Reflow Profiles - Sony Ericsson V800 Working Instruction, Electrical

2.1.1

Reflow Profiles

Sn/Ag/Cu (Lead free)
290
250
200
150
100
50
0
Ramp rate
Ramp rate cooling zone
Time above liquids
Minimum temperature
Maximum temperature
Total time
* The higher temperature in case the board has extremely high ∆T.
3/000 21-2/FEA 209544/88 C

Company Internal Sony Ericsson Mobile Communications AB
Preheat zone
40 80 120
< 4°C/sec
< 6°C/sec
60-150 sec
235°C
245°C or 260°C* for 10 sec
Appr. 4-7 min
Reflow zone
160 200
Time [Seconds]
Working Instruction, Electrical
Cooling zone
260°C
245°C
235°C
240 280
6(13)