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but beginner might damage foil by overheating.)
- Flux / HI115 Specific gravity 0.863 / (Original flux will be replaced
daily.)
21.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two marked 2
pins.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as sliding
the soldering iron.
21.3. Modification Procedure of Bridge
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering iron as
shown in below figure.
*Most important matter is accurate setting of IC to the
corresponding soldering foil.
54
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