Texas Instruments TMS320F2837 D Series Errata Sheet

1 Introduction
This document describes the silicon updates to the functional specifications for the TMS320F2837xD
microcontrollers (MCUs).
The updates are applicable to the following:
• 337-ball New Fine Pitch Ball Grid Array, ZWT Suffix
• 176-pin PowerPAD™ Thermally Enhanced Low-Profile Quad Flatpack, PTP Suffix
2 Device and Development Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
[TMS320] DSP devices and support tools. Each TMS320™ DSP commercial family member has one of
three prefixes: TMX, TMP, or TMS (for example, TMS320F28379D). Texas Instruments recommends two
of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent
evolutionary stages of product development from engineering prototypes (with TMX for devices and TMDX
for tools) through fully qualified production devices and tools (with TMS for devices and TMDS for tools).
TMX Experimental device that is not necessarily representative of the final device's electrical
specifications
TMP Final silicon die that conforms to the device's electrical specifications but has not
completed quality and reliability verification
TMS Fully qualified production device
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal
qualification testing
TMDS Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following
disclaimer:
"Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, PTP) and temperature range (for example, T).
SPRZ412K – December 2013 – Revised February 2020
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TMS320F2837xD Dual-Core MCUs
Silicon Revisions C, B, A, 0
TMS320F2837xD Dual-Core MCUs Silicon Revisions C, B, A, 0
Copyright © 2013–2020, Texas Instruments Incorporated
SPRZ412K – December 2013 – Revised February 2020
Silicon Errata
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