General Rf Troubleshooting; Introduction To Rf Troubleshooting - Nokia 3555 Service Manual

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RM-257; RM-270; RM-277
RF troubleshooting

General RF troubleshooting

Introduction to RF troubleshooting

Most RF semiconductors are static discharge sensitive
ESD protection must be applied during repair (ground straps and ESD soldering irons).
Pre-baking
These parts are moisture sensitive and must be pre-baked prior to soldering:
• RF IC N7505
• TXFEM N7520
• WCDMA PA N7540
• Tx SAW Z7582
• DC/DC Converter N7451
• Hi Band WCDMA Duplexer Z7541
• Tx Saw GSM 850/900 Z7503
• Rx Saw GSM 1800/1900 Z7501
Note:
Please review the appropriate process for storage and handling of these components prior
to soldering.
Discrete components
In addition to the key-components, there are a number of discrete components (resistors, inductors and
capacitors) for which troubleshooting is done mainly by
Capacitors: check for short circuits.
Resistors: check value with an ohm meter.
Note:
In-circuit measurements should be evaluated carefully
Measuring equipment
All measurements should be done using:
• An oscilloscope for low frequency and DC measurements. Recommended probe: 10:1, 10Mohm//8pF.
• A radio communication tester including RF generator and spectrum analyser, for example Rohde & Schwarz
CMU200. (Alternatively a spectrum analyser and an RF generator can be used. Some tests in this guide are
not possible to perform if this solution is chosen).
Note:
A mobile phone WCDMA transmitter should never be tested with full TX power (only it possible
to perform the measurements in a good RF-shielded room). Even low power WCDMA transmitters
may disturb nearby WCDMA networks and cause problems to 3G cellular phone communication in
a wide area.
Note:
All measurements with an RF coupler should be performed in an RF-shielded environment
because nearby base stations can disturb sensitive receiver measurements. If there is no possibility
to use RF shielded environment, testing at frequencies of nearby base stations should be avoided.
Level of repair
The scope of this guideline is to enable repairs at key-component level. Some key-components are not
accessible, i.e. not replaceable. Please refer to the list of
Issue 1
COMPANY CONFIDENTIAL
Copyright © 2007 Nokia. All rights reserved.
visual inspection .
Non-replaceable RF components (page
4–6).
Page 4 –5

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Rm-257Rm-270Rm-277

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