1
VSS1
P9
NC5
R3
NC6
R7
VSSQ10
B2
NC1
A2
VSSQ9
B8
NC2
E2
VSSQ8
A7
NC3
R8
VSSQ7
D2
VSSQ6
D8
VSSQ5
VSSDL
E7
J7
VSSQ4
F2
VSSQ3
F8
VSSQ2
H2
VDDL
VSSQ1
J1
H8
DDR2 MEMORY
C902
C903
C906
C907
C908
C909
C910
C911
C912
C913
C914
0.01uF
0.01uF
0.01uF
0.01uF
0.01uF
0.01uF
0.01uF
0.01uF
0.01uF
0.01uF
0.01uF
LD330/LD420
DDR2
C915
C916
C917
0.01uF
0.01uF
0.01uF
2009/12/23
8
9
LGE Internal Use Only
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