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HP Presario CQ72 Product End-Of-Life Disassembly Instructions

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Product End-of-Life Disassembly Instr uctions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP Presario CQ72 Notebook PC
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
Mother board, Touch pad
All types including standard alkaline and lithium coin
or button style batteries Battery pack, Coin cell
battery
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps (LCD panel)
(EPS)
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
2
2
0
1
0
0
0
0
0
0
Page 1

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Summary of Contents for HP Presario CQ72

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent including liquids, semi-liquids (gel/paste) and toner chambers, and service stations. Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components...
  • Page 3 30. Dis-fasten fan screw*6 31. Remove FAN module 32. Disassemble CPU 33. Remove screw mylar*2 34. Dis-fasten LCD BEZEL screw*2(M2.5*4) 35. Disassemble LCD BEZEL 36. Dis-fasten hinge cover screw*2(M2.5*4) 37. Remove hinge cover*2 38. Dis-fasten hinge screw*8(M2.5*4) 39. Disassemble panel with hinge bracket 40.
  • Page 4 LCD panel disassembly process EL-MF877-00 Page 4 Template Revision B PSG instructions for this template are available at EL-MF877-01...