JVC GZ-MG21US Schematic Diagrams page 23

CCD, OPE AND MONITOR CIRCUIT BOARDS
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
<02>CCD
FOIL SIDE(B)
LYB10067-001B
C5002
C5006 C5003
C5001
L5003
L5001
R5808
C5810
R5807
3 1
R5818
IC5801
C5813 R5805
4 5
1 8
IC5804
R5819
4 5
C5801
<06>MONITOR
LYB10070-001B
TL7701
S7501
COMPONENT SIDE(A)
C7603 L7601
C7604
R7712
R7711
C7703
1
1 6
Q7702 Q7703
R7703 R7705 CN7701
COMPONENT SIDE(A)
C5853
3 2
R5920
IC5852
R5917
R5912
R5918
C5912 3 1 C5908
4 1
C5913
R5908
IC5902
4 5
FOIL SIDE(B)
TL7601
TL7603
C7620
5 4
R7502
IC7602 TL1
1 3
L7603
R7601 R7611
C7616 C7617
C7606 C7621
40
C7605
R7602
CN7603
(No.YF132)2-43
<04>OPE
LYB10070-001B
S401
D451
COMPONENT SIDE(A)
2-44(No.YF132)
FOIL SIDE(B)
R456 R454
J402
C455
CN402
24 1
R455
D453
L453
C451 C453
R451 L451
S403
S413
J402
L455
D455