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USER'S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER.
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARES DESCRIBED IN IT MAY BE
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY
ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED FOR THE UTILIZATION OF THESE
MOTHER-BOARDS TO MEET THE USER'S REQUIREMENTS. BUT IT WILL CHANGE, CORRECT
AT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL "AS IS"
WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF
PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND
THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER'S
BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion
Revision History
1.0
First Edition
Item Checklist
Motherboard
User's manual
DVD for motherboard utilities
Cable Package
I/O Back Panel Shield
Intel Core Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance, thermal
management becomes increasingly crucial while building computer systems.
Maintaining the proper thermal environment is the key to reliable, long-term system
operation. The overall goal in providing the proper thermal environment is keeping the
processor below its specified maximum case temperature. Heat sinks induce
improved processor heat dissipation through increased surface area and
concentrated airflow from attached fans. In addition, interface materials allow effective
transfers of heat from the processor to the heat sink. For optimum heat transfer, Intel
recommends the use of thermal grease and mounting clips to attach the heat sink to
the processor.
When selecting a thermal solution for your system, please refer to Intel official website
for collection of heat sinks evaluated and recommended by Intel.
Date
June, 2011
iv
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