Package Contents; H170-Plus D3 Specifications Summary - Asus H170-PLUS D3 User Manual

Package contents

Check your motherboard package for the following items.
Motherboard
Cables
Accessories
Application DVD
Documentation
If any of the above items is damaged or missing, contact your retailer.

H170-PLUS D3 specifications summary

CPU
Chipset
Memory
Graphics
Expansion
Slots
vi
ASUS H170-PLUS D3 motherboard
2 x Serial ATA 6.0 Gb/s cables
1 x I/O Shield
1 x M.2 screw package
Support DVD
User Guide
Intel
LGA1151 socket for
Celeron processors
®
Supports Intel 14nm CPU
®
Supports Intel Turbo Boost Technology 2.0*
®
* The Intel Turbo Boost Technology 2.0 support depends on the CPU types.
®
** Refer to www.asus.com for Intel® CPU support list.
Intel H170 Express Chipset
®
4 x DIMM, maximum 64GB, DDR3 1866(O.C.)*/1600/1333 MHz, non-ECC, un-
buffered memory
Dual-channel memory architecture
®
Supports Intel Extreme Memory Profile (XMP)
* Hyper DIMM support is subject to the physical characteristics of individual CPUs.
Please refer to Memory QVL (Qualified Vendors List) for details.
Integrated graphics processor - Intel
Multi-VGA output support: HDMI, DVI, VGA ports
- Supports HDMI with maximum resolution of 4096 x 2160 @ 24Hz / 2560 x
1600@60Hz
- Supports DVI with maximum resolution of 1920 x 1200 @ 60Hz
- Supports VGA with maximum resolution of 1920 x 1200 @ 60Hz
Supports Intel InTru
® TM
and Intel Insider
® TM
Maximum shared memory of 1024 MB
1 x PCI Express 3.0/2.0 x16 slot (at x16 mode)
1 x PCI Express 3.0/2.0 x16 slot (max. at x4 mode, compatible with PCIe x1 and
x4 devices)
2 x PCI Express 3.0/2.0 x1 slots
2 x PCI slots
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6th Generation Core™ i7 / i5 / i3, Pentium
®
HD Graphics support
®
3D, Quick Sync Video, Intel Clear Video HD Technology,
®
, and
®