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Customer Care Europa & Africa
© 2002 SCCE Training Group
General
- How to use this document
Place the schematics behind this manual.
Now you are able to follow these specifictions with graphical layouts and it is easier for you to find the components and
measuring points.
-General handling
There are different screw lengths so pay attention to the right screw position. All screws must be tightened with a torque of
17Ncm. If a higher torque is used, the B_cover and spacer frame might be damaged.
When connecting the phone to the flash box (Fla-7 or FPS-8), generally contact service will be shown on display because the UI
module is hold in reset state to protect it for software corruption.
-µBGA components and broken balls
Special attention to µBGA components:
All µBGA´s with exception of MAD D300 are replaceable and must be renewed after removing. Reflow by hot air fan is not
allowed.
Check soldering points, remove oxidated solderings (broken balls) carefully by enclosing a few new solders before placing new
components. The only allowed way to change µBGA components is the use of µBGA rework maschines, approved from NMP (e.g.
ZEVAC/ OK International). Use recommended Fluxtype and an appropriate amount only
-Component characteristics
Some components contain important data.
Several described steps are only practicable if you are able to reflash/ realign the card phone and/ or rewrite IMEI/
SIMlock in certain cases. Please pay attention to separate notes.
-Realign after repair
Characteristics of replacement parts are different.
To prevent additional faults after repair (RX quality, TX power etc.) it is necessary to retune phone values.
npm_5_repair_v1_0.doc
CONFIDENTIAL
Product NPM-5
Introduction
Date 08.04.2002
Checked by:
SCCE Training Group
2(11)
Repairhints
Version 1.0 Approved
Approved by:
SCCE
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