Samsung LE32A676A Service Manual page 199

Level Location No.
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001569
....4 T0568 3301-001594
....4 JA3003 3701-001367
....4 JA3004_4HD 3701-001367
....4 JA3005 3701-001367
....4 CN7777_TES 3710-002111
....4 CN330 3711-005925
....4 CN330 3711-006374
....4 IC112 1103-001410
....4 T0087 1203-001815
....4 T0087 1203-001815
....4 T0087 1203-003695
....4 R110 2007-000583
....4 R110 2007-000591
....4 R110 2007-000691
....4 C120 2203-000925
....4 C120 2203-000925
....4 C120 2203-000975
....4 C120 2203-002494
....4 R110 2007-007587
....4 R110 2007-000033
....4 R110 2007-000033
....4 R110 2007-000033
....4 R110 2007-000033
....4 R110 2007-000033
....4 R110 2007-000033
....4 R110 2007-000133
....4 R110 2007-000146
....4 R110 2007-000146
....4 R110 2007-000312
....4 R110 2007-000312
....4 C120 2203-006307
....4 M0018 BN97-02200A
.....5 IC520 0903-001552
....4 M0018 BN97-02200B
.....5 IC115 1107-001415
....4 M0018 BN97-02200C
.....5 IC115 1107-001699
Code No.
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;600ohm,2012,1000mA,TP,520ohm/90
BEAD-SMD;90ohm,2.0*1.2*1.3mm,-,TP,-,-,-
CONNECTOR-HDMI;19P,2R,FEMALE,SMD,AU
CONNECTOR-HDMI;19P,2R,FEMALE,SMD,AU
CONNECTOR-HDMI;19P,2R,FEMALE,SMD,AU
SOCKET-BOARD TO BOARD;60P,2R,0.5MM,SMD-S
HEADER-BOARD TO CABLE;BOX,51P,1R,0.5mm,S
HEADER-BOARD TO CABLE;BOX,41P,2R,1.25mm,
IC-EEPROM;S-24CS08AFJ-TB-1GE,8Kbit,1Kx8,
IC-POSI.FIXED REG.;78M09,TO-252,3P,-,PLA
IC-POSI.FIXED REG.;78M09,TO-252,3P,-,PLA
IC-POSI.FIXED REG.;NCP1117ST33T3G,SOT-22
R-CHIP;22Kohm,1%,1/10W,TP,1608
R-CHIP;22ohm,1%,1/10W,TP,1608
R-CHIP;3.3Mohm,5%,1/10W,TP,1608
C-CER,CHIP;470nF,+80-20%,50V,Y5V,2012
C-CER,CHIP;470nF,+80-20%,50V,Y5V,2012
C-CER,CHIP;47nF,10%,25V,X7R,TP,1608,-
C-CER,CHIP;470nF,10%,16V,X7R,2012
R-CHIP;3.6Kohm,1%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;330Kohm,5%,1/10W,TP,1608
R-CHIP;6.8Kohm,5%,1/16W,TP,1005
R-CHIP;6.8Kohm,5%,1/16W,TP,1005
R-CHIP;10ohm,5%,1/4W,TP,3216
R-CHIP;10ohm,5%,1/4W,TP,3216
C-CER,CHIP;1000nF,10%,25V,X5R,2012
ASSY MICOM;T-AMBDEUS,N59A,2008.01.31,090
IC-MICROCONTROLLER;WT61P8-RG480WT,LQFP,4
ASSY MICOM;T-AMBDEUM,N59A,2008.01.31,110
IC-FLASH MEMORY;29W320D,4Mx8/2Mx16Bit,TS
ASSY MICOM;T-AMBDFRC,N59A,2008.01.31,110
IC-FLASH MEMORY;KFG1216U2B,512Mbit,32Mx1
Description & Specifi cation
5. Exploded View & Part List
Q'ty SA/SNA Remark
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.N.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.N.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.A
1 S.N.A
1 S.A
1 S.N.A
1 S.N.A
1 S.N.A
1 S.A
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